Patents for H05K 1 - Printed circuits (98,583) |
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08/07/2001 | US6272021 Circuit device |
08/07/2001 | US6272020 Structure for mounting a semiconductor device and a capacitor device on a substrate |
08/07/2001 | US6272018 Method for the verification of the polarity and presence of components on a printed circuit board |
08/07/2001 | US6271678 Transmission line terminator for signal integrity and EMI control |
08/07/2001 | US6271671 Multi-chip module testability using poled-polymer interlayer dielectrics |
08/07/2001 | US6271585 A composite formed by impregnating melted copper into a molybdenum green compact and rolled into a plate having the differences in thermal expansion coefficients of <8%; uniform distribution; semiconductors for electric cars |
08/07/2001 | US6271583 Semiconductor device having resin encapsulated package structure |
08/07/2001 | US6271483 Wiring board having vias |
08/07/2001 | US6271482 Conductive elastomer interconnect |
08/07/2001 | US6271481 Pad configurations for improved etching of multilayer circuit assemblies |
08/07/2001 | US6271480 Electronic device |
08/07/2001 | US6271479 Method and apparatus for connecting an electric component to a printed circuit board |
08/07/2001 | US6271478 Multi-layer circuit board |
08/07/2001 | US6271477 Long-lasting flexible circuitry |
08/07/2001 | US6271109 Substrate for accommodating warped semiconductor devices |
08/07/2001 | US6270900 For various kinds of wiring boards such as wiring films for semiconductor packages, for flexible printed wiring boards and wiring films for semiconductor mounting |
08/07/2001 | US6270899 As curing agent for epoxy resin |
08/07/2001 | US6270880 For use as an electrical insulator in a circuit board such as a multilayer circuit board |
08/07/2001 | US6270835 Providing three-layer structure comprising dielectric layer and electrically conductive layers; patterning electrically conductive layer to form structure; embedding into second dielectric material; patterning electrically conductive layer |
08/07/2001 | US6270601 Method for producing filled vias in electronic components |
08/07/2001 | US6270375 Low inductance flex-to-PCB spring connector for a disc drive |
08/07/2001 | US6270374 Electrical connector with wafer for video positioning and surface mount holding feature |
08/07/2001 | US6270369 Sub-card board connector, sub-card board, modem sub-card, and a computer having this connector |
08/07/2001 | US6270362 High density surface mount connector |
08/07/2001 | US6270361 Connection structure for bus bars |
08/07/2001 | US6270359 Electric junction box |
08/07/2001 | US6270356 IC socket |
08/07/2001 | US6270354 Multi-connectable printed circuit board |
08/07/2001 | US6270236 L.E.D Lighting unit with transparent carrier panel |
08/02/2001 | WO2001056347A1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard |
08/02/2001 | WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
08/02/2001 | WO2001056340A1 Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board |
08/02/2001 | WO2001056339A1 Flexible printed wiring board and its production method |
08/02/2001 | WO2001056338A1 High speed interconnect |
08/02/2001 | WO2001056047A1 Conductor pattern built in multilayer board, multilayer board having built-in conductor pattern, and method of manufacturing multilayer board |
08/02/2001 | WO2001056043A1 Soft magnetic powder and composite magnetic material using the same |
08/02/2001 | WO2001055823A2 Apparatus for providing regulated power to an integrated circuit |
08/02/2001 | WO2001054854A1 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
08/02/2001 | US20010011111 Acid and alkali resistance containing dielectric |
08/02/2001 | US20010010984 Dual circuit card connector |
08/02/2001 | US20010010860 Combined by an intervening amorphous aromatic polyimide film with a glass transition temperature of 200 to 300 degrees celsius |
08/02/2001 | US20010010850 Printed substrate board |
08/02/2001 | US20010010628 Use of blind vias for soldered interconnections between substrates and printed wiring boards |
08/02/2001 | US20010010627 Semiconductor device and manufacturing method therefor |
08/02/2001 | US20010010625 Method and apparatus for increasing memory capacity |
08/02/2001 | US20010010398 Multi-cavity substrate structure for discrete devices |
08/02/2001 | US20010010395 Interleaved signal trace routing |
08/02/2001 | US20010010367 Thermosetting polyester, suspending filler, phosphorescent pigment, polymerization catalyst, reinforcing material comprising a reinforcing fabric, wherein the reinforcing fabric is a fiberglass fabric |
08/02/2001 | US20010010323 System and method for forming stable solder bonds |
08/02/2001 | US20010010321 Enhanced pad design for substrate |
08/02/2001 | US20010010274 Print board |
08/02/2001 | US20010010273 Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit |
08/02/2001 | US20010010272 Wiring substrate and process for producing the same |
08/02/2001 | US20010010271 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time |
08/02/2001 | US20010010270 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time |
08/02/2001 | US20010010250 Circuit print board manufacturing method, circuit print board, and carbon sheet |
08/02/2001 | US20010010121 Wiring board manufacture method, wiring board, and electrical connection box |
08/02/2001 | DE10101777A1 Einzelmodulsystem für elektrisches/elektronisches Gerät Single module system for electrical / electronic device |
08/02/2001 | DE10055436A1 Wärmestrahlungs-Einbettungsstruktur für ein elektrisches Bauteil und Einbettungsverfahren dafür Heat radiation embedding structure for an electrical part and embedding method therefor |
08/02/2001 | DE10001796A1 Multilayer conductor e.g. for electrical circuits of motor vehicle instrument panel, includes illumination unit in multilayer structure of multilayer conductor |
08/01/2001 | EP1121008A1 Multilayer printed wiring board and method for manufacturing the same |
08/01/2001 | EP1121007A2 Circuit board with a metal substrate |
08/01/2001 | EP1120895A2 Capacitor module for use in invertor, invertor, and capacitor module |
08/01/2001 | EP1120807A1 Thick or thin film circuit with fuse |
08/01/2001 | EP1120796A2 Electronic component and manufacturing method thereof |
08/01/2001 | EP1120658A2 Electricity meter measurement circuitry |
08/01/2001 | EP1120469A2 Method for actively transporting DNA |
08/01/2001 | EP1120437A1 Polyphenylene sulfide film, method for producing the same, and circuit board using the same |
08/01/2001 | EP1120214A1 Sheet retainer for punching ceramic green sheet and punching device |
08/01/2001 | EP1120157A2 Self-addressable electronic device |
08/01/2001 | EP1120156A2 Method of electronically controlled hybridization of DNA |
08/01/2001 | EP1120155A2 Method for combinatorial synthesis of a biopolymer |
08/01/2001 | EP1120026A1 Device for protecting an electric circuit against interface microdischarge phenomena |
08/01/2001 | EP1119287A1 Emg electrode apparatus and positioning system |
08/01/2001 | CN1306735A Appts. and method for improving computer memory speed and capacity |
08/01/2001 | CN1306386A 电路板 Circuit board |
08/01/2001 | CN1306385A Single module system for electrical and electronic device |
08/01/2001 | CN1306373A High frequency unit of magnetic tape recorder |
08/01/2001 | CN1306307A Module with film circuit |
08/01/2001 | CN1306057A Polyamide acid varnish compsns. and flexible printing base plate |
08/01/2001 | CN1306041A Fire resistance resin compsns. and presoaking material and laminated products using same |
08/01/2001 | CN1306025A Polyamide acid and polyamideous resin prepared therefrom and its use in circuit board |
07/31/2001 | US6269004 Electric subassembly |
07/31/2001 | US6268991 Method and arrangement for customizing electronic circuit interrupters |
07/31/2001 | US6268920 Registration of sheet materials using statistical targets and method |
07/31/2001 | US6268783 Printed circuit board including signal transmission line capable of suppressing generation of noise |
07/31/2001 | US6268616 Electrical wiring board and method for identifying same |
07/31/2001 | US6268569 Printed wiring board assembly with a substrate having a glass fabric reinforced, condensation reacted and thermally crosslinked nadic end-capped polyimide resin |
07/31/2001 | US6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages |
07/31/2001 | US6268239 Semiconductor chip cooling structure and manufacturing method thereof |
07/31/2001 | US6268238 Three dimensional package and architecture for high performance computer |
07/31/2001 | US6268231 Low cost CCD packaging |
07/31/2001 | US6268070 Laminate for multi-layer printed circuit |
07/31/2001 | US6268025 Multilayer |
07/31/2001 | US6267618 Terminal fitting for flat conductor |
07/31/2001 | US6266874 Methods of making microelectronic components having electrophoretically deposited layers |
07/27/2001 | CA2299976A1 Chip identification label |
07/26/2001 | WO2001054232A2 Flexible compliant interconnect assembly |
07/26/2001 | WO2001054196A1 Dual-sided, surface mountable integrated circuit package |