| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/26/2001 | WO2001053748A1 A lighting assembly |
| 07/26/2001 | WO2001053375A1 Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same |
| 07/26/2001 | WO2001045477B1 Circuit forming board and method of manufacturing circuit forming board |
| 07/26/2001 | WO2001001453A3 Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards |
| 07/26/2001 | US20010010035 Power decoupling circuit generating system and power decoupling circuit generating method |
| 07/26/2001 | US20010009820 Terminal connection structure of flat circuit belt |
| 07/26/2001 | US20010009819 Branch connection structure for flat cable |
| 07/26/2001 | US20010009816 Filter device for at least one electrical line connectable externally to a housing |
| 07/26/2001 | US20010009782 Multi-layer electronic device package comprising first and second outer layers and a plurality of signal layers disposed between the outer layers, signal layers including signal traces and ground traces interleaved with signal traces |
| 07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
| 07/26/2001 | US20010009505 IC card |
| 07/26/2001 | US20010009504 One system module |
| 07/26/2001 | US20010009299 Flexible wiring board, method of manufacturing flexible wiring board and display device equipped with flexible wiring board |
| 07/26/2001 | US20010009296 Process for forming an integrated circuit |
| 07/26/2001 | US20010009293 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds |
| 07/26/2001 | US20010009273 Electroconductive composition for filling via holes comprising silver, a hardener, a resin, and a titanate coupling compound for reducing metal oxides such as copper oxide |
| 07/26/2001 | US20010009203 Multi-layer circuit board |
| 07/26/2001 | US20010009201 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
| 07/26/2001 | US20010009067 Method for manufacturing wire harness with branch connection terminals |
| 07/26/2001 | US20010009066 Full additive process with filled plated through holes |
| 07/26/2001 | DE19963850A1 Verfahren und Vorrichtung zum Erzeugen einer leitfähigen Struktur auf einem Substrat Method and apparatus for producing a conductive structure on a substrate |
| 07/26/2001 | DE19960961A1 Schlüssel mit integrierter, elektronischer Steuerschaltung für eine Kraftfahrzeug-Sicherheitsanlage Key with integrated electronic control circuit for a motor vehicle security system |
| 07/26/2001 | DE10101050A1 Electric battery pack has flexible printed circuit for contacting battery modules inserted in battery pack housing provided with air flow openings |
| 07/26/2001 | DE10065364A1 Spannungsgesteuerter Oszillator und Kommunikationsvorrichtung unter Verwendung desselben A voltage controlled oscillator and the same communication device using |
| 07/26/2001 | DE10064969A1 Device for filtering one or more electrical wires to be connected to a casing from outside fits in a multilayer printed circuit board with carrier layers and conductor layers with a filter side part of a contact pin fastened on it. |
| 07/26/2001 | DE10027870A1 Laminated decoupling capacitor used in HF circuit, has penetration conductors for external terminal electrodes and internal electrodes connection which are arranged such that magnetic field induced is nullified |
| 07/26/2001 | DE10000972A1 Production of a printed circuit board comprises forming a galvanic junction between a copper layer and an aluminum plate and forming an aluminum zincate layer in the region of the junction |
| 07/25/2001 | EP1119228A2 Electric connection box |
| 07/25/2001 | EP1119225A2 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
| 07/25/2001 | EP1119111A1 Isolator with built-in power amplifier |
| 07/25/2001 | EP1119076A2 Card connector |
| 07/25/2001 | EP1119058A1 Light-emitting diode |
| 07/25/2001 | EP1119049A2 Laminate type semiconductor apparatus |
| 07/25/2001 | EP1119045A2 Diamond interconnection substrate and a manufacturing method therefor |
| 07/25/2001 | EP1118412A1 Method and device for soldering components on delicate support |
| 07/25/2001 | EP1118411A1 Method and device for soldering components |
| 07/25/2001 | EP1118403A2 Tungsten-copper composite powder |
| 07/25/2001 | EP1118120A1 Package for providing improved electrical contact and methods for forming the same |
| 07/25/2001 | EP1118089A1 Method of manufacturing ceramic electronic components |
| 07/25/2001 | EP1118076A2 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 07/25/2001 | EP1117734A1 Flame resistant polyphenylene ether-polyamide resin blends |
| 07/25/2001 | CN2440301Y Connection structure of electronic signal transmission |
| 07/25/2001 | CN1305628A Flex support and seal apparatus for disc drive |
| 07/25/2001 | CN1305339A Composite laminate and its manufacturing method |
| 07/25/2001 | CN1305338A Module substrate and its manufacturing method |
| 07/25/2001 | CN1305119A Liquid crystal display apparatus |
| 07/25/2001 | CN1305100A Photoelectric smoke detector and smoke detector parts |
| 07/25/2001 | CN1068909C Tungsten-copper composite powder |
| 07/24/2001 | US6266730 High-frequency bus system |
| 07/24/2001 | US6266261 DC power adapter system |
| 07/24/2001 | US6266252 Apparatus and method for terminating a computer memory bus |
| 07/24/2001 | US6266236 Apparatus and method for connecting and articulating display in a portable computer having multiple display orientations |
| 07/24/2001 | US6266214 One-piece load beam and gimbal flexure using flexible circuit |
| 07/24/2001 | US6266120 Dummy pad, a printed circuit board including the same, and a liquid crystal display including the same |
| 07/24/2001 | US6266119 Liquid crystal apparatus and production process thereof |
| 07/24/2001 | US6266016 Microstrip arrangement |
| 07/24/2001 | US6265952 Adapter for surface mounted devices |
| 07/24/2001 | US6265842 Cross-connect method and apparatus |
| 07/24/2001 | US6265772 Stacked semiconductor device |
| 07/24/2001 | US6265767 Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package |
| 07/24/2001 | US6265766 Flip chip adaptor package for bare die |
| 07/24/2001 | US6265765 Fan-out semiconductor chip assembly |
| 07/24/2001 | US6265753 Imidizing and curing an oligomeric precursor compound comprising a polybenzoxazole, polybezothiazole polyamic acid ester end-capped with an aryl-substituted acetylene moiety; enhanced isotropic optical and dielectrical properties |
| 07/24/2001 | US6265674 Terminal connecting structure of flexible board and printed circuit board |
| 07/24/2001 | US6265673 Semiconductor element-mounting board and semiconductor device |
| 07/24/2001 | US6265672 Multiple layer module structure for printed circuit board |
| 07/24/2001 | US6265671 Printed-wiring board and a production method thereof |
| 07/24/2001 | US6265498 Curing blend of thermosetting, thermoplastic resins |
| 07/24/2001 | US6265090 Silver coated with metal oxide; high contraction starting temperature |
| 07/24/2001 | US6265051 Edge connectors for printed circuit boards comprising conductive ink |
| 07/24/2001 | US6265050 Organic overcoat for electrode grid |
| 07/24/2001 | US6264785 Mounting structure of electric part and mounting method thereof |
| 07/24/2001 | US6264486 Zero insertion force sockets using negative thermal expansion materials |
| 07/24/2001 | US6263937 Apparatus for making resin-impregnated fiber substrates |
| 07/24/2001 | US6263565 Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same |
| 07/19/2001 | WO2001052325A1 Microwave ic package with dual mode wave guide |
| 07/19/2001 | WO2001051883A1 Low cost hall position sensor and method for fabricating the same |
| 07/19/2001 | WO2001051568A1 Uv curable ferromagnetic compositions |
| 07/19/2001 | US20010009032 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components |
| 07/19/2001 | US20010008864 A low-dielectric-constant glass fiber comprising, by weight, 45-60% silicon dioxide 8-20% alumina, 15-30% of boron oxide, 5-12% calcium oxide, 0.5-5.0% titanium oxide, used for reinforcing a high density printed wiring board |
| 07/19/2001 | US20010008839 Flip-type terminal with slim-style microstrip patch antenna for GPS and method therefor |
| 07/19/2001 | US20010008811 Card connector |
| 07/19/2001 | US20010008778 Temporary attach article and method for temporary attach of devices to a substrate |
| 07/19/2001 | US20010008680 PCB and method for making PCB with thin copper layer |
| 07/19/2001 | US20010008483 Single module system for electric/electronic appliance |
| 07/19/2001 | US20010008479 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 07/19/2001 | US20010008442 Positioning mark and alignment method using the same |
| 07/19/2001 | US20010008313 Chip package with degassing holes |
| 07/19/2001 | US20010008309 Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof |
| 07/19/2001 | US20010008306 Laminate type semiconductor apparatus |
| 07/19/2001 | US20010008302 Semiconductor device |
| 07/19/2001 | US20010008091 Electrodeposited copper foil, method of inspecting physical properties thereof, and copper - clad laminate employing the electrodeposited copper foil |
| 07/19/2001 | US20010008043 Method of making a circuit board not having solder failures |
| 07/19/2001 | CA2396984A1 Uv curable ferromagnetic compositions |
| 07/18/2001 | EP1117282A1 Electronic module with power components and manufacturing method |
| 07/18/2001 | EP1117281A1 Printed wiring board and prepreg for printed wiring board |
| 07/18/2001 | EP1116774A2 Flame-retardant resin composition, and prepregs and laminates using such composition |
| 07/18/2001 | EP1116640A2 Control unit and method of manufacturing the same |
| 07/18/2001 | EP1116424A1 Electronic assembly comprising a sole plate forming a heat sink |
| 07/18/2001 | EP1116420A1 Printed circuit plate used for testing electric components |