Patents for H05K 1 - Printed circuits (98,583)
08/2001
08/07/2001US6272021 Circuit device
08/07/2001US6272020 Structure for mounting a semiconductor device and a capacitor device on a substrate
08/07/2001US6272018 Method for the verification of the polarity and presence of components on a printed circuit board
08/07/2001US6271678 Transmission line terminator for signal integrity and EMI control
08/07/2001US6271671 Multi-chip module testability using poled-polymer interlayer dielectrics
08/07/2001US6271585 A composite formed by impregnating melted copper into a molybdenum green compact and rolled into a plate having the differences in thermal expansion coefficients of <8%; uniform distribution; semiconductors for electric cars
08/07/2001US6271583 Semiconductor device having resin encapsulated package structure
08/07/2001US6271483 Wiring board having vias
08/07/2001US6271482 Conductive elastomer interconnect
08/07/2001US6271481 Pad configurations for improved etching of multilayer circuit assemblies
08/07/2001US6271480 Electronic device
08/07/2001US6271479 Method and apparatus for connecting an electric component to a printed circuit board
08/07/2001US6271478 Multi-layer circuit board
08/07/2001US6271477 Long-lasting flexible circuitry
08/07/2001US6271109 Substrate for accommodating warped semiconductor devices
08/07/2001US6270900 For various kinds of wiring boards such as wiring films for semiconductor packages, for flexible printed wiring boards and wiring films for semiconductor mounting
08/07/2001US6270899 As curing agent for epoxy resin
08/07/2001US6270880 For use as an electrical insulator in a circuit board such as a multilayer circuit board
08/07/2001US6270835 Providing three-layer structure comprising dielectric layer and electrically conductive layers; patterning electrically conductive layer to form structure; embedding into second dielectric material; patterning electrically conductive layer
08/07/2001US6270601 Method for producing filled vias in electronic components
08/07/2001US6270375 Low inductance flex-to-PCB spring connector for a disc drive
08/07/2001US6270374 Electrical connector with wafer for video positioning and surface mount holding feature
08/07/2001US6270369 Sub-card board connector, sub-card board, modem sub-card, and a computer having this connector
08/07/2001US6270362 High density surface mount connector
08/07/2001US6270361 Connection structure for bus bars
08/07/2001US6270359 Electric junction box
08/07/2001US6270356 IC socket
08/07/2001US6270354 Multi-connectable printed circuit board
08/07/2001US6270236 L.E.D Lighting unit with transparent carrier panel
08/02/2001WO2001056347A1 Radiocommunication module in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard
08/02/2001WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056340A1 Substrate material piece, flexible circuit board, and method of manufacturing the flexible circuit board
08/02/2001WO2001056339A1 Flexible printed wiring board and its production method
08/02/2001WO2001056338A1 High speed interconnect
08/02/2001WO2001056047A1 Conductor pattern built in multilayer board, multilayer board having built-in conductor pattern, and method of manufacturing multilayer board
08/02/2001WO2001056043A1 Soft magnetic powder and composite magnetic material using the same
08/02/2001WO2001055823A2 Apparatus for providing regulated power to an integrated circuit
08/02/2001WO2001054854A1 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
08/02/2001US20010011111 Acid and alkali resistance containing dielectric
08/02/2001US20010010984 Dual circuit card connector
08/02/2001US20010010860 Combined by an intervening amorphous aromatic polyimide film with a glass transition temperature of 200 to 300 degrees celsius
08/02/2001US20010010850 Printed substrate board
08/02/2001US20010010628 Use of blind vias for soldered interconnections between substrates and printed wiring boards
08/02/2001US20010010627 Semiconductor device and manufacturing method therefor
08/02/2001US20010010625 Method and apparatus for increasing memory capacity
08/02/2001US20010010398 Multi-cavity substrate structure for discrete devices
08/02/2001US20010010395 Interleaved signal trace routing
08/02/2001US20010010367 Thermosetting polyester, suspending filler, phosphorescent pigment, polymerization catalyst, reinforcing material comprising a reinforcing fabric, wherein the reinforcing fabric is a fiberglass fabric
08/02/2001US20010010323 System and method for forming stable solder bonds
08/02/2001US20010010321 Enhanced pad design for substrate
08/02/2001US20010010274 Print board
08/02/2001US20010010273 Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit
08/02/2001US20010010272 Wiring substrate and process for producing the same
08/02/2001US20010010271 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
08/02/2001US20010010270 Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
08/02/2001US20010010250 Circuit print board manufacturing method, circuit print board, and carbon sheet
08/02/2001US20010010121 Wiring board manufacture method, wiring board, and electrical connection box
08/02/2001DE10101777A1 Einzelmodulsystem für elektrisches/elektronisches Gerät Single module system for electrical / electronic device
08/02/2001DE10055436A1 Wärmestrahlungs-Einbettungsstruktur für ein elektrisches Bauteil und Einbettungsverfahren dafür Heat radiation embedding structure for an electrical part and embedding method therefor
08/02/2001DE10001796A1 Multilayer conductor e.g. for electrical circuits of motor vehicle instrument panel, includes illumination unit in multilayer structure of multilayer conductor
08/01/2001EP1121008A1 Multilayer printed wiring board and method for manufacturing the same
08/01/2001EP1121007A2 Circuit board with a metal substrate
08/01/2001EP1120895A2 Capacitor module for use in invertor, invertor, and capacitor module
08/01/2001EP1120807A1 Thick or thin film circuit with fuse
08/01/2001EP1120796A2 Electronic component and manufacturing method thereof
08/01/2001EP1120658A2 Electricity meter measurement circuitry
08/01/2001EP1120469A2 Method for actively transporting DNA
08/01/2001EP1120437A1 Polyphenylene sulfide film, method for producing the same, and circuit board using the same
08/01/2001EP1120214A1 Sheet retainer for punching ceramic green sheet and punching device
08/01/2001EP1120157A2 Self-addressable electronic device
08/01/2001EP1120156A2 Method of electronically controlled hybridization of DNA
08/01/2001EP1120155A2 Method for combinatorial synthesis of a biopolymer
08/01/2001EP1120026A1 Device for protecting an electric circuit against interface microdischarge phenomena
08/01/2001EP1119287A1 Emg electrode apparatus and positioning system
08/01/2001CN1306735A Appts. and method for improving computer memory speed and capacity
08/01/2001CN1306386A 电路板 Circuit board
08/01/2001CN1306385A Single module system for electrical and electronic device
08/01/2001CN1306373A High frequency unit of magnetic tape recorder
08/01/2001CN1306307A Module with film circuit
08/01/2001CN1306057A Polyamide acid varnish compsns. and flexible printing base plate
08/01/2001CN1306041A Fire resistance resin compsns. and presoaking material and laminated products using same
08/01/2001CN1306025A Polyamide acid and polyamideous resin prepared therefrom and its use in circuit board
07/2001
07/31/2001US6269004 Electric subassembly
07/31/2001US6268991 Method and arrangement for customizing electronic circuit interrupters
07/31/2001US6268920 Registration of sheet materials using statistical targets and method
07/31/2001US6268783 Printed circuit board including signal transmission line capable of suppressing generation of noise
07/31/2001US6268616 Electrical wiring board and method for identifying same
07/31/2001US6268569 Printed wiring board assembly with a substrate having a glass fabric reinforced, condensation reacted and thermally crosslinked nadic end-capped polyimide resin
07/31/2001US6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages
07/31/2001US6268239 Semiconductor chip cooling structure and manufacturing method thereof
07/31/2001US6268238 Three dimensional package and architecture for high performance computer
07/31/2001US6268231 Low cost CCD packaging
07/31/2001US6268070 Laminate for multi-layer printed circuit
07/31/2001US6268025 Multilayer
07/31/2001US6267618 Terminal fitting for flat conductor
07/31/2001US6266874 Methods of making microelectronic components having electrophoretically deposited layers
07/27/2001CA2299976A1 Chip identification label
07/26/2001WO2001054232A2 Flexible compliant interconnect assembly
07/26/2001WO2001054196A1 Dual-sided, surface mountable integrated circuit package