| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 10/01/2002 | US6459043 Flexible circuit with electrostatic damage limiting feature and method of manufacture |
| 10/01/2002 | US6459041 Etched tri-layer metal bonding layer |
| 10/01/2002 | US6459039 Method and apparatus to manufacture an electronic package with direct wiring pattern |
| 10/01/2002 | US6458734 Dielectric ceramic composition |
| 10/01/2002 | US6458670 Area of multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented |
| 10/01/2002 | US6458608 Alignment check method on printed circuit board |
| 10/01/2002 | US6458431 Embedding particles; photochemistry |
| 10/01/2002 | US6458234 Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate |
| 10/01/2002 | US6457979 Shielded attachment of coaxial RF connector to thick film integrally shielded transmission line on a substrate |
| 10/01/2002 | US6457978 Method and apparatus for arranging cable connectors to allow for easier cable installation |
| 10/01/2002 | US6457632 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy |
| 10/01/2002 | CA2246825C Woven mesh interconnect |
| 09/30/2002 | CA2379454A1 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board |
| 09/26/2002 | WO2002076162A1 A power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
| 09/26/2002 | WO2002076160A1 Transfer printing |
| 09/26/2002 | WO2002076159A1 Laminate comprised of flat conductor elements |
| 09/26/2002 | WO2002075890A1 Methods and systems for reducing clamp voltages in surge protection circuitry |
| 09/26/2002 | WO2002075869A2 An improved patch panel |
| 09/26/2002 | WO2002074841A1 Substrates having conductive surfaces |
| 09/26/2002 | WO2002074715A1 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 09/26/2002 | WO2002074712A1 Chopped strand for glass paper |
| 09/26/2002 | WO2002039796A8 Definable integrated passives for circuitry |
| 09/26/2002 | US20020137867 Obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group- having (meth)acrylate; bonds or adheres well to metal conductor layers |
| 09/26/2002 | US20020137533 System for coordination of TDD transmission bursts within and between cells in a wireless access system and method of operation |
| 09/26/2002 | US20020137404 I-channel surface-mount connector |
| 09/26/2002 | US20020137400 Electrical connector |
| 09/26/2002 | US20020137391 Electronic device |
| 09/26/2002 | US20020137373 Electrical connector having improved grounding terminals |
| 09/26/2002 | US20020137370 Plug connector |
| 09/26/2002 | US20020137256 Method and structure for an organic package with improved BGA life |
| 09/26/2002 | US20020136546 FPC mounting structure |
| 09/26/2002 | US20020136396 Insulation strip for a pots splitter card |
| 09/26/2002 | US20020136170 Wireless access system using selectively adaptable beam forming in TDD frames and method of operation |
| 09/26/2002 | US20020135993 Flexible printed circuit board and foldable cell phone terminal |
| 09/26/2002 | US20020135991 Layered circuit boards and methods of production thereof |
| 09/26/2002 | US20020135985 Over-current protecting apparatus |
| 09/26/2002 | US20020135982 Electronic module having a three dimensional array of integrated circuit packages |
| 09/26/2002 | US20020135727 Display module, flexible wire board and flexible wire board connecting method |
| 09/26/2002 | US20020135519 Electrically conductive patterns, antennas and methods of manufacture |
| 09/26/2002 | US20020135459 Method for the manufacture of printed circuit boards with plated resistors |
| 09/26/2002 | US20020135444 Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same |
| 09/26/2002 | US20020135058 Component built-in module and method of manufacturing the same |
| 09/26/2002 | US20020134919 Optical detector-preamplifier subassembly |
| 09/26/2002 | US20020134685 Coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode, a dielectric layer formed to cover first electrode while leaving a portion of via unfilled, wherein second electrode is formed by a dielectric layer |
| 09/26/2002 | US20020134584 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 09/26/2002 | US20020134583 Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |
| 09/26/2002 | US20020134581 Hybrid capacitor, circuit, and system |
| 09/26/2002 | US20020134579 Method and device for avoiding electrostatic discharge of an electronic device by using electroconductive sheet |
| 09/26/2002 | US20020134578 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |
| 09/26/2002 | US20020134577 Printed circuit board having footprints, circuit module having a printed circuit board, and method of manufacturing a printed circuit board |
| 09/26/2002 | US20020134576 Trace-pad interface for improved signal quality |
| 09/26/2002 | US20020134422 Solar tile and associated method for fabricating the same |
| 09/26/2002 | US20020134259 Uphill screen printing in the manufacturing of microelectronic components |
| 09/26/2002 | US20020133943 Method for manufacturing circuit device |
| 09/26/2002 | US20020133933 Method of attaching a slider with head transducer to a suspension |
| 09/26/2002 | DE10127357C1 Manufacturing system for production of circuit structure on conductive plate uses two lasers with lenses illuminating two separate areas on plate |
| 09/26/2002 | DE10113585A1 Production of flexible thin layer circuits used in the automobile industry comprises preparing a flexible thin layer support, inserting an opening, applying a primary layer on the support, and forming a circuit pattern on the primary layer |
| 09/26/2002 | DE10113361A1 Laminated ceramic green body, useful for preparing, e.g. integrated circuits, comprises layers glued together with an adhesive film deposited on a release liner |
| 09/26/2002 | DE10111256A1 Circuit board, especially for direct engine mounting in motor vehicles, has through holes arranged on board to be optimized for reduction of mechanical vibration loads acting on board |
| 09/26/2002 | DE10110620A1 Elekronische Baugruppe Elekronische assembly |
| 09/26/2002 | DE10107176A1 Oscillator construction method checks actual characteristic parameters of components selected for oscillator tuning circuit before fitting in latter |
| 09/25/2002 | EP1244341A2 Electronic device |
| 09/25/2002 | EP1244177A1 Electrical device and method for connecting a cable to the same |
| 09/25/2002 | EP1244172A2 Wiring board and wiring board module using the same |
| 09/25/2002 | EP1243843A2 LED signal module |
| 09/25/2002 | EP1243569A2 Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate |
| 09/25/2002 | EP1243167A1 Self-aligned coaxial via capacitors |
| 09/25/2002 | EP1243166A1 Flanged terminal pins for dc/dc converters |
| 09/25/2002 | EP1242236A1 Polyolefin composites for printed circuit board and antenna base material |
| 09/25/2002 | EP0783773B1 Surface mounted directional coupler |
| 09/25/2002 | CN2513319Y Midpoint lifting single transmission receiving bus bar structure |
| 09/25/2002 | CN2513227Y Improved structure of overlapping tin ball for ball gate array IC socket |
| 09/25/2002 | CN1371590A Multilayer substrate module and portable wireless terminal |
| 09/25/2002 | CN1371485A Connector arrangement |
| 09/25/2002 | CN1371239A Through hole processing and structure for HF circuit board |
| 09/25/2002 | CN1371238A Integrated module |
| 09/25/2002 | CN1371169A Laminated composite device and its manufacture |
| 09/25/2002 | CN1371126A Semiconductor module and its manufacture |
| 09/25/2002 | CN1370802A Resin composition and its use and production process thereof |
| 09/25/2002 | CN1091402C IPC (chip) temination machine |
| 09/24/2002 | US6456836 Frequency multiplier and wireless device incorporating same |
| 09/24/2002 | US6456757 Optical wavelength division multiplexer/demultiplexer having adhesive overflow channels with dams to achieve tight adhesive bond |
| 09/24/2002 | US6456720 Flexible circuit board assembly for a hearing aid |
| 09/24/2002 | US6456505 Electronic device and attachment structure thereof |
| 09/24/2002 | US6456502 Integrated circuit device/circuit board connection apparatus |
| 09/24/2002 | US6455950 Circuit connection structure of automobile door |
| 09/24/2002 | US6455936 Integrated circuit assembly having interposer with a compliant layer |
| 09/24/2002 | US6455784 Thermosetting polyphenylene ether resins, unsaturated carboxylic acids or anhydrides, triallyl isocyanurate and/or cyanurate, conjugated copolyene block polymers, fillers and fireproofing multilayers for printed circuits |
| 09/24/2002 | US6455783 Multilayer printed wiring board and method for manufacturing the same |
| 09/24/2002 | US6455778 Micro-flex technology in semiconductor packages |
| 09/24/2002 | US6455453 Mgo and an mgal2o4 crystal phase; glass composed of silicon oxide, boron oxide, alkaline earth oxide; high strength; metals such as silver or copper |
| 09/24/2002 | US6455355 Method of mounting an exposed-pad type of semiconductor device over a printed circuit board |
| 09/24/2002 | US6454878 Cladding prior to being stacked; multilayer circuitboard |
| 09/24/2002 | US6454585 Low profile NIC jumper solution using ZIF connector |
| 09/24/2002 | US6454582 Wiring unit |
| 09/24/2002 | US6454574 Electrical card connector |
| 09/24/2002 | US6454573 Board-cable connection structure |
| 09/24/2002 | US6453811 Printing method and printing apparatus |
| 09/19/2002 | WO2002074029A1 Multilayer printed wiring board |
| 09/19/2002 | WO2002074028A1 Method and protective device for mounting a temperature-sensitive electronic component |