Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2003
11/06/2003US20030205406 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
11/06/2003US20030205398 Electrical junction box for a vehicle
11/06/2003US20030205397 Electrical junction box for a vehicle
11/06/2003DE20313744U1 Electronic input output module for use in various system housings have multiple parallel printed circuit boards that are interconnected
11/06/2003CA2518614A1 Manufacturing method for a wireless communication device and manufacturing apparatus
11/05/2003EP1359792A1 Substrate with non-visible electrically conducting layers
11/05/2003EP1359676A1 Portable telephone
11/05/2003EP1359662A1 Drive system with converter control circuit for low voltage 3-phase motor
11/05/2003EP1359627A2 Light emitting module
11/05/2003EP1359612A2 Methods of manufacturing a hybrid integrated circuit device
11/05/2003EP1359441A1 Optical-electrical wiring board, mounted board, and method of manufacturing optical-electrical wiring board
11/05/2003EP1359194A1 Polytetrafluoroethylene aqueous dispersion composition
11/05/2003EP1359175A1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
11/05/2003EP1359133A1 Porous ceramic and method for preparation thereof, and microstrip substrate
11/05/2003EP1358675A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
11/05/2003EP1358124A2 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
11/05/2003EP1163825B1 Method for producing circuit arrangements
11/05/2003EP0934687B1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
11/05/2003EP0895486B1 Grafted thermoplastic elastomer barrier layer
11/05/2003CN2585527Y Module power source printed circuit board
11/05/2003CN1454402A Self-aligned transition between a transmission line and a module
11/05/2003CN1454341A Connector receptacle
11/05/2003CN1454273A Heat-resistant fibrous paper
11/05/2003CN1454240A 可固化树脂组合物 The curable resin composition
11/05/2003CN1454041A Production process and product of film-like flexible circuit board
11/05/2003CN1454039A Wiring plate, electronic device and mounting method of electronic elements
11/05/2003CN1454038A Adjustable open-circuit guide circuit
11/05/2003CN1453869A 半导体存储器模块 Semiconductor memory module
11/05/2003CN1453859A Mixed integrated circuit apparatus
11/05/2003CN1453857A Method for producing mixed integrated circuit apparatus
11/05/2003CN1453771A Optical pick up apparatus
11/05/2003CN1126973C Display device
11/05/2003CN1126614C Rolled copper foil and producing method thereof
11/04/2003US6643135 On board mounting electronic apparatus and on board mounting electric power supply
11/04/2003US6643108 Controller system for pool and/or spa
11/04/2003US6642808 High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic
11/04/2003US6642613 Techniques for joining an opto-electronic module to a semiconductor package
11/04/2003US6642554 Memory module structure
11/04/2003US6642478 Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board
11/04/2003US6642460 Switch assembly employing an external customizing printed circuit board
11/04/2003US6642449 Electronic component and manufacturing method thereof
11/04/2003US6642282 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board
11/04/2003US6642167 Oxides of barium, titanium, zirconium and/or zinc, silicon, copper, vanadium, tantalum, bismuth, manganese or group IA metals, used in high frequency circuits
11/04/2003US6641942 Solid-state energy storage module employing integrated interconnect board
11/04/2003US6641898 Printed wiring board and method of manufacturing a printed wiring board
11/04/2003US6641865 Method for selectively applying solder mask
11/04/2003US6641860 Method of manufacturing printed circuit boards
11/04/2003US6641440 Electrical connector with power module
11/04/2003US6641430 Contact structure and production method thereof and probe contact assembly using same
11/04/2003US6641411 Low cost high speed connector
11/04/2003US6641407 Conductor interconnect structure connecting circuit boards
11/04/2003US6641406 Flexible connector for high density circuit applications
11/04/2003US6640435 Methods for trimming electrical parameters in an electrical circuit
11/04/2003US6640430 Method of manufacturing a printed circuit board
11/04/2003US6640429 Method of making multilayer circuit board
10/2003
10/30/2003WO2003090317A1 Completely integrated ethernet connector
10/30/2003WO2003090313A1 Rf system concept for vehicular radar having several beams
10/30/2003WO2003090278A2 Dual-sided heat removal system
10/30/2003WO2003090277A1 Circuit board, process for producing the same and power module
10/30/2003WO2003090183A1 Electrotechnical kit
10/30/2003WO2003089991A2 Photocurable compositions containing reactive particles
10/30/2003WO2003067906A3 High-speed router with single backplane distributing both power and signaling
10/30/2003WO2003062866A3 Flex board interface to an optical module
10/30/2003WO2003048674A3 Guided munitions electronics package and method
10/30/2003WO2003022581A3 Inkjet deposition apparatus and method
10/30/2003WO2002095801A3 Improved connection assembly for integrated circuit sensors
10/30/2003WO2002071111A3 Combined electrical/optical foil lines and circuits
10/30/2003US20030203683 Probe card
10/30/2003US20030203317 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same
10/30/2003US20030203175 Greensheet carriers and processing thereof
10/30/2003US20030203174 Low signal loss bonding ply for multilayer circuit boards
10/30/2003US20030203170 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead
10/30/2003US20030203169 Ceramic structure using a support sheet
10/30/2003US20030202454 Optical pickup device
10/30/2003US20030202373 Semiconductor package with a controlled impedance bus and method of forming same
10/30/2003US20030202372 Semiconductor memory module
10/30/2003US20030202333 Arrangement consisting of a circuit carrier and a printed circuit board or a printed circuit board assembly
10/30/2003US20030202329 Expansion board apparatus and removing method
10/30/2003US20030202328 Wrap- around cooling arrangement for printed circuit board
10/30/2003US20030202314 Printed circuit board capacitor structure and method
10/30/2003US20030202312 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
10/30/2003US20030202306 Heat sink for semiconductor die employing phase change cooling
10/30/2003US20030202281 Electromagnetic wave shielded write and read wires on a support for a magnetic media drive
10/30/2003US20030202126 Tuner that suppresses outside radiation of inside oscillated signal
10/30/2003US20030201989 Signal transmission system
10/30/2003US20030201851 High frequency apparatus for transmitting or processing high frequency signal, and method for manufactruing the high frequency apparatus
10/30/2003US20030201545 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
10/30/2003US20030201533 Alternating electroconductivity patterns, dielectric sheets; positioning apertures
10/30/2003US20030201530 Heat and stress resistance; copper oxide dispersed in copper matrix; aluminum nitride substrate; heat dissipation
10/30/2003US20030201528 Flip-chip die and flip-chip package substrate
10/30/2003US20030201427 Press fitting concave and convex shapes
10/30/2003US20030201310 Packaging method using lead-free solder
10/30/2003US20030201258 Method for producing a trench structure in a polymer substrate
10/30/2003US20030201123 Electrical connector pad assembly for printed circuit board
10/30/2003US20030201122 Flip-chip package substrate
10/30/2003US20030200647 Pattern forming method, method of making microdevice, method of making thin-film magnetic head, method of making magnetic head slider, method of making magnetic head apparatus, and method of making magnetic recording and reproducing apparatus
10/30/2003DE10030154C2 Elektronisches Gerät zum Anschluss von Anzeige-Instrumenten der Instrumententafel eines Kraftfahrzeuges Electronic device for connection of display instruments of the instrument panel of a motor vehicle
10/29/2003EP1357775A1 Circuit board and its manufacturing method
10/29/2003EP1357774A1 Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure
10/29/2003EP1357771A1 Electronic parts
1 ... 619 620 621 622 623 624 625 626 627 628 629 630 631 632 633 634 635 636 637 638 639 ... 986