| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/20/2001 | US20010023055 Process and apparatus for heat-treating substrate having film-forming composition thereon |
| 09/20/2001 | US20010023028 Connecting material; preremoval of surface oxide |
| 09/20/2001 | US20010022739 Memory system |
| 09/20/2001 | US20010022718 Printed circuit board capacitor structure and method |
| 09/20/2001 | US20010022716 Environmentally insensitive surge suppressor apparatus and method |
| 09/20/2001 | US20010022564 Led display assembly |
| 09/20/2001 | US20010022396 Fan-out semiconductor chip assembly |
| 09/20/2001 | US20010022392 Tented plated through-holes and method for fabrication thereof |
| 09/20/2001 | US20010022237 Ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries; high coefficient of thermal expansion and a high dielectric constant |
| 09/20/2001 | US20010022236 Substrate for power semiconductor modules with through-plating of solder and method for its production |
| 09/20/2001 | DE10112328A1 Electroluminescent device with contoured light-emitting surfaces has conductive films of flexible printed circuit connected by grid-like arrangement of contacts |
| 09/20/2001 | DE10111718A1 Electronic circuit device has one board connected by solder to metal spacers, which are connected to other board by conductive adhesive |
| 09/20/2001 | DE10110151A1 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode |
| 09/20/2001 | CA2403135A1 Impregnated glass fiber strands and products including the same |
| 09/19/2001 | EP1134730A2 Copper-Alloy foil to be used for suspension member of hard-disc drive |
| 09/19/2001 | EP1133904A1 Deposited thin build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 09/19/2001 | EP1133902A2 Electromechanical component |
| 09/19/2001 | EP1133812A1 High density electrical connector |
| 09/19/2001 | EP1133796A1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support |
| 09/19/2001 | EP0960038B1 Manufacture of a wiring loom |
| 09/19/2001 | EP0917501B1 Method for isolating ultrafine and fine particles and resulting particles |
| 09/19/2001 | EP0898802B1 Protective device for an electronic circuit |
| 09/19/2001 | CN2449446Y Six-layer circuit board |
| 09/19/2001 | CN1314072A High density printed circuit substrate and method of fabrication |
| 09/19/2001 | CN1314071A Method for producing circuit-forming board, circuit-forming board, and carbon sheet |
| 09/19/2001 | CN1313722A Multi-layer printed circuit board and method for measuring impendance thereof |
| 09/19/2001 | CN1313672A Frequency conversion module with thyristor |
| 09/19/2001 | CN1313165A Laser cutting laminated core carrier |
| 09/19/2001 | CN1071535C Assembly for mounting components to flexible cables |
| 09/18/2001 | US6292923 Configurable interface module |
| 09/18/2001 | US6292374 Assembly having a back plate with inserts |
| 09/18/2001 | US6292372 Solder thieving pad for wave soldered through-hole components |
| 09/18/2001 | US6292370 Flexible circuit board and method for making a flexible circuit board |
| 09/18/2001 | US6292368 Electrical power component mounted by brazing on a support and corresponding mounting process |
| 09/18/2001 | US6292366 Printed circuit board with embedded integrated circuit |
| 09/18/2001 | US6292351 Multilayer ceramic capacitor for three-dimensional mounting |
| 09/18/2001 | US6292139 Electronic part and a method of manufacturing the same |
| 09/18/2001 | US6292073 Solderless circuit interconnect having a spring contact passing through an aperture |
| 09/18/2001 | US6292006 Method for preventing condensation on handler board during semiconductor device testing |
| 09/18/2001 | US6291899 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 09/18/2001 | US6291889 High temperature resistant thin-film system |
| 09/18/2001 | US6291780 Method and device for connecting FPCs |
| 09/18/2001 | US6291778 Printed circuit boards |
| 09/18/2001 | US6291776 Thermal deformation management for chip carriers |
| 09/18/2001 | US6291775 Flip chip bonding land waving prevention pattern |
| 09/18/2001 | US6291627 Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide |
| 09/18/2001 | US6291626 Phosphorus-containing dihydric phenol or naphthol-advanced epoxy resin or cured |
| 09/18/2001 | US6291374 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
| 09/18/2001 | US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 09/18/2001 | US6290881 Ultraviolet curable silver composition and related method |
| 09/18/2001 | US6290509 Electrical connector housing |
| 09/18/2001 | US6290333 Multiple power interconnect arrangement for inkjet printhead |
| 09/18/2001 | US6290118 Method and apparatus for soldering and soldering land of a printed circuit board |
| 09/18/2001 | US6289580 Surface mount power supply device |
| 09/18/2001 | CA2245413C Conductive elastomer for grafting to an elastic substrate |
| 09/18/2001 | CA2202426C Mounting structure for a semiconductor circuit |
| 09/17/2001 | CA2333812A1 Power heatsink for a circuit board |
| 09/13/2001 | WO2001067836A1 Electric power module and methods for making same |
| 09/13/2001 | WO2001067835A1 Apparatus for inspecting solder paste printed on a pcb and supplementary dispensing solder paste |
| 09/13/2001 | WO2001067834A1 Flexible circuits with static discharge protection and process for manufacture |
| 09/13/2001 | WO2001067833A1 A printed circuit board assembly with improved bypass decoupling for bga packages |
| 09/13/2001 | WO2001067832A1 Electrical circuit and substrate therefor |
| 09/13/2001 | WO2001067512A2 Method and apparatus for delivering power to high performance electronic assemblies |
| 09/13/2001 | WO2001067178A1 Solder resist ink |
| 09/13/2001 | WO2000007197A3 Composition and method for manufacturing integral resistors in printed circuit boards |
| 09/13/2001 | US20010021744 Resin composition |
| 09/13/2001 | US20010021610 C-shaped compliant contact |
| 09/13/2001 | US20010021106 Stacked printed circuit board memory module |
| 09/13/2001 | US20010021105 Circuit module |
| 09/13/2001 | US20010021103 Control unit and method of manufacturing the same |
| 09/13/2001 | US20010020997 Signal processing circuit substrate used for lquid crystal display unit and method of assembling the same |
| 09/13/2001 | US20010020996 Liquid crystal display |
| 09/13/2001 | US20010020886 Coil device and switching power supply apparatus using the same |
| 09/13/2001 | US20010020749 Bond-pad with pad edge strengthening structure |
| 09/13/2001 | US20010020742 Stacked semiconductor device and method for manufacturing the same |
| 09/13/2001 | US20010020741 Semiconductor memory module having double-sided stacked memory chip layout |
| 09/13/2001 | US20010020549 Wiring board, semiconductor device and production methods thereof |
| 09/13/2001 | US20010020548 Blind via laser drilling system |
| 09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 09/13/2001 | US20010020535 Circuit pack, multilayer printed wiring board, and device |
| 09/13/2001 | EP1145256A3 Composition and method for manufacturing integral resistors in printed circuit boards |
| 09/13/2001 | DE10108785A1 Steckverbindung für Chipkarten Connector for smart cards |
| 09/13/2001 | DE10108762A1 Electronic component mounting method for fixing component on substrate, involves detecting dislocation of divided block of substrate based on detected relative position data and substrate entire position |
| 09/13/2001 | DE10108666A1 Insulating thick film composition calcined with a ceramic blank used in mobile communication devices consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank |
| 09/13/2001 | DE10054962A1 Power module has insulating substrate with semiconducting power component, control substrate with control IC for controlling power component, conducting bearer plate and housing |
| 09/13/2001 | DE10023354A1 Circuit board has electrically conducting structure in at least one defined area forming planar antenna terminated by at least one resistance in an at least approximately reflection-free manner |
| 09/13/2001 | DE10011373A1 Flexible printed circuit used in the production of an instrument panel for vehicles consists of a base material, a conductor pattern applied on one side, and a flexible or semi-flexible reinforcing material applied on the other side |
| 09/13/2001 | DE10010979A1 Electrical circuit on substrate e.g. PCB, has component(s) mounted on conducting track layer on substrate and enclosed by recesses in conducting track layer in form of round holes or trenches |
| 09/13/2001 | CA2402229A1 Method and apparatus for delivering power to high performance electronic assemblies |
| 09/12/2001 | EP1133220A2 Copper foil with low profile bond enhancement |
| 09/12/2001 | EP1133218A2 Multilayered circuit board and method for producing the same |
| 09/12/2001 | EP1133217A2 High frequency circuit board and method of producing the same |
| 09/12/2001 | EP1132962A2 Wiring board, semiconductor device and production methods thereof |
| 09/12/2001 | EP1132961A1 Circuit substrate for mounting a semiconductor element |
| 09/12/2001 | EP1132127A2 Method for isolating ultrafine and fine particles and resulting particles |
| 09/12/2001 | EP1131378A1 Flame retardant resin compositions containing phosphoramides, and method for making |
| 09/12/2001 | EP1131168A1 Methods of forming metal contact pads on a metal support substrate |
| 09/12/2001 | CN2448047Y Six-layer circuit board |
| 09/12/2001 | CN2448046Y Six-layer circuit board adapted for high-speed signals |