Patents for H05K 1 - Printed circuits (98,583)
11/2001
11/13/2001US6316731 Method of forming a printed wiring board with compensation scales
11/13/2001US6316583 Fluorescence, ultraviolet radiation absorbance and solubility in organic solvents, can be epoxidized to form epoxy products whicha are used in manufacture of laminates, coatings, and adhesives
11/13/2001US6316116 Ceramic circuit board and method of manufacturing the same
11/13/2001US6316104 Based on polymer resins and containing a cationic scavenger (e.g., titanium phosphate) are provided for circuit materials and flat cables with metallic wiring.
11/13/2001US6316100 Nickel powders, methods for producing powders and devices fabricated from same
11/13/2001US6316059 Modifying the substrate with a silane layer, locally removing said layer with uv-ozone treatment and selectively nucleating the remaining silane layer in a polymer-stabilized pd sol.
11/13/2001US6315927 Photosensitive conductive paste
11/13/2001US6315614 Memory module with offset notches for improved insertion and stability and memory module connector
11/13/2001US6315605 Printed circuit board stiffener assembly
11/13/2001US6315381 Energy control method for an inkjet print cartridge
11/13/2001US6314852 Gang punch tool assembly
11/13/2001US6314810 Instruments cluster gauge mounting means
11/13/2001US6314660 Cascaded tensioning tangential drive for THA handling
11/13/2001US6314641 Interconnect for testing semiconductor components and method of fabrication
11/13/2001CA2216339C Process for preparing metal powder
11/09/2001CA2346619A1 Printed circuit board stiffener assembly
11/08/2001WO2001084894A1 Circuit card assembly having controlled expansion properties
11/08/2001WO2001084893A1 Circuit card assembly having controlled vibrational properties
11/08/2001WO2001084664A1 Broadband flexible printed circuit balun
11/08/2001WO2001084629A2 Detector for computer tomographs
11/08/2001WO2001084581A2 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/08/2001WO2001083620A1 Resin composition for electric and electronic appliances
11/08/2001WO2001083591A1 Polyimides and polyamic acids
11/08/2001WO2001075916A8 Multiple array and method of making a multiple array
11/08/2001US20010039646 Structure having multiple levels of programmable integrated circuits for interconnecting electronic components
11/08/2001US20010039309 Conductive fillers of copper microfibers mixed into thermoplastic or thermosetting resins; electromagnetic wave shielding properties and good conductivity in spite of small loading of the conductive filler
11/08/2001US20010039251 For semiconductor packaging products
11/08/2001US20010039074 Micro-flex technology in semiconductor packages
11/08/2001US20010038911 Heat resistance; soldering; dimensional stability
11/08/2001US20010038906 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
11/08/2001US20010038905 Printed wiring board and method of manufacturing the same
11/08/2001US20010038703 Hearing-aid assembly using folded flex circuits
11/08/2001US20010038531 Package substrate
11/08/2001US20010038530 Imbedded die-scale interconnect for ultra-high speed digital communications
11/08/2001US20010038527 Inter-circuit encapsulated packaging
11/08/2001US20010038310 Power transistor module, power amplifier and methods in the fabrication thereof
11/08/2001US20010038149 Multilayered wiring structure and method of manufacturing the same
11/08/2001US20010038145 Multilayer wiring board, semiconductor device and methods for manufacturing such multilayer wiring board and semiconductor device
11/08/2001US20010037897 Wiring board comprising granular magnetic film
11/08/2001US20010037896 Package substrate
11/08/2001US20010037895 Electronic component and manufacturing method thereof
11/08/2001US20010037565 Process for forming a multi-level thin-film electronic packaging structure
11/08/2001US20010037561 Contacting-making system for two printed circuit boards
11/08/2001DE10022064A1 External heated electric mirror for fitting to a motor vehicle includes an electric connector consisting of elongated sections for a printed circuit board.
11/08/2001DE10020761A1 Foil conductor e.g. for cable harnesses used in motor vehicle, includes a carrier material containing at least one conductor path as well as a covering foil joined to it via an adhesive layer
11/08/2001CA2413222A1 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
11/07/2001EP1152649A2 Electronic controller unit and method of manufacturing
11/07/2001EP1152648A2 Housing and method of making
11/07/2001EP1152647A1 Power supply with no potential ignition source
11/07/2001EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001EP1152069A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001EP1151646A1 Article having a circuit soldered with parts and method for recycling wastes of the same
11/07/2001EP1151485A1 Arrangement of electrochemical cells and circuit board
11/07/2001EP1019246A4 Microsphere-containing circuit board paper
11/07/2001EP0983617B1 Device for transmitting high-frequency signals
11/07/2001CN1321411A Printed wiring board and method of producing same
11/07/2001CN1321410A Printed wiring board and method of producing same
11/07/2001CN1321407A Substrate of circuit board
11/07/2001CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/07/2001CN1321060A Laser imaging of thin film circuit material
11/07/2001CN1321059A Circuit board consisting of grain structure magnetic film
11/07/2001CN1320576A Dielectric ceramic composition, method for producing same, and use in device of communication apparatus
11/06/2001US6314273 Mobile telecommunication apparatus having notches
11/06/2001US6314013 Stacked integrated circuits
11/06/2001US6313999 Self alignment device for ball grid array devices
11/06/2001US6313998 Circuit board assembly having a three dimensional array of integrated circuit packages
11/06/2001US6313598 Power semiconductor module and motor drive system
11/06/2001US6313541 Bone-pad with pad edge strengthening structure
11/06/2001US6313524 Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate
11/06/2001US6313456 Solid state imaging device having a box-shaped circuit board
11/06/2001US6313402 Stress relief bend useful in an integrated circuit redistribution patch
11/06/2001US6313185 Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structures
11/06/2001US6312864 Covering patterned film with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the decomposition temperature
11/06/2001US6312791 Multilayer ceramic substrate with anchored pad
11/06/2001US6312621 Bis/3,4-epoxycyclohexyl/methyl adipate, 3,4-epoxycyclohexyl methyl 3,4-epoxycyclohexane/carboxylate, bis/4-cyanatophenyl/ ethane, epoxidized polybutadiene, titanium-and/or zirconium-based lewis acid catalyst, dibenzylidene sorbitol.
11/06/2001US6312269 Card connector circuit board
11/06/2001US6312264 Connecting device
11/06/2001US6312263 Board-to-board connector capable of readily electrically connecting two parallel boards to each other
11/06/2001CA2150353C Detection tag
11/01/2001WO2001082671A1 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module
11/01/2001WO2001082666A1 Circuit board and production method therefor
11/01/2001WO2001082665A1 Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of the laminate with inside layer circuit
11/01/2001WO2001082664A1 Printed wiring board and method of mounting circuit element on this wiring board
11/01/2001WO2001082662A1 Single-sided wiring substrate, display module comprising the same and method of connecting the same
11/01/2001WO2001082661A1 Method for interconnecting electronic components in a portable object in the form of a credit card
11/01/2001WO2001082378A1 Carrier substrate for electronic components
11/01/2001WO2001082372A1 Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type
11/01/2001WO2001082315A1 Compositions and method for printing resistors, capacitors and inductors
11/01/2001WO2001081453A1 Method for making polyimide
11/01/2001US20010036766 Interlayer connection structure
11/01/2001US20010036506 Substrate and process for producing the same
11/01/2001US20010036066 Method and apparatus for delivering power to high performance electronic assemblies
11/01/2001US20010036065 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
11/01/2001US20010036063 Electronic part module mounted on
11/01/2001US20010036052 Dielectric material including particulate filler
11/01/2001US20010035799 Circuit board device and design support device
11/01/2001US20010035769 Semiconductor memory
11/01/2001US20010035687 Vibration motor holding apparatus and portable electronic equipment having the same
11/01/2001US20010035585 Semiconductor device having stress reducing laminate and method for manufacturing the same
11/01/2001US20010035570 Package for semiconductor devices