| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 10/24/2001 | EP1147905A1 Method of manufacturing printed-circuit board, method of manufacturing recording device, and mask for printed-circuit board |
| 10/24/2001 | EP1147070A1 Electrically conductive ceramics |
| 10/24/2001 | EP1062851B1 Modular power output stage |
| 10/24/2001 | EP0776596B1 Rigid flex printed circuit board |
| 10/24/2001 | EP0772958B1 Internally damped circuit articles |
| 10/24/2001 | CN1319277A Isolator with built-in power amplifier |
| 10/24/2001 | CN1319259A Light-emitting diode |
| 10/24/2001 | CN1319239A Method of manufacturing ceramic electronic copmonents |
| 10/24/2001 | CN1319238A Planar transformer |
| 10/24/2001 | CN1319067A Transport system with integrated transport carrier and directors |
| 10/24/2001 | CN1318973A Positioning device for use in process for manufacturing multi-layer printed circuit board and its using method |
| 10/24/2001 | CN1318849A High-frequency current inhibiting body of magnetic loss material |
| 10/24/2001 | CN1073651C Lanminate base stock |
| 10/23/2001 | US6308056 Double super tuner |
| 10/23/2001 | US6307751 Flexible circuit assembly |
| 10/23/2001 | US6307527 LED display assembly |
| 10/23/2001 | US6307458 Split inductor with fractional turn of each winding and PCB including same |
| 10/23/2001 | US6307446 Planar interconnects using compressible wire bundle contacts |
| 10/23/2001 | US6307440 Oscillating circuit, an oscillator frequency adjusting method, and a tuner |
| 10/23/2001 | US6307261 Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device |
| 10/23/2001 | US6307260 Microelectronic assembly fabrication with terminal formation from a conductive layer |
| 10/23/2001 | US6307259 Plastic package for semiconductor device |
| 10/23/2001 | US6306980 Resin composites and method for producing the same |
| 10/23/2001 | US6306963 Electrical laminates |
| 10/23/2001 | US6306946 Liquid crystalline polyesters having a surprisingly good combination of a low melting point, a high heat distortion temperature, a low melt viscosity, and a high tensile elongation |
| 10/23/2001 | US6306935 Thermosetting resin compositions for build-up method |
| 10/23/2001 | US6306528 Method for the controlling of certain second phases in aluminum nitride |
| 10/23/2001 | US6306511 Substrate comprising compact of first powder comprising partially sintered glass, functional layer comprising compact of second powder comprising ceramic material having specified electrical property, diffusion bonded by substrate material |
| 10/23/2001 | US6306481 Multilayer circuit board having insulating layer with via-holes |
| 10/23/2001 | US6305987 Integrated connector and semiconductor die package |
| 10/23/2001 | US6305975 Electrical connector feedthrough to low pressure chamber |
| 10/23/2001 | US6305970 Terminal end structure of flat circuitry and branch connection structure constituted by the same |
| 10/23/2001 | US6305946 Power connector combining signal connection |
| 10/23/2001 | CA2170718C Electromagnetic radiation measuring apparatus |
| 10/18/2001 | WO2001078475A1 Method and device for fabricating electrical connecting elements, and connecting element |
| 10/18/2001 | WO2001078473A1 Copper-clad laminated sheet |
| 10/18/2001 | WO2001078472A1 Flexible circuit with plated cover layer and overlapping protective layer |
| 10/18/2001 | WO2001078354A2 Hands-free communication device |
| 10/18/2001 | WO2001078265A1 Rugged shock-resistant backplane for embedded systems |
| 10/18/2001 | WO2001078199A2 Printed circuit board assembly |
| 10/18/2001 | WO2001077420A1 Laser hole drilling copper foil |
| 10/18/2001 | WO2001077192A1 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured object obtained therefrom |
| 10/18/2001 | US20010032030 Method of part mounting |
| 10/18/2001 | US20010031690 Insulator ceramic is composed of an magnesium oxide-magnesium aluminate (MgO-MgAl2O4) ceramic powder, and a glass powder containing oxides of silicon, boron and with or without alumina, also contains oxides of 1a, 11a, zinc and copper |
| 10/18/2001 | US20010031580 Connector for smart cards |
| 10/18/2001 | US20010031577 Connection-retaining unit |
| 10/18/2001 | US20010031576 Surface mount holding feature |
| 10/18/2001 | US20010031569 High density wirebond connector assembly |
| 10/18/2001 | US20010031568 Printed circuit board connector |
| 10/18/2001 | US20010031507 Method and device for adapting/tuning signal transit times on line systems or networks between integrated circuits |
| 10/18/2001 | US20010030882 Flanged terminal pins for dc/dc converters |
| 10/18/2001 | US20010030789 Method and apparatus for fiber optic modules |
| 10/18/2001 | US20010030550 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate |
| 10/18/2001 | US20010030521 Cross-connect method and apparatus |
| 10/18/2001 | US20010030295 Electromagnetic wave assisted chemical processing |
| 10/18/2001 | US20010030185 Connection of a junction to an electrical conductor track on a plate |
| 10/18/2001 | US20010030122 Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same |
| 10/18/2001 | US20010030061 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 10/18/2001 | US20010030060 Electronic component protection devices and methods |
| 10/18/2001 | US20010030059 Circuit component built-in module, radio device having the same, and method for producing the same |
| 10/18/2001 | US20010030058 Multi-layer printed circuit board registration |
| 10/18/2001 | US20010030057 Electronic component package, printing circuit board, and method of inspecting the printed circuit board |
| 10/18/2001 | US20010030013 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 10/18/2001 | US20010029666 Printed-circuit board having projection electrodes and method for producing the same |
| 10/18/2001 | US20010029665 Method of manufacturing ceramic thick-film printed circuit board |
| 10/18/2001 | DE10117872A1 Multilayer monolithic ceramic substrate has thick boundary green layer in contact with thick base green layer |
| 10/18/2001 | DE10115776A1 Sammelschienentragplatte für einen elektrischen Anschlußkasten Busbar support plate for an electric connection box |
| 10/18/2001 | DE10016132A1 Electronic component for electronic devices comprises electronic switch and conducting paths on surface of the component to electrically connect the switch with metal-coated protrusions made from rubber-elastic insulating material |
| 10/18/2001 | DE10016037A1 Verfahren zur Herstellung eines Etiketts oder einer Chipkarte, Vorrichtung zur Durchführung des Verfahrens und danach hergestelltes Etikett oder Chipkarte Process for the preparation of a label or a chip card, apparatus for carrying out the process and then produced label or chip card |
| 10/18/2001 | DE10014382A1 Leiterbahn-Schichtstruktur und Vorstufe zu dieser Wiring layer structure, and the precursor to this |
| 10/17/2001 | EP1146637A1 Electronic component of a high frequency current suppression type and bonding wire for the same |
| 10/17/2001 | EP1146591A2 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same |
| 10/17/2001 | EP1146404A1 Electronic timepiece |
| 10/17/2001 | EP1146372A2 Opto-electronic connector modules based on flexible circuit boards |
| 10/17/2001 | EP1146342A2 High frequency electronic module and test method thereof |
| 10/17/2001 | EP1146149A1 Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same |
| 10/17/2001 | EP1145845A1 Composite film |
| 10/17/2001 | EP1145610A2 Electronic control device |
| 10/17/2001 | EP1145608A1 Printed circuit assembly having locally enhanced wiring density |
| 10/17/2001 | EP1145606A1 Printed circuit board |
| 10/17/2001 | EP1145374A2 Remote entry integrally molded transmitter |
| 10/17/2001 | EP1145348A1 Micro-electrochemical energy storage cells |
| 10/17/2001 | EP1145317A1 Coaxial type signal line and manufacturing method thereof |
| 10/17/2001 | EP1145301A2 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 10/17/2001 | EP1145256A2 Composition and method for manufacturing integral resistors in printed circuit boards |
| 10/17/2001 | EP1145085A1 Electronic wrist watch comprising an integrated circuit incorporated in a flexible band |
| 10/17/2001 | EP1144498A1 Flame retardant polymer blends, and method for making |
| 10/17/2001 | EP0841412B1 High-tensile electrolytic copper foil and process for producing the same |
| 10/17/2001 | CN1318274A Multilayer build-up wiring board |
| 10/17/2001 | CN1318273A Method of producing multi-layer circuits |
| 10/17/2001 | CN1318223A Conductive parts |
| 10/17/2001 | CN1318173A Electrical connector for simultaneous connection of two electronic-memory cards |
| 10/17/2001 | CN1317925A Printed distributing board |
| 10/17/2001 | CN1317863A Surface mounting type switching mains and its mounting method |
| 10/17/2001 | CN1317829A High frequency current inhibiting type electronic component and its conjunction wire |
| 10/17/2001 | CN1073234C Dew-forming transducer and video recorder using this transducer |
| 10/17/2001 | CN1073223C Electric lamp to be fitted to printed board |
| 10/17/2001 | CN1073132C Halogen-free flame-retardant epoxy resin compsn. |
| 10/16/2001 | US6304726 Camera |
| 10/16/2001 | US6304700 Device for transmitting high-frequency communication signals and method for manufacturing the device |