Patents for H05K 1 - Printed circuits (98,583)
10/2001
10/09/2001US6300576 Printed-circuit board having projection electrodes and method for producing the same
10/09/2001US6300566 Electrical connection of a circuit carrier to a conductor-track carrier
10/09/2001US6300563 Gauge assembly having an adaptable coil assembly
10/09/2001US6300158 Integrated solar power module
10/09/2001US6300038 Articles having imagable coatings
10/09/2001US6299942 Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use
10/09/2001US6299785 Electrode formation process
10/09/2001US6299749 Method of fabricating an electrical component
10/09/2001US6299713 Optical radiation conducting zones and associated bonding and alignment systems
10/09/2001US6299469 Flexible circuit board splice clamp
10/09/2001US6299460 Spring-loaded backing plate assembly for use with land grid array-type devices
10/09/2001US6299456 Interposer with contact structures for electrical testing
10/09/2001US6299337 Flexible multiple led module, in particular for a luminaire housing of a motor vehicle
10/09/2001US6299053 Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
10/09/2001CA2045272C Process for improving the surface of liquid crystal polymers
10/06/2001CA2337659A1 Backplane configuration without common switch fabric
10/04/2001WO2001074124A1 Simultaneous switching noise minimization technique for power lines using dual layer power line mutual inductors
10/04/2001WO2001073957A2 Battery-operated wireless-communication apparatus and method
10/04/2001WO2001073883A2 Low-temperature fabrication of thin-film energy-storage devices
10/04/2001WO2001073870A2 Integrated capacitor-like battery and associated method
10/04/2001WO2001073868A2 Device enclosures and devices with integrated battery
10/04/2001WO2001073866A2 Method and apparatus for integrated-battery devices
10/04/2001WO2001073865A2 Continuous processing of thin-film batteries and like devices
10/04/2001WO2001073864A2 Thin-film battery having ultra-thin electrolyte and associated method
10/04/2001WO2001073800A1 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method
10/04/2001WO2001073451A1 High frequency circuit impedance measuring probe for inner-layer-containing laminated sheet used for multi-layer printed board
10/04/2001WO2001072902A1 Curable composition and multilayered circuit substrate
10/04/2001WO2001072887A1 Screen printable flame retardant coating
10/04/2001WO2001072879A1 Lowly heat-expandable laminate
10/04/2001WO2001072868A1 Halogen free epoxy resin having a defined molecule mass
10/04/2001WO2001020668A3 AN INTEGRATED RF MxN SWITCH MATRIX
10/04/2001WO2001012880A3 Method for the production of a self-supporting copper foil
10/04/2001US20010027039 Connector holding structure for securely mounting print-board connector in casing
10/04/2001US20010027037 Compact electrical adapter for mounting to a panel connector of a computer
10/04/2001US20010027036 Electrical connector
10/04/2001US20010027035 Electrical connector
10/04/2001US20010026888 Battery pack and method of manufacturing the same
10/04/2001US20010026864 Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts
10/04/2001US20010026863 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization
10/04/2001US20010026686 Camera having flexible circuit board
10/04/2001US20010026663 Optical wavelength division multiplexer/demultiplexer having adhesive overflow channels with dams to achieve tight adhesive bond
10/04/2001US20010026638 Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same
10/04/2001US20010026444 Electronic circuit board with built-in thin film capacitor and manufacturing method thereof
10/04/2001US20010026442 Conductor track layer structure and prestage thereof
10/04/2001US20010026441 Printed wiring board having heat radiating means and method of manufacturing the same
10/04/2001US20010026438 Electric power module and method for making same
10/04/2001US20010026435 Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same
10/04/2001US20010026388 Electro-optical connector module
10/04/2001US20010026211 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method
10/04/2001US20010026016 Electronic component of a high frequency current suppression type and bonding wire for the same
10/04/2001US20010025726 Circuit board and manufacturing method thereof
10/04/2001US20010025723 Mounting structure of electronic component on substrate board
10/04/2001US20010025722 Glass-ceramic wiring board
10/04/2001US20010025718 Bus bar wiring plate body for electric coupling box
10/04/2001US20010025596 Heat insulation arrangement of indicating instrument
10/04/2001EP1139706A2 Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same
10/04/2001EP1139705A1 Printed wiring board and method of producing the same
10/04/2001EP1139703A1 Substrate of circuit board
10/04/2001EP1139482A2 Electric accumulator with electronic protection circuit
10/04/2001EP1139355A1 Electronic device of ceramic
10/04/2001EP1139353A2 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method
10/04/2001EP1139104A2 Electrical conductor multilayer arrangement with integrated current detection
10/04/2001EP1139019A1 L.E.D. thermal management
10/04/2001EP1138719A1 Polyimide/polyarylate resin compositions and moldings thereof
10/04/2001EP1138420A2 Molybdenum-copper composite powder
10/04/2001EP1138181A1 Article having an embedded electronic device, and method of making same
10/04/2001EP1138180A1 Printed circuit board and method for fabricating such board
10/04/2001EP1137970A2 Method and device for aligning two photo masks with each other and optionally, an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards
10/04/2001EP0956747B1 Circuit board for electrical apparatus with hf components, particularly for mobile radiocommunications equipment
10/04/2001EP0538457B1 Fabrication of metal matrix composites by vacuum die casting
10/04/2001DE10015046A1 Circuit arrangement based on at least two circuit boards e.g. for operation of motor vehicle, includes a channel in the carrier plate between circuit boards having one end designed for engineering the contacts
10/04/2001DE10012244A1 Manufacturing printing plate involves applying structurable coating to plate, structuring coating to form a structured coating with recesses, filling recesses and removing structured coating
10/03/2001CN1316116A Method for vertical connection of conductors in device in microwave range
10/03/2001CN1315903A Resin/copper/metal laminate and method of producing same
10/03/2001CN1315823A Method for manufacturing circuit device and circuit device
10/03/2001CN1315822A Film resistance element for printed circuit board and forming method thereof
10/03/2001CN1315734A Insulative material for printed circuit board
10/02/2001US6298013 Device for monitoring the travel time of mail shipments
10/02/2001US6297981 Compact electrical device, especially a switched-mode power supply
10/02/2001US6297968 Mounting structure for mounting flexible printed circuit board and recording/reproducing apparatus using same
10/02/2001US6297965 Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board
10/02/2001US6297964 Semiconductor device, method of fabricating the same film carrier tape, circuit board, and electronic apparatus
10/02/2001US6297961 Semiconductor module and heat sink used in such module
10/02/2001US6297959 Radiation structure for heating element
10/02/2001US6297957 Apparatus for reducing electromagnetic emissions from a computer
10/02/2001US6297560 Semiconductor flip-chip assembly with pre-applied encapsulating layers
10/02/2001US6297551 Integrated circuit packages with improved EMI characteristics
10/02/2001US6297469 Process for producing a metal-ceramic substrate
10/02/2001US6297460 Multichip module and method of forming same
10/02/2001US6297459 Processing low dielectric constant materials for high speed electronics
10/02/2001US6297458 Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process
10/02/2001US6296949 Printed circuits of laminates on substrates, metals, copper electrodeposits manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional elements
10/02/2001US6296722 Lead-free solder alloy
10/02/2001US6296506 Socket for a pin grid-array package
10/02/2001US6296499 Contact for error resistant coupling of electrical signals
10/02/2001US6296494 Printed-circuit module having a printed-circuit board mounted to a printing wiring board
10/02/2001US6295727 Method of manufacturing an integrated circuit
09/2001
09/27/2001WO2001072095A2 Polybutadiene and polyisoprene based theremosetting compositions and method of manufacture
09/27/2001WO2001071908A1 Isolating energy conditioning shield assembly
09/27/2001WO2001071860A1 Card edge connector for a modular jack