| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/17/2002 | US6451932 Resin composites and method for producing the same |
| 09/17/2002 | US6451878 Containing bisphenol s |
| 09/17/2002 | US6451418 Heat conductive resin substrate and semiconductor package |
| 09/17/2002 | US6450837 Electrical connector having surge suppressing device |
| 09/17/2002 | US6450821 Electrical connectors adapted to reduce or prevent adherence of conductive material to contact portions as the connector |
| 09/17/2002 | US6450704 Transparent substrate and hinged optical assembly |
| 09/17/2002 | US6450663 Light-emitting-diode arrangement |
| 09/17/2002 | US6449839 Electrical circuit board and a method for making the same |
| 09/12/2002 | WO2002071818A1 Method for producing flexible wiring board |
| 09/12/2002 | WO2002071695A2 Wireless access using multiple modulation formats according to subscriber type |
| 09/12/2002 | WO2002071111A2 Combined electrical/optical foil lines and circuits |
| 09/12/2002 | WO2002070921A1 Mechatronic transmission control |
| 09/12/2002 | WO2002019430A3 Hybrid substrate with embedded capacitors and methods of manufacture |
| 09/12/2002 | US20020128397 Phenolic resins modified with phosphorus oxychloride (POCl3) of given formula; flame retardant properties and high heat resistance so as not to require additional flame retardants; use as electronic packaging material |
| 09/12/2002 | US20020127924 Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet |
| 09/12/2002 | US20020127903 Electrical connector assembly having improved guiding means |
| 09/12/2002 | US20020127839 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
| 09/12/2002 | US20020127838 Method and apparatus for improved static attitude of head suspension assemblies with electrical interconnects |
| 09/12/2002 | US20020127494 Providing perforate metal core; applying a dielectric polymer onto all exposed surfaces; applying a dielectric polymer; ablating surface of dielectric polymer in a pattern to expose; forming metallized vias; applying photosensitive layer |
| 09/12/2002 | US20020127422 Thermally stable, non-woven, fibrous paper, derivatives thereof, and methods for manufacturing the same |
| 09/12/2002 | US20020127418 Embedding resin and wiring substrate using the same |
| 09/12/2002 | US20020127379 Circuit board and method for manufacturing the same |
| 09/12/2002 | US20020126951 Optical converter flex assemblies |
| 09/12/2002 | US20020126733 Method and apparatus for testing a temperature sensor |
| 09/12/2002 | US20020126465 EMI reduction in power modules through the use of integrated capacitors on the substrate level |
| 09/12/2002 | US20020126464 Noise protection sheet |
| 09/12/2002 | US20020126460 Printed circuit board arrangement |
| 09/12/2002 | US20020126459 Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 09/12/2002 | US20020126458 Connection structure of flexible board arranged in camera |
| 09/12/2002 | US20020126457 Junction circuit for auxiliary device module and auxiliary device module |
| 09/12/2002 | US20020126456 Optical data link |
| 09/12/2002 | US20020125997 Printed circuit with ID tag and method for recognizing of distribution root |
| 09/12/2002 | US20020125983 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
| 09/12/2002 | US20020125868 Apparatus for providing regulated power to an integrated circuit |
| 09/12/2002 | US20020125612 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 09/12/2002 | US20020125574 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics |
| 09/12/2002 | US20020125570 Ball grid array semiconductor package structure to avoid high frequency interference |
| 09/12/2002 | US20020125566 High frequency circuit chip and method of producing the same |
| 09/12/2002 | US20020125563 Power semiconductor module of high isolation strength |
| 09/12/2002 | US20020125561 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
| 09/12/2002 | US20020125558 Semiconductor package with stacked substrates and multiple semiconductor dice |
| 09/12/2002 | US20020125505 Substrate for an electronic power circuit, and an electronic power module using such a substrate |
| 09/12/2002 | US20020125486 Electrode substrate of plasma display panel and method for making the same |
| 09/12/2002 | US20020125322 Imaging module for optical reader comprising refractive diffuser |
| 09/12/2002 | US20020125043 Semiconductor packaging structure, packaging board and inspection method of packaging conditions |
| 09/12/2002 | US20020125042 Method for transforming a substrate with edge contacts into a ball grid array, ball grid array manufactured according to this method, and flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 09/12/2002 | US20020125040 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020125039 Electromagnetic coupler alignment |
| 09/12/2002 | US20020124910 Conductive paste and laminated ceramic electronic component using the same |
| 09/12/2002 | US20020124584 Remote controller for air-conditioning apparatus |
| 09/12/2002 | US20020124398 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020124392 Method for making an article having an embedded electronic device |
| 09/12/2002 | DE10204429A1 Elektronische Komponente und Herstellungsverfahren dafür Electronic component and manufacturing method thereof |
| 09/12/2002 | DE10201045A1 Flexibler LED-Schaltkreis zur Rückseitigen Durchleuchtung Flexible LED circuit for The Back-ray |
| 09/12/2002 | DE10157026A1 Ultraschallendoskop Ultrasonic endoscope |
| 09/12/2002 | DE10120271A1 Multi-layer circuit structure has component(s) on multi-layer arrangement, inductance(s) formed by magnetic core, coil with all windings formed on and/or in multi-layer arrangement |
| 09/12/2002 | DE10111389A1 Soldered connection between tracks on e.g. flexible- and glass substrates, to make position measurement sensor, involves using solder pads of specified shape on each substrate |
| 09/12/2002 | DE10109542A1 Leiterplattenanordnung Printed circuit board assembly |
| 09/12/2002 | DE10104971A1 Kombinierte elektrisch/optische Folienleitungen und -schaltungen Combined electrical / optical film lines and circuits |
| 09/11/2002 | EP1239712A2 Electronic circuit for remote data transmission |
| 09/11/2002 | EP1239710A2 Electronic assembly |
| 09/11/2002 | EP1239539A2 Antenna |
| 09/11/2002 | EP1239515A1 Substrate for electronic power circuit and electronic power module utilizing such a substrate |
| 09/11/2002 | EP1238445A1 System comprising at least two printed circuit boards |
| 09/11/2002 | EP1238444A1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection |
| 09/11/2002 | EP1238431A1 Method and device for interconnecting electronic components in three dimensions |
| 09/11/2002 | EP1238121A1 Surface preparation of a substrate for thin film metallization |
| 09/11/2002 | EP1237782A1 Light emitting diode assembly for use as an aircraft position light |
| 09/11/2002 | EP1183462A4 Integrated powertrain control system for large engines |
| 09/11/2002 | EP1163389A4 Visible and fluorescent dye containing laminate materials |
| 09/11/2002 | CN2511101Y Apparatus for stopping electromagnetic wave interference of circuit board |
| 09/11/2002 | CN2511093Y Improved thin film circuit board wire jumper structure |
| 09/11/2002 | CN2510992Y Slotted seat structure for grid-array packaged element |
| 09/11/2002 | CN1369107A Ion reflection comprising flexible printed circuit board |
| 09/11/2002 | CN1368904A Method of forming thin metal layer on insulating substrate |
| 09/11/2002 | CN1368838A Base plate connecting device |
| 09/11/2002 | CN1368770A Discharge gap device |
| 09/11/2002 | CN1368757A Semiconductor device and method for manufacture semiconductor equipment |
| 09/11/2002 | CN1090892C Method for mfg. of double-side conductive metal foil type circuit board and products thereof |
| 09/11/2002 | CN1090767C Photoenhanced diffusion patterning for organic polymer films |
| 09/10/2002 | US6449308 High-speed digital distribution system |
| 09/10/2002 | US6449168 Circuit board and a method for manufacturing the same |
| 09/10/2002 | US6449166 High capacity memory module with higher density and improved manufacturability |
| 09/10/2002 | US6449158 Method and apparatus for securing an electronic power device to a heat spreader |
| 09/10/2002 | US6448873 LC filter with suspended printed inductor and compensating interdigital capacitor |
| 09/10/2002 | US6448664 Ball grid array chip packages having improved testing and stacking characteristics |
| 09/10/2002 | US6448647 BGA package substrate |
| 09/10/2002 | US6448646 Semiconductor device-mounting construction and inspection method therefor |
| 09/10/2002 | US6448640 Ball array layout in chip assembly |
| 09/10/2002 | US6448628 Chip decoupling capacitor |
| 09/10/2002 | US6448508 Electrical component with a flexible strip of connecting conductors |
| 09/10/2002 | US6448506 Semiconductor package and circuit board for making the package |
| 09/10/2002 | US6448504 Printed circuit board and semiconductor package using the same |
| 09/10/2002 | US6448491 Electromagnetic interference suppressing body having low electromagnetic transparency and reflection, and electronic device having the same |
| 09/10/2002 | US6448195 Composition for ceramic substrate and ceramic circuit component |
| 09/10/2002 | US6448184 Formation of diamond particle interconnects |
| 09/10/2002 | US6448106 Modules with pins and methods for making modules with pins |
| 09/10/2002 | US6447923 Layer of high bonding strength on the surface of a highly heat conductive, mechanically strong si3n4 ceramic; metallizing layer containing 0.01 to 20% silicon |
| 09/10/2002 | US6447915 Small variation in thickness between layers; polysulfone thermoplastic resin, epoxy or phenoxy resin having both a bisphenol s skeleton and a biphenyl skeleton, multifunctional epoxy resin, epoxy curing agent; coating a copper foil |
| 09/10/2002 | US6447888 Ceramic wiring board |