| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/12/2001 | CN1313023A Thermal management device and method of making such device |
| 09/12/2001 | CN1312962A Microwave dielectric material |
| 09/12/2001 | CN1312674A Element and device mounting method |
| 09/12/2001 | CN1312671A Multi-layer flexible wiring board and its production method |
| 09/12/2001 | CN1312670A Formation of metal interconnection structure |
| 09/12/2001 | CN1312565A Insulator ceramic composition |
| 09/12/2001 | CN1312309A Laminated material, resin paint and resin composition for printed circuit board and laminated board for pinted circuit board made thereby |
| 09/11/2001 | US6289306 Data processing of a bitstream signal |
| 09/11/2001 | US6288924 Semiconductor device and process for manufacturing the same |
| 09/11/2001 | US6288909 Conductive via feed through for double-sided modules |
| 09/11/2001 | US6288908 Peripheral apparatus for PC cards |
| 09/11/2001 | US6288906 Multiple layer printed circuit board having power planes on outer layers |
| 09/11/2001 | US6288905 Contact module, as for a smart card, and method for making same |
| 09/11/2001 | US6288885 Method and apparatus for electrostatic discharge protection for printed circuit boards |
| 09/11/2001 | US6288647 Photoelectric smoke detector, and smoke detection section assembly |
| 09/11/2001 | US6288627 Embedded trimmable resistors |
| 09/11/2001 | US6288414 Liquid crystal display and a double layered metal contact |
| 09/11/2001 | US6288386 Circuit having a flexible printed circuit board for electronically controlling a night vision device and night vision device including the same |
| 09/11/2001 | US6288347 Wiring board for flip-chip-mounting |
| 09/11/2001 | US6288346 System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
| 09/11/2001 | US6288345 Compact z-axis DC and control signals routing substrate |
| 09/11/2001 | US6287132 Connector with staggered contact design |
| 09/11/2001 | US6287130 Construction and method of connecting connector to base board |
| 09/11/2001 | US6287021 Apparatus for coupling electronic components within electronic devices such as cameras |
| 09/11/2001 | US6286204 Method for fabricating double sided ceramic circuit boards using a titanium support substrate |
| 09/09/2001 | CA2332720A1 Resonant capacitive coupler |
| 09/07/2001 | WO2001065838A1 Small-sized image pickup module |
| 09/07/2001 | WO2001065602A1 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 09/07/2001 | WO2001065344A2 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
| 09/07/2001 | WO2001064433A1 Carrier foil-pasted metal foil and production method thereof |
| 09/07/2001 | WO2001003108A3 Ultrasonic linear or curvilinear transducer and connection technique therefore |
| 09/07/2001 | CA2400568A1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
| 09/06/2001 | US20010019919 Structure and method of mounting branch connector to flat circuit |
| 09/06/2001 | US20010019780 Preventing wrinkling |
| 09/06/2001 | US20010019739 On synthetic resin substrates |
| 09/06/2001 | US20010019476 Construction of fixing flexible sheet on electronic device |
| 09/06/2001 | US20010019462 Disk drive apparatus and method of mounting same |
| 09/06/2001 | US20010019301 Thin-film resistor, wiring substrate, and method for manufacturing the same |
| 09/06/2001 | US20010019298 Structure of making a thick film low value high frequency inductor |
| 09/06/2001 | US20010019292 Piezoelectric oscillator unit |
| 09/06/2001 | US20010019171 Package for semiconductor chip |
| 09/06/2001 | US20010018986 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound |
| 09/06/2001 | US20010018985 High-frequency circuit board and method of producing the same |
| 09/06/2001 | US20010018983 Multilayer integrated substrate and manufacturing method for multilayer ceramic element |
| 09/06/2001 | US20010018982 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
| 09/06/2001 | US20010018799 Method of forming a chip carrier by joining a laminate layer and stiffener |
| 09/06/2001 | US20010018797 Low temperature co-fired ceramic with improved registration |
| 09/06/2001 | DE10062109A1 Electric system module for electronic products, has power pins and signal pins arranged on three edges of case |
| 09/06/2001 | DE10008569A1 Substrate for power semiconductor device |
| 09/06/2001 | DE10007414A1 Process for through-plating a substrate comprises forming a through-hole in a metal plate in orientation with the through-hole of a ceramic plate, applying a solder paste to one side of the substrate, and passing through an oven |
| 09/05/2001 | EP1130950A2 Wiring board |
| 09/05/2001 | EP1130530A2 Part marking method applicable to industrial parts |
| 09/05/2001 | EP1130473A2 A system, method and article of manufacture for direct image processing of printed circuit boards |
| 09/05/2001 | EP1130408A2 Method and apparatus for adaptation/adjustment of the delay time of signal between integrated circuits in networks or line systems |
| 09/05/2001 | EP1130003A1 Glass ceramics composition and electronic parts and multilayered lc multiple component using the same |
| 09/05/2001 | EP1129605A1 Edge connectors for printed circuit boards comprising conductive ink |
| 09/05/2001 | EP1129520A1 Bus through termination circuit |
| 09/05/2001 | EP1129050A1 Paste for screenprinting electric structures onto carrier substrates |
| 09/05/2001 | EP1129048A1 Composite plate and method for producing and using such a composite plate |
| 09/05/2001 | EP1129003A1 Improvements relating to power steering |
| 09/05/2001 | EP0983712B1 Electronic plate folded at 45 degrees |
| 09/05/2001 | EP0852897B1 Method for surface mounting a heatsink to a printed circuit board |
| 09/05/2001 | CN1311975A High frequency heating apparatus |
| 09/05/2001 | CN1311909A Connector with two rows of terminals having tail portions with smilar impadance |
| 09/05/2001 | CN1311899A Catacitive mounting arrangement for securing an integrated circuit package to a heat sink |
| 09/05/2001 | CN1311625A Nano stack film circuit material |
| 09/04/2001 | USH1991 Clockspring using flexible printed wiring |
| 09/04/2001 | US6285912 System for physically mounting a multifunction user interface to a basic multifunction sensor to access and control various parameters of a control network environment |
| 09/04/2001 | US6285808 Circuit carrier with an optical layer and optoelectronic component |
| 09/04/2001 | US6285560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified |
| 09/04/2001 | US6285559 Multichip module |
| 09/04/2001 | US6285558 Microprocessor subsystem module for PCB bottom-side BGA installation |
| 09/04/2001 | US6285554 Method and an arrangement for the electrical contact of components |
| 09/04/2001 | US6285553 Mounting structure for an LSI |
| 09/04/2001 | US6285542 Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
| 09/04/2001 | US6285432 Method and apparatus for locating LCD connectors |
| 09/04/2001 | US6285272 Low profile inductive component |
| 09/04/2001 | US6285196 Process for the electrical testing of the base material for the manufacture of printed circuit boards |
| 09/04/2001 | US6285107 Stator structure of motor |
| 09/04/2001 | US6285086 Semiconductor device and substrate for semiconductor device |
| 09/04/2001 | US6285080 Planar metallized substrate with embedded camber control material and method thereof |
| 09/04/2001 | US6285079 Semiconductor device employing grid array electrodes and compact chip-size package |
| 09/04/2001 | US6285047 Linear image sensor device, IC assembling substrate and method for assembling the same |
| 09/04/2001 | US6284985 Ceramic circuit board with a metal plate projected to prevent solder-flow |
| 09/04/2001 | US6284984 Printed circuit board, for mounting BGA elements and a manufacturing method of a printed circuit board for mounting BGA elements |
| 09/04/2001 | US6284983 Multifunctional printed circuit board with an opto-electronically active component |
| 09/04/2001 | US6284982 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 09/04/2001 | US6284353 Printed wiring board and method of manufacturing the same |
| 09/04/2001 | US6284329 Method of forming adherent metal components on a polyimide substrate |
| 09/04/2001 | US6284086 Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive |
| 09/04/2001 | US6284080 Barrier metallization in ceramic substrate for implantable medical devices |
| 09/04/2001 | US6284079 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 09/04/2001 | US6283778 Circuit board mounting system and releasable connector therefor |
| 09/04/2001 | US6283681 Method and device for aligning a workpiece on a machine tool table |
| 09/04/2001 | US6283612 Light emitting diode light strip |
| 09/04/2001 | US6283166 Woven glass fabrics and laminate for printed wiring boards |
| 09/04/2001 | US6282782 Forming plugs in vias of circuit board layers and subassemblies |
| 09/04/2001 | CA2232647C Method for joining members at ordinary temperature |
| 08/30/2001 | WO2001063996A2 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 08/30/2001 | WO2001063994A2 Tamper proof case for electronic devices having memories with sensitive information |