Patents for H05K 1 - Printed circuits (98,583)
11/2001
11/01/2001US20010035529 Micro-flex technology in semiconductor packages
11/01/2001US20010035301 Method and article for the connection and repair of flex and other circuits
11/01/2001US20010035297 Wiring material and connecting structure of said wiring material
10/2001
10/31/2001EP1150551A1 Conductive connecting pin and package board
10/31/2001EP1150550A2 Method for interconnecting electronic components in a portable credit card-like device
10/31/2001EP1150311A2 Composite magnetic material and composite dielectric material for electronic parts
10/31/2001EP1149521A1 An electronic circuit board, an arrangement comprising an insulating material and an electronic circuit board
10/31/2001EP0850425B1 Radio frequency tag
10/31/2001EP0710431B1 Multi-layer printed circuit board and space-saving memory module
10/31/2001DE10116797A1 Elektrischer Verbinder The electrical connector
10/31/2001DE10100393A1 Einmodulsystem Einmodulsystem
10/31/2001DE10050726A1 Multi-pole printed circuit board connector has relatively spaced fixing elements for holding contact paths at required relative spacing
10/31/2001DE10021125A1 Manufacturing flexible circuit involves positioning flexible circuit foil on grid structure on workpiece bearer with pins, providing solder past, mounting components, soldering in oven
10/31/2001DE10019888A1 Trägersubstrat für elektronische Bauteile Substrate for electronic components
10/31/2001DE10019410A1 Flexible flat cable has flexible, insulating bearer structure, conducting tracks, at least sectional magnetic blocking surface for eddy current screening against magnetic fields
10/31/2001DE10018020A1 Electrical connection arrangement for vehicle closing device, has housing wall arranged in vicinity of connection portion and connection zone of electrical component to form basin
10/31/2001CN1320012A Method for producing multi-layer circuit board
10/31/2001CN1319914A Accumulator with electronic safety protection circuit
10/31/2001CN1319850A Electricity conductive glue and multi-layer ceramic electronic element using same
10/31/2001CN1319825A Indicator
10/31/2001CN1319780A LCD device
10/31/2001CN1319571A Isolation ceramic, multi-layer ceramic substrate and laminated electronic component
10/31/2001CN1074236C Process for producing multilayer printed circuit boards
10/31/2001CN1074235C Terminal connecting structure of flexible board and printed circuit board
10/31/2001CN1074074C Laminate base stock
10/30/2001US6311023 Camera having a light-shieldable member for protecting a semiconductor element flip-chip-bonded on a flexible printed board
10/30/2001US6310782 Apparatus for maximizing memory density within existing computer system form factors
10/30/2001US6310781 Connection pin layout for connecting integrated magnetics modules to a printed circuit board
10/30/2001US6310780 Surface mount assembly for electronic components
10/30/2001US6310775 Power module substrate
10/30/2001US6310764 Electrolytic capacitor with a high oscillation load factor
10/30/2001US6310752 Variable voltage protection structures and method for making same
10/30/2001US6310536 Termination resistor in printed circuit board
10/30/2001US6310527 Multi-layer circuit board including reactance element and a method of trimming a reactance element in a circuit board
10/30/2001US6310412 Three-phase AC distribution system and method for printed circuit boards
10/30/2001US6310401 Substrate for high-voltage modules
10/30/2001US6310398 Routable high-density interfaces for integrated circuit devices
10/30/2001US6310391 Mounted structure of circuit board and multi-layer circuit board therefor
10/30/2001US6310304 Electronic part fabricated by intaglio printing
10/30/2001US6310303 Structure for printed circuit design
10/30/2001US6310301 Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same
10/30/2001US6310299 Glass connector and fabricating method thereof
10/30/2001US6310293 Stacked assembly
10/30/2001US6309990 Glass fiber of low permittivity
10/30/2001US6309805 Method for securing and processing thin film materials
10/30/2001US6309791 Polyimide precursor, polyimide and their use
10/30/2001US6309241 Branch connection structure for flat cable
10/30/2001US6309228 C-shaped compliant contact
10/30/2001US6309224 High density wirebond connector assembly
10/30/2001US6309151 Device and method for controlling the machining depth of a machine for machining multilayer printed circuit boards
10/30/2001CA2200122C Uni-pad surface mount component package
10/30/2001CA2068726C Novel bistriazene compounds and polymeric compositions crosslinked therewith
10/25/2001WO2001080613A1 Process for stacking layers that form a multilayer printed circuit
10/25/2001WO2001080612A1 Method for fabricating electrical connecting element, and electrical connecting element
10/25/2001WO2001080609A1 Double-sided wiring board and its manufacture method
10/25/2001WO2001080608A1 Transparent substrate provided with electroconductive strips
10/25/2001WO2001080574A2 Splitter architecture for a telecommunication system
10/25/2001WO2001080387A2 Over-voltage protection for electronic circuits
10/25/2001WO2001080350A1 Suspended transmission line with embedded signal channeling device
10/25/2001WO2001080348A1 Suspended transmission line and method
10/25/2001WO2001080347A1 Suspended transmission line with embedded amplifier
10/25/2001WO2001080316A2 Contactless interconnection system
10/25/2001WO2001080207A1 Led switch control imaging device
10/25/2001WO2001079867A1 Method of making a probe test board
10/25/2001WO2001079691A1 Integrated powertrain control system for large engines
10/25/2001WO2001078908A1 High speed flip chip assembly process
10/25/2001WO2001042253A3 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
10/25/2001US20010034875 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise
10/25/2001US20010034587 Method for determining the desired decoupling components for power distribution systems
10/25/2001US20010034144 Electrical conductor
10/25/2001US20010034142 Signal transmission connector and cable employing same
10/25/2001US20010033963 Layered substrate with battery
10/25/2001US20010033952 Method and apparatus for integrated-battery devices
10/25/2001US20010033891 Blending copper powder with a high-polymer organic substance, adding alumina in cellulose derivative vehicle, and sintering to smaller particles
10/25/2001US20010033509 Stacked integrated circuits
10/25/2001US20010033476 Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device
10/25/2001US20010033474 Monolithic ceramic electronic component, method for manufacturing the same, and electronic device
10/25/2001US20010033452 Head assembly employing microactuator in recording medium drive
10/25/2001US20010033355 Mounting structure for semiconductor device, electro-optical device, and electronic apparatus
10/25/2001US20010033203 Oscillator, method for producing oscillator, and communication apparatus incorporating same
10/25/2001US20010033152 Apparatus for providing regulated power to an integrated circuit
10/25/2001US20010033015 Ball array layout and method of making
10/25/2001US20010032740 Microwave package
10/25/2001US20010032738 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
10/25/2001US20010032737 Conductive paste and multi-layer ceramic electronic component using the same
10/25/2001US20010032736 Circuit board holder
10/25/2001US20010032700 Printed wiring board
10/25/2001US20010032666 Integrated capacitor-like battery and associated method
10/25/2001US20010032388 Structure and method for multiple diameter via
10/25/2001DE19843731C2 Vorrichtung zur Schallwandlung Device for sound conversion
10/25/2001DE10103807A1 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture
10/25/2001DE10041290A1 Überspannungsschutzeinrichtung Overvoltage protection device
10/25/2001DE10038768A1 Transparent substrate with pattern of electric conductive tracks, screen printed, using stove burnt paste
10/25/2001DE10020099A1 Motor vehicle light comprises semiconductor structural elements whose main radiation direction runs in PCB plane or parallel to it
10/25/2001CA2406246A1 Splitter architecture for a telecommunications system
10/24/2001EP1148773A1 High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics
10/24/2001EP1148771A1 Circuit board holder
10/24/2001EP1148602A1 Overvoltage arrester device
10/24/2001EP1148597A2 Electrical connector
10/24/2001EP1148304A1 Second print plate for electronic control device for an electric water heater