Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2003
11/13/2003US20030210527 Heat pipe circuit board
11/13/2003US20030210113 Transmission line, resonator, filter, duplexer, and communication apparatus
11/13/2003US20030210058 Electrical print resolution test die
11/13/2003US20030209977 Thermal management in electronic displays
11/13/2003US20030209954 Electronic component and method for forming substrate electrode of the same
11/13/2003US20030209813 Semiconductor device and manufacturing method of the same
11/13/2003US20030209806 Method for manufacturing semiconductor device
11/13/2003US20030209796 Manufacturing method of multilayer substrate
11/13/2003US20030209794 Card manufacturing technique and resulting card
11/13/2003US20030209792 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof
11/13/2003US20030209790 Semiconductor memory module
11/13/2003US20030209732 Apparatus for routing signals
11/13/2003US20030209697 Water-soluble electrically conductive composition, modifications, and applications thereof
11/13/2003DE20220468U1 Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region
11/13/2003DE20211438U1 Illumination element, e.g. for lighting passages, floors in hotels, has board fitted with light emitting diodes and divided into segments pivotably connected together, each carrying at least one LED
11/13/2003DE10225465C1 Ribbon cable conductors contacting method with incorporation of optical process control for ensuring contacting quality
11/12/2003EP1361034A2 Chip card and method of manufacturing a chip card
11/12/2003EP1360885A1 Element for electromagnetic shielding and method for manufacturing thereof
11/12/2003EP1360882A1 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
11/12/2003EP1360881A1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures
11/12/2003EP1360723A2 High performance silicon contact for flip chip
11/12/2003EP1360720A2 Process for the manufacture of printed circuit boards with plated resistors
11/12/2003EP1360171A1 Novolak cyanate-based prepolymer compositions
11/12/2003EP1360067A1 Lightweight circuit board with conductive constraining cores
11/12/2003EP1007308B1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/12/2003EP0972432B1 Method of arranging signal and destination pads to provide multiple signal/designation connection combinations
11/12/2003CN1456035A Circuit board and production method therefor
11/12/2003CN1456032A Method for generating conductive structure on non-plane surface and use thereof
11/12/2003CN1456031A Circuit board and production method thereof
11/12/2003CN1455933A Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
11/12/2003CN1455506A Drive system for AC device of low-voltage three-phase AC motor
11/12/2003CN1455288A Light-emitting assembly
11/12/2003CN1127782C Controlling heat expansion of electrical couplings
11/12/2003CN1127780C High density electrical connector
11/12/2003CN1127643C Electronic controller
11/12/2003CN1127456C Glass and ceramic substrate using the same
11/11/2003USRE38310 Optical circuit on printed circuit board
11/11/2003US6647311 Coupler array to measure conductor layer misalignment
11/11/2003US6647036 Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
11/11/2003US6646890 Mounting of mezzanine circuit boards to a base board
11/11/2003US6646888 Low inductance multiple resistor EC capacitor pad
11/11/2003US6646886 Power connection structure
11/11/2003US6646885 Enhanced electronic card structure
11/11/2003US6646884 Sandwich-structured intelligent power module
11/11/2003US6646862 Dynamic circuit interface
11/11/2003US6646708 Electrooptic device, manufacturing method therefor with visual confirmation of compression bonding to terminals and electronic apparatus
11/11/2003US6646622 Combination instrument
11/11/2003US6646609 Antenna with an integral RF circuit, antenna module incorporating the same, and communication apparatus incorporating the same
11/11/2003US6646608 Center electrode assembly, nonreciprocal circuit device, communication device, and method of producing the center electrode assembly
11/11/2003US6646521 Connection for conducting high frequency signal between a circuit and a discrete electric component
11/11/2003US6646516 Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer, communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method
11/11/2003US6646349 Ball grid array semiconductor package
11/11/2003US6646338 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
11/11/2003US6646331 Semiconductor device and semiconductor module
11/11/2003US6646286 Semiconductor substrate-based BGA interconnection
11/11/2003US6646064 Reacting epoxy resin with p-containing dihydric phenol or naphthol
11/11/2003US6645631 Flame retardant phosphorus element-containing epoxy resin compositions
11/11/2003US6645630 Phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having particles,
11/11/2003US6645012 Card edge connector comprising a housing and a plurality of contacts
11/11/2003US6644980 Connector structure, female connector, and male connector
11/11/2003US6644979 Backplane structure capable of being mounted with two interface cards
11/11/2003US6643916 Method to assemble a capacitor plate for substrate components
11/06/2003WO2003092347A1 Electromagnetically shielded circuit device and shielding method therefor
11/06/2003WO2003092344A1 Production of via hole in flexible circuit printable board
11/06/2003WO2003092343A1 Connection structure between printed boards
11/06/2003WO2003092342A1 Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
11/06/2003WO2003092174A2 Manufacturing method for a wireless communication device and manufacturing apparatus
11/06/2003WO2003092121A2 Three dimensional, high speed back-panel interconnection system
11/06/2003WO2003092045A2 Method for producing an electrical circuit
11/06/2003WO2003090987A1 Method of manufacturing ceramic laminated body
11/06/2003WO2003073506A3 A modular integrated circuit chip carrier
11/06/2003WO2003067943A3 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/06/2003WO2003043085A3 Electronic device carrier adapted for transmitting high frequency signals
11/06/2003WO2003029166A3 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
11/06/2003WO2003028085A3 Method for producing a ceramic substrate
11/06/2003WO2003022019A3 Wireless suspension design to accommodate multiple drive designs
11/06/2003WO2003001594A3 High-voltage module and method for producing the same
11/06/2003WO2002054421A3 Multiple tier array capacitor and methods of fabrication therefor
11/06/2003US20030208648 System and method for introducing proprietary signals into a standard backplane via physical separation
11/06/2003US20030207745 Multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising
11/06/2003US20030207627 Contact for error resistant coupling of electrical signals
11/06/2003US20030207623 High frequency electrical connector
11/06/2003US20030207566 High performance silicon contact for flip chip
11/06/2003US20030207546 Mother substrate, substrate element, and method for manufacturing the same
11/06/2003US20030207492 Semiconductor device and method for fabricating the same
11/06/2003US20030207211 Process for massively producing tape type flexible printed circuits
11/06/2003US20030207135 Dispersion for electrodeposition which has excellent shelf life and can form thin, high dielectric constant films, as well as a high dielectric constant film formed from the aqueous dispersion and electronic parts provided with the high
11/06/2003US20030206405 Circuit package for electronic systems
11/06/2003US20030206399 Monolithic electrical system and heat sink assembly
11/06/2003US20030206392 Switching device for controlling large amount of current
11/06/2003US20030206388 Universial energy conditioning interposer with circuit architecture
11/06/2003US20030206376 Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication
11/06/2003US20030206160 Circuit board with EMI suppression
11/06/2003US20030206084 Radio frequency circuit module on multi-layer substrate
11/06/2003US20030205837 Device comprising components vertically stacked thereon and method for manufacturing the same
11/06/2003US20030205826 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
11/06/2003US20030205779 Semiconductor device system with impedance matching of control signals
11/06/2003US20030205610 Method of connecting circuit boards
11/06/2003US20030205551 Method for the manufacture of printed circuit boards with plated resistors
11/06/2003US20030205407 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
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