Patents for H05K 1 - Printed circuits (98,583)
10/2001
10/16/2001US6304690 Connecting a plurality of circuit boards
10/16/2001US6304450 Inter-circuit encapsulated packaging
10/16/2001US6304448 Power module
10/16/2001US6304425 Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof
10/16/2001US6304232 Circuit module
10/16/2001US6303989 Integrated circuit device on metal board with CPU power converter
10/16/2001US6303982 Semiconductor device
10/16/2001US6303881 Via connector and method of making same
10/16/2001US6303880 Printed circuit boards
10/16/2001US6303878 Mounting structure of electronic component on substrate board
10/16/2001US6303877 Multilayer thin-film wiring board
10/16/2001US6303875 IC packages replaceable by IC packages having a smaller pin count and circuit device using the same
10/16/2001US6303874 Electronic parts module and electronic equipment
10/16/2001US6303871 Degassing hole design for olga trace impedance
10/16/2001US6303733 From bisphenol compounds and difluoro diarylacetylenes and/or ethynylated benzophenones; dielectrics employed with a variety of microelectronic devices, for example, integrated circuits and multichip modules.
10/16/2001US6303408 Microelectronic assemblies with composite conductive elements
10/16/2001US6303400 Temporary attach article and method for temporary attach of devices to a substrate
10/16/2001US6303230 For the manufacture of hard disk drive(hdd) suspensions of an integrated circuit/wiring structure with high accuracy
10/16/2001US6302742 Electrical interface panel
10/16/2001US6302709 Multiple function high current interconnect with integrated bus bar
10/16/2001US6302705 Electrical circuit connector with support
10/16/2001US6302704 Method and apparatus for selectively connecting flexible circuits
10/16/2001US6302702 Connecting devices and method for interconnecting circuit components
10/16/2001CA2229596C Hermetically sealed electrical feedthrough for use with implantable electronic devices
10/16/2001CA2080831C Crosslinkable fluorinated aromatic ether compositions
10/16/2001CA2006708C Release film composed of a laminate
10/11/2001WO2001076336A1 Method for fabricating electrical connecting elements, and connecting element
10/11/2001WO2001076331A1 Element for an electronic assembly
10/11/2001WO2001076330A1 Electrical connecting element and method of fabricating the same
10/11/2001WO2001076322A2 Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions
10/11/2001WO2001076051A2 Dc power adapter system
10/11/2001WO2001076020A1 Channel-shaped connection device for electrical lines of internal combustion engines
10/11/2001WO2001075971A1 Semiconductor device and its manufacturing method
10/11/2001WO2001075970A2 Element and method for connecting constituents of an electronic assembly
10/11/2001WO2001075969A1 Electronic component with flexible contact points and method for the production thereof
10/11/2001WO2001075916A1 Multiple array and method of making a multiple array
10/11/2001WO2001075832A1 A method for forming a product sensor, and a product sensor
10/11/2001WO2001075458A1 Multiple layer electrical interface
10/11/2001WO2001075424A1 Solder cream print visual inspection device and inspecting method
10/11/2001WO2001074960A2 Halogen free flame retardant adhesive resin coated composite
10/11/2001WO2001074927A1 Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
10/11/2001WO2001074585A1 Metallized polyimide film
10/11/2001US20010029130 Electrical connection arrangement and method for the manufacture thereof
10/11/2001US20010029128 Electrical connecting structure of mounted part, computer apparatus, and electronic equipment
10/11/2001US20010029118 Structure for connecting terminals on wiring board
10/11/2001US20010028557 Method and apparatus for interconnecting multiple devices on a circuit board
10/11/2001US20010028556 Printed circuit board assembly
10/11/2001US20010028554 Module systems and module manufacturing processes
10/11/2001US20010028454 Optical inspection of laser vias
10/11/2001US20010028104 Semiconductor device, stacked-type semiconductor unit and method for manufacturing the same
10/11/2001US20010027964 Laser machining method, laser machining apparatus, and its control method
10/11/2001US20010027877 Electronic component and mounting method and apparatus thereof
10/11/2001US20010027875 Multi-layer printed circuit board and fabrication method thereof and a BGA semiconductor package using the multi-layer printed circuit board
10/11/2001US20010027874 Wiring substrate, method of manufacturing the same and semiconductor device
10/11/2001US20010027605 Method for producing printed wiring board
10/11/2001DE10113793A1 Wärmeisolationsanordnung eines Anzeigeinstruments Heat insulation arrangement of a display instrument
10/11/2001DE10015830A1 Manufacture of optical waveguide in circuit board by filling trench in circuit board with e.g. UV-hardenable transparent polymer material
10/11/2001DE10015757A1 Display has LCD panel and inputs set into a multi layer foil that has connection tracks
10/11/2001DE10015270A1 Vertical implementation of thick film resistances in multilayer substrates
10/11/2001DE10014640A1 Halogenfreies Epoxidharz mit definierter Molekülmasse Halogen-free epoxy resin with defined molecular mass
10/10/2001EP1143776A1 Printed-circuit board and method of manufacture thereof
10/10/2001EP1143775A2 Electronic assembly with semi-crystalline copolymer adhesive
10/10/2001EP1143774A2 Wiring board comprising granular magnetic film
10/10/2001EP1143761A2 Backplane configuration without common switch fabric
10/10/2001EP1143515A2 Wiring substrate, method of manufacturing the same and semiconductor device
10/10/2001EP1143509A2 Method of manufacturing the circuit device and circuit device
10/10/2001EP1142953A1 Cyanate-epoxy resin composition, and prepreg, metal foil-laminated plate and printed wiring board using the same
10/10/2001EP1142921A1 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
10/10/2001EP1142849A1 Silicon nitride composite substrate
10/10/2001EP1142458A1 Resonant tag with a conductive composition closing an electrical circuit
10/10/2001EP1142457A1 Method for producing a multilayer printed circuit board
10/10/2001EP1142456A1 Process for depositing conducting layer on substrate
10/10/2001EP1141806A1 Usb-compliant personal key with integral input and output devices
10/10/2001CN2453641Y Malgnetic mateiral composite substrate
10/10/2001CN1317227A Method and device for processing substrates
10/10/2001CN1317224A Interconnect assembly for printed circuit boards and manufacturing method thereof
10/10/2001CN1317221A Door-dependent system for enabling and adjusting options on hearing aids
10/10/2001CN1317163A Non-circular micro-via
10/10/2001CN1317020A Melt-processible poly(tetrafluoroethylene)
10/10/2001CN1316873A Flexible printed substrate
10/10/2001CN1316872A Panel and its making method and installation method for electronic circuit component
10/10/2001CN1316871A Flexible wiring board and making method thereof and display device with flexible wiring board
10/10/2001CN1316728A Record or playback equipment
10/10/2001CN1316463A Phasphorus-containing epoxy resin composition, flame-retarded sheet resin composite metal forming, semi-solidified sheet, veneer shect, multiply sheet using the phasphorus-containing epoxy resin
10/10/2001CN1072736C Method of coating copper film on ceramic substrate
10/09/2001US6301127 Circuit block for power supply
10/09/2001US6301125 Unit with shield
10/09/2001US6301121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process
10/09/2001US6301120 Circuit board apparatus
10/09/2001US6301114 Multilayered electronic part and electronic circuit module including therein the multilayered electronic part
10/09/2001US6301105 Disk drive enclosure
10/09/2001US6301104 Interface card-type motherboard for a computer
10/09/2001US6300997 Liquid crystal display device having an IC chip mounted on a narrow film wiring board
10/09/2001US6300847 Backplane having strip transmission line ethernet bus
10/09/2001US6300846 Flat flexible cable with ground conductors
10/09/2001US6300778 Solder paste and residue
10/09/2001US6300739 Low cost limited angle torque DC brushless servomotor and method for fabricating thereof
10/09/2001US6300687 Micro-flex technology in semiconductor packages
10/09/2001US6300679 Flexible substrate for packaging a semiconductor component
10/09/2001US6300579 Grounding terminal and mounting structure of the same on a printed circuit board