| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/23/2001 | US20010016436 Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production |
| 08/23/2001 | US20010016251 Containing silica and boron oxide |
| 08/23/2001 | US20010015891 FPC for mounting components and spread illuminating apparatus using the same |
| 08/23/2001 | US20010015890 Electronic component module and piezoelectric oscillator device |
| 08/23/2001 | US20010015888 Sub-modular configurable avionics |
| 08/23/2001 | US20010015887 Electronic control unit having connector positioned between two circuit substrates |
| 08/23/2001 | US20010015684 Circuit board and method of manufacturing therefor |
| 08/23/2001 | US20010015655 Removable electrical interconnect apparatuses and removable engagement probes |
| 08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
| 08/23/2001 | US20010015595 Piezoelectric oscillator |
| 08/23/2001 | US20010015497 Integrated circuit package, ball-grid array integrated circuit package and methods of packaging an integrated circuit |
| 08/23/2001 | US20010015488 Method of constructing stacked packages |
| 08/23/2001 | US20010015483 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
| 08/23/2001 | US20010015444 Opto-electric mounting apparatus |
| 08/23/2001 | US20010015288 Microcircuit shielded, controlled impedance "gatling gun" via |
| 08/23/2001 | US20010015287 Printed circuit boards having at least one metal layer |
| 08/23/2001 | US20010015286 Method of surface- mounting electronic components |
| 08/23/2001 | US20010015285 Semiconductor device |
| 08/23/2001 | US20010015250 Laminated ceramic electronic components and manufacturing method therefor |
| 08/23/2001 | US20010015012 Structure of conductive bump in wiring board |
| 08/23/2001 | US20010015008 Process for fabricating a thin multi-layer circuit board |
| 08/23/2001 | DE10065019A1 Einrichtung zum Schutz eines auf einem Trägersubstrat angeordneten elektrischen und/oder elektronischen Bauteils vor elektrostatischen Entladungen Device for protecting an object arranged on a supporting substrate electric and / or electronic component against electrostatic discharges |
| 08/23/2001 | DE10063944A1 Steuergerät für ein Schließsystem in einem Kraftfahrzeug Control unit for a locking system in a motor vehicle |
| 08/23/2001 | DE10006592A1 Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte Deferred combination compounds and latent ammonium salts of epoxy resin curing and flame retardants, and from epoxy resin systems and products produced |
| 08/23/2001 | DE10005836A1 Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region |
| 08/23/2001 | CA2399829A1 Luminescent gel coats and moldable resins |
| 08/22/2001 | EP1126752A2 Chip scale packaging on CTE matched printed wiring boards |
| 08/22/2001 | EP1126565A1 Casing for an electronic unit |
| 08/22/2001 | EP1126562A1 Conducting guide plate |
| 08/22/2001 | EP1126552A2 Circuit board straddle mounted connector |
| 08/22/2001 | EP1126551A2 Connector for module |
| 08/22/2001 | EP1126542A1 Microstrip line and microwave device using the same |
| 08/22/2001 | EP1126358A1 Anti-intrusion device |
| 08/22/2001 | EP1125960A2 A latent combination compound and a latent ammonium salt from an epoxy resin curing agent and a flame retardant, epoxy resin systems or -products made therefrom |
| 08/22/2001 | EP1125483A1 Case for circuit board for horizontal or vertical mounting |
| 08/22/2001 | EP1125482A1 Stacked circuit board assembly adapted for heat dissipation |
| 08/22/2001 | EP1125479A1 Fabrication process for flex circuit applications |
| 08/22/2001 | EP1125330A1 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 08/22/2001 | EP1125329A1 Tape ball grid array with interconnected ground plane |
| 08/22/2001 | EP1124770A1 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
| 08/22/2001 | EP1124769A1 Impregnated glass fiber strands and products including the same |
| 08/22/2001 | EP1124710A1 Ribbed trim panel for thermal spraying of electrical circuit |
| 08/22/2001 | EP1092248A4 Pcb to metallic ground connection method |
| 08/22/2001 | CN1309625A Glass ceramics composition and electronic parts and multilayered LC multiple component using same |
| 08/22/2001 | CN1309526A Technology for making underboarding used on perforating on PCB or insulating board for electric appliances |
| 08/22/2001 | CN1309525A 印刷电路板 A printed circuit board |
| 08/22/2001 | CN1309440A Circuit board across installation connector |
| 08/22/2001 | CN1309439A Microwave band line and wicrowave device using said microwave band line |
| 08/21/2001 | US6279141 Preburn-in dynamic random access memory module and preburn-in circuit board thereof |
| 08/21/2001 | US6278951 Crosstalk noise calculation method and storage medium |
| 08/21/2001 | US6278618 Substrate strips for use in integrated circuit packaging |
| 08/21/2001 | US6278509 Display device having particular ribs between TCPs |
| 08/21/2001 | US6278356 Flat, built-in resistors and capacitors for a printed circuit board |
| 08/21/2001 | US6278345 Flexible printed circuit and the method for making the same |
| 08/21/2001 | US6278153 Thin film capacitor formed in via |
| 08/21/2001 | US6277495 Reducing birefringence |
| 08/21/2001 | US6277169 Method for making silver-containing particles |
| 08/21/2001 | US6276995 Electronic component and method of manufacturing same |
| 08/21/2001 | US6276992 Method of forming a groove in a surface of a mother substrate |
| 08/21/2001 | US6276593 Apparatus and method for solder attachment of high powered transistors to base heatsink |
| 08/21/2001 | US6276246 Method for punching slug from workpiece |
| 08/21/2001 | US6276055 Method and apparatus for forming plugs in vias of a circuit board layer |
| 08/21/2001 | CA2219761C Printed circuit board with selectable routing configuration |
| 08/16/2001 | WO2001060136A1 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof |
| 08/16/2001 | WO2001060135A1 Printed circuit board |
| 08/16/2001 | WO2001060119A2 Lighting body |
| 08/16/2001 | WO2001059887A1 Printed circuit board and connector assembly |
| 08/16/2001 | WO2001059886A1 Printed circuit board and connector assembly |
| 08/16/2001 | WO2001059885A2 Compliant pin and its method of manufacture |
| 08/16/2001 | WO2001059799A1 Security device for a printed circuit board, said device providing better security |
| 08/16/2001 | WO2001059002A1 Halogen-free phosphorous-containing flame-resistant epoxy resin compositions |
| 08/16/2001 | WO2001016402A8 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 08/16/2001 | WO2001009054A9 Impregnated glass fiber strands and products including the same |
| 08/16/2001 | WO2000046837A3 Improved circuit board manufacturing process |
| 08/16/2001 | WO2000012609A8 Flame retardant polymer blends, and method for making |
| 08/16/2001 | US20010014963 Method for designing a decoupling circuit |
| 08/16/2001 | US20010014706 Heat curing; adhesives |
| 08/16/2001 | US20010014705 Mixture containing talc; dustless |
| 08/16/2001 | US20010014559 Electronic component inwhich an insert member is tightly held by a resin portion and prevented from deformation thereof |
| 08/16/2001 | US20010014553 Terminal and connecting method of circuit body and the terminal |
| 08/16/2001 | US20010014548 Electrical connector |
| 08/16/2001 | US20010014547 Assembly including a flex circuit and a gas tight chamber |
| 08/16/2001 | US20010014546 Cap and low insertion force connector for printed circuit board |
| 08/16/2001 | US20010014491 Lead frame and manufacturing method thereof |
| 08/16/2001 | US20010014490 Method of manufacturing semiconductor integrated circuit device |
| 08/16/2001 | US20010014429 Potassium, boron and silicon oxide |
| 08/16/2001 | US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil |
| 08/16/2001 | US20010014407 Acid resistance |
| 08/16/2001 | US20010014399 Solvent-free |
| 08/16/2001 | US20010014014 Casing for an electronic unit |
| 08/16/2001 | US20010014004 Parallel plate buried capacitor |
| 08/16/2001 | US20010013786 Apparatus and method for evaluating printed circuit board assembly manufacturing processes |
| 08/16/2001 | US20010013650 Circuit interconnect providing reduced crosstalk and simultaneous switching noise |
| 08/16/2001 | US20010013647 Flexible substrate based ball grid array (BGA) package |
| 08/16/2001 | US20010013535 Method of connecting circuit boards |
| 08/16/2001 | US20010013425 Multilayered Substrate for Semiconductor Device |
| 08/16/2001 | US20010013423 Flip chip attach on flexible circuit carrier using chip with metallic cap on solder |
| 08/16/2001 | US20010013422 Electronic interconnection medium having offset electrical mesh plane |
| 08/16/2001 | US20010013171 Method and equipment for removing insulation from a flat cable |
| 08/16/2001 | US20010013170 Component alignment methods |