| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/08/2001 | EP1145301A3 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 06/07/2001 | WO2001041519A1 Electronic power module and method for making same |
| 06/07/2001 | WO2001041517A1 Improvements in or relating to circuit boards |
| 06/07/2001 | WO2001041288A1 Low cost limited angle torque dc brushless servomotor and method for fabricating thereof |
| 06/07/2001 | WO2001040715A1 Remote controller for air conditioner |
| 06/07/2001 | WO2001040380A1 Resin composition and flexible printed circuit board |
| 06/07/2001 | WO2001040354A1 Poly(phenylene ether) - polyvinyl thermosetting resin |
| 06/07/2001 | WO2001039583A1 A slanted connector |
| 06/07/2001 | WO2000059000A3 Method for making segmented through holes in printed circuit boards |
| 06/07/2001 | US20010003165 Data processing of a bitstream signal |
| 06/07/2001 | US20010003070 Electrical connection box |
| 06/07/2001 | US20010003053 Area of multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented |
| 06/07/2001 | US20010002855 Active matrix type liquid crystal display device |
| 06/07/2001 | US20010002732 Substrate with at least two metal structures disposed thereon, and method for fabricating it |
| 06/07/2001 | US20010002728 Printed-circuit board and method of manufacture thereof |
| 06/07/2001 | US20010002727 Semiconductor device and module of the same |
| 06/07/2001 | US20010002625 Wiring substrate, multi-layered wiring substrate and method of fabricating those |
| 06/07/2001 | US20010002624 Tip structures. |
| 06/07/2001 | US20010002606 Method for producing ceramic slurry, ceramic green sheet, and fabricating monolithic ceramic electronic component |
| 06/07/2001 | DE10041623A1 Multi-layered ceramic substrate manufacture involves preparing raw compound multilayer body with metallic foils, and baking it while restraining contraction of green sheets in direction of main surface |
| 06/07/2001 | DE10024801A1 Verbindererfassungssystem und -verfahren A connector detection system and method |
| 06/07/2001 | DE10022726A1 Thermoelectric conversion module uses insulating layer to cover edge portions of thermoelements in between which electroconductive material is distributed |
| 06/07/2001 | CA2392104A1 A slanted connector |
| 06/06/2001 | EP1104647A1 Method for manufacturing solderless high density electronic modules |
| 06/06/2001 | EP0897653B1 A circuit board |
| 06/06/2001 | CN1298627A Adapted electrically conductive layer |
| 06/06/2001 | CN1298626A Flip chip devices with flexible conductive adhesive |
| 06/06/2001 | CN1298545A Electromechanical switching device package with controlled impedance environment |
| 06/06/2001 | CN1298458A Dispersion-strengthened electrolytic cupper foil and method for producing the same |
| 06/06/2001 | CN1298377A Preparation of polyindanebisphenols and polymers derived therefrom |
| 06/06/2001 | CN1298276A Circuit board |
| 06/06/2001 | CN1298275A Flexible circuit board and its manufacture |
| 06/06/2001 | CN1297963A Polyporous material |
| 06/06/2001 | CN1297960A Epoxy resin composition and semi-solidified sheet and multilayer printed circuit board produced therewith |
| 06/05/2001 | US6243655 Circuit trace probe and method |
| 06/05/2001 | US6243509 Packaging enhanced board level opto-electronic interconnects |
| 06/05/2001 | US6243282 Apparatus for on-board programming of serial EEPROMs |
| 06/05/2001 | US6243274 Shields for electronic components with ready access to shielded components |
| 06/05/2001 | US6243272 Method and apparatus for interconnecting multiple devices on a circuit board |
| 06/05/2001 | US6243269 Centralized cooling interconnect for electronic packages |
| 06/05/2001 | US6243253 Surface mount multilayer capacitor |
| 06/05/2001 | US6242935 Interconnect for testing semiconductor components and method of fabrication |
| 06/05/2001 | US6242932 Interposer for semiconductor components having contact balls |
| 06/05/2001 | US6242815 Flexible substrate based ball grid array (BGA) package |
| 06/05/2001 | US6242803 Semiconductor devices with integral contact structures |
| 06/05/2001 | US6242799 Anisotropic stress buffer and semiconductor device using the same |
| 06/05/2001 | US6242349 Forming a seed layer, annealing to increase grain size and plating copper on seed layer |
| 06/05/2001 | US6242286 Multilayer high density micro circuit module and method of manufacturing same |
| 06/05/2001 | US6242279 High density wire bond BGA |
| 06/05/2001 | US6242079 Printed wiring board and method for manufacturing the same |
| 06/05/2001 | US6242078 High density printed circuit substrate and method of fabrication |
| 06/05/2001 | US6242075 Planar multilayer ceramic structures with near surface channels |
| 06/05/2001 | US6241838 Method of producing a multi-layer ceramic substrate |
| 06/05/2001 | US6241537 ESD protective connector apparatus |
| 06/05/2001 | US6241530 Backplane assembly for printed circuit boards |
| 06/05/2001 | US6241143 Producing method of a film-type transmission line and method of connecting to an existing line |
| 06/05/2001 | US6240621 Method of manufacturing a plurality of electronic components |
| 06/05/2001 | CA2200136C Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure |
| 05/31/2001 | WO2001039563A2 Method of allocating cost savings associated with a manufacturing process |
| 05/31/2001 | WO2001039562A1 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 05/31/2001 | WO2001039561A1 Wiring board and production method thereof |
| 05/31/2001 | WO2001039335A1 Dual function lamp socket |
| 05/31/2001 | WO2001039332A1 Differential signal electrical connectors |
| 05/31/2001 | WO2001039228A1 Electromagnetic switching device |
| 05/31/2001 | WO2001038086A1 Member having metallic layer, its manufacturing method, and its application |
| 05/31/2001 | WO2001016876A3 Chip card and a method for producing a chip card |
| 05/31/2001 | US20010002342 Input / output connector for a mobile electric device |
| 05/31/2001 | US20010002341 Microelectronic contact structure, and method of making same |
| 05/31/2001 | US20010002340 Microelectronic contact structure, and method of making same. |
| 05/31/2001 | US20010002330 Integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls, a pliable material bonds the balls in movable contact with the pads, avoiding thermal stress |
| 05/31/2001 | US20010002294 Printed circuit board and method of manufacturing the same |
| 05/31/2001 | US20010002163 Process for mounting electronic device and semiconductor device |
| 05/31/2001 | US20010002162 Process for mounting electronic device and semiconductor device |
| 05/31/2001 | US20010002106 Method of manufacturing and testing an electronic device, and an electronic device |
| 05/31/2001 | US20010002103 Static event detection/protection device |
| 05/31/2001 | US20010002068 Test interconnect for semiconductor components having bumped and planar contacts |
| 05/31/2001 | US20010001976 Apparatus and method for fabricating buried and flat metal features |
| 05/31/2001 | DE19957554A1 Thermomechanically compensated circuit board has stiff insert at one or more positions whose coefficient of thermal expansion is different from that of circuit board material |
| 05/31/2001 | DE19957302A1 Substrate used in the production of integrated circuits comprises a first insulating layer on the substrate, a second insulating layer on the first insulating layer, hollow chambers |
| 05/31/2001 | DE19956642A1 Circuit board connector has connecting medium in form of one-dimensional conducting synthetic material with positioning aids or guides for other circuit board to be contacted |
| 05/31/2001 | DE19950487A1 Circuit board for electronic system, has edge apertures used to provide interconnection arrangement |
| 05/31/2001 | DE10050629A1 Three=dimensional circuit body for vehicle has insulating layer formed corresponding to surface shape of car-body frame, and circuit patterns formed by applying electric conducting paste to insulating layer |
| 05/31/2001 | CA2391958A1 Method of allocating cost savings associated with a manufacturing process |
| 05/30/2001 | EP1104182A1 Improved image sensor devices for Incorporation into endoscopes |
| 05/30/2001 | EP1104049A1 Flexible connector integrally having transmission line |
| 05/30/2001 | EP1104046A2 Circuit forming method and circuit connection structure in electrical connection box |
| 05/30/2001 | EP1104017A2 Method of flip-chip mounting a semiconductor chip to a circuit board |
| 05/30/2001 | EP1103905A2 Printed circuit board design support system, printed circuit board design method and storage medium storing control program for same |
| 05/30/2001 | EP1103855A1 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board |
| 05/30/2001 | EP1103575A1 Epoxy resin composition, prepreg and multilayer printed-wiring board |
| 05/30/2001 | EP1103170A1 Printed circuit board with a heatsink and method for mounting a heatsink |
| 05/30/2001 | EP1103169A1 Printed circuit card |
| 05/30/2001 | EP1103168A2 High density printed circuit substrate and method of fabrication |
| 05/30/2001 | EP1103163A2 High frequency heating apparatus |
| 05/30/2001 | EP1103021A1 Circuit support with control elements communicating via bus lines |
| 05/30/2001 | EP0925562A4 Electronic article surveillance protection for printed circuit boards |
| 05/30/2001 | EP0888332B1 N-Azacycloalkyl Alkyl Dibenzothiophene Carboxamides: Dopamine Receptor Subtype Specific Ligands |
| 05/30/2001 | CN1297567A Conductive paste, ceramic multilayer substrate, and method for mfg. ceramic multilayer substrate |
| 05/30/2001 | CN1297323A PC board |
| 05/30/2001 | CN1297224A Suspension board with circuit |