| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/27/2001 | WO2001071074A1 Base material for a printed circuit board formed from a three-dimensional woven fiber structure |
| 09/27/2001 | WO2001070885A1 Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate |
| 09/27/2001 | WO2001070844A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 09/27/2001 | WO2001070843A2 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 09/27/2001 | WO2001070392A1 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 09/27/2001 | WO2001035006A3 Metal-infiltrated ceramic seal |
| 09/27/2001 | US20010025016 Solution for removing thermal grease from electronic cards |
| 09/27/2001 | US20010024892 Contact sheet |
| 09/27/2001 | US20010024891 Connector arrangement for an electro-luminescent lighting element and night light using such an arrangement |
| 09/27/2001 | US20010024889 Module mounting system |
| 09/27/2001 | US20010024888 Electromagnetic coupler socket |
| 09/27/2001 | US20010024472 Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques |
| 09/27/2001 | US20010024360 Printed wiring board |
| 09/27/2001 | US20010024259 Tape carrier package film |
| 09/27/2001 | US20010024148 Filter arrangement |
| 09/27/2001 | US20010024129 Interposer and methods for fabricating same |
| 09/27/2001 | US20010023983 Semiconductor devices |
| 09/27/2001 | US20010023982 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 09/27/2001 | US20010023782 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| 09/27/2001 | US20010023780 Printed wiring board |
| 09/27/2001 | US20010023779 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 09/27/2001 | US20010023535 Polymer thick-film resistor printed on planar circuit board surface |
| 09/27/2001 | US20010023533 Method of increasing package reliability using package lids with plane CTE Gradients |
| 09/27/2001 | US20010023532 Method for producing multilayer circuit board |
| 09/27/2001 | DE10018415C1 Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path |
| 09/27/2001 | DE10015502A1 Photostructurizable paste, for producing structurized resistance film or wiring trace on green ceramic substrate, contains platinum (compound) powder and optionally ceramic (precursor) as filler in light-sensitive organic binder |
| 09/27/2001 | DE10013936A1 Filter for the separation of high frequency components from signal content is in a multi layer form |
| 09/27/2001 | DE10013483A1 Circuit board has connecting pads with upper sides arranged in planes which are at the height of and/or above the plane of the upper side of the conducting pathways |
| 09/27/2001 | DE10013170A1 Structure-optimized fan-out of surface-mount device (SMD) electronic components for design layout of circuit boards |
| 09/26/2001 | EP1137333A1 Multilayer build-up wiring board |
| 09/26/2001 | EP1137332A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 09/26/2001 | EP1137330A1 Pattern design for electronic components on a 400 micron copper layer in printed circuits |
| 09/26/2001 | EP1137328A2 Insulating material for printed wiring board |
| 09/26/2001 | EP1137067A2 Multi-chip ball grid array ic packages |
| 09/26/2001 | EP1137060A2 Method for producing multilayer circuit board and multilayer circuit board |
| 09/26/2001 | EP1136944A1 Non-contact type ic card and method and apparatus for manufacturing the same |
| 09/26/2001 | EP1135827A1 Voltage tunable laminated dielectric materials for microwave applications |
| 09/26/2001 | EP1135799A1 Method and device for producing shaped ceramic bodies using setter plates |
| 09/26/2001 | EP1135783A1 Capacitance-coupled high dielectric constant embedded capacitors |
| 09/26/2001 | EP1135693A1 Probe card for probing wafers with raised contact elements |
| 09/26/2001 | CN1315044A Electronic device and manufacture thereof |
| 09/26/2001 | CN1314932A Process for preparing green pigment composition containing no halogen |
| 09/26/2001 | CN1314829A Printing of electronic circuit and components |
| 09/26/2001 | CN1314777A Counteraction circuit for controlling high speed line electromagnetic interference |
| 09/26/2001 | CN1314776A Monolithic ceramic electronic element and its producing method and electronic device |
| 09/26/2001 | CN1314618A Method for preparing multiple layer inner connection circuit |
| 09/25/2001 | US6295631 Method for determining the compensation value of the width of a wire by measuring the resistance of the wire |
| 09/25/2001 | US6295210 Chassis grounding ring for a printed wiring board mounting aperture |
| 09/25/2001 | US6295207 Retractable and removable extensions with edge plated PCB's in thin-profile electronic devices |
| 09/25/2001 | US6295206 Memory card, and receptacle for same |
| 09/25/2001 | US6295200 Carrier assembly and method |
| 09/25/2001 | US6295199 Electronics module and a method of manufacturing such a module |
| 09/25/2001 | US6295193 Electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board |
| 09/25/2001 | US6295031 Memory card assembly having an integral antenna |
| 09/25/2001 | US6294971 Inverted board mounted electromechanical device |
| 09/25/2001 | US6294837 Semiconductor interconnect having laser machined contacts |
| 09/25/2001 | US6294827 Hybrid microwave-frequency integrated circuit |
| 09/25/2001 | US6294756 Thick film low value high frequency inductor, and method of making the same |
| 09/25/2001 | US6294742 Apparatus and method for adapting surface mount solder pad for heat sink function |
| 09/25/2001 | US6294730 Adapted electrically conductive layer |
| 09/25/2001 | US6294621 Resin composites and method for producing the same |
| 09/25/2001 | US6294316 Having fine metal bumps. |
| 09/25/2001 | US6294275 Has both high thermal conductivity and high mechanical strength; average grain diameter of 2 mum or less; and a half width of the diffraction peak on the (302) plane, obtained by x-ray diffraction, of 0.24 deg. or less. |
| 09/25/2001 | US6294255 Method of and structure for fixing a flexible electrical conductor |
| 09/25/2001 | US6294244 Sintered product of silicon nitride contains a rare earth element (re) and magnesium; power modules. |
| 09/25/2001 | US6293818 Electrical connector for connecting a flexible printed circuit to a rigid printed circuit board |
| 09/25/2001 | US6293808 Contact sheet |
| 09/25/2001 | US6293455 Method for producing a reliable BGA solder joint interconnection |
| 09/25/2001 | US6293008 Method for producing foil circuit boards |
| 09/25/2001 | CA2099998C Dial speed control for hand-held power tool |
| 09/20/2001 | WO2001069999A1 A method for printing a conductive coating on an electronic unit |
| 09/20/2001 | WO2001069990A1 Bonded structure and electronic circuit board |
| 09/20/2001 | WO2001069988A1 Printed-circuit board with fuse |
| 09/20/2001 | WO2001069987A2 Printed circuit board assembly with improved thermal performance |
| 09/20/2001 | WO2001069971A2 Hearing aid with a flexible shell |
| 09/20/2001 | WO2001069963A2 Through-hole and surface mount technologies for highly-automatable hearing aid receivers |
| 09/20/2001 | WO2001069717A1 Method for forming radio frequency antenna using conductive inks |
| 09/20/2001 | WO2001069680A2 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 09/20/2001 | WO2001069670A1 Module with built-in electronic elements and method of manufacture thereof |
| 09/20/2001 | WO2001069577A2 Fiber display module and panel assembly |
| 09/20/2001 | WO2001069458A2 Optimized structure for the fanout of smd components during the routing of printed-circuit boards |
| 09/20/2001 | WO2001068755A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068754A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068753A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068752A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068751A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068750A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068749A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068748A1 Impregnated glass fiber strands and products including the same |
| 09/20/2001 | WO2001068728A1 Poly(alicyclic olefin) and process for producing the same |
| 09/20/2001 | WO2001068567A2 Photostructured paste |
| 09/20/2001 | WO2001068528A1 Composite metal titanate in plate form and method for preparation thereof |
| 09/20/2001 | WO2001068340A1 Aromatic polyamide film |
| 09/20/2001 | WO2001033926A3 Electronic control device |
| 09/20/2001 | WO2000059000A8 Method for making segmented through holes in printed circuit boards |
| 09/20/2001 | WO2000046837B1 Improved circuit board manufacturing process |
| 09/20/2001 | US20010023144 Arrangement for supplying power from a buss bar to a circuit board |
| 09/20/2001 | US20010023142 Printed circuit board connector |
| 09/20/2001 | US20010023140 Socket for electrical parts |
| 09/20/2001 | US20010023139 Center bond flip chip semiconductor carrier and a method of making and using it |