| Patents for H05K 1 - Printed circuits (98,583) |
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| 11/20/2003 | US20030215620 Member having metallic layer, its manufacturing method and its application |
| 11/20/2003 | US20030215619 Metal core substrate and process for manufacturing same |
| 11/20/2003 | US20030215606 Dispersible dielectric particles and methods of forming the same |
| 11/20/2003 | US20030215568 Positioning an extruder in line with the hole, extruding and depositing balls of molten electroconductive material into the apertures; materials handling |
| 11/20/2003 | US20030215566 Stuffing through holes on the dielectric layer with microstructure or nanostructure electroconductive paste, to connect and conduct each other, forming accurate integrated circuits |
| 11/20/2003 | US20030215565 Method and apparatus for the formation of laminated circuit having passive components therein |
| 11/20/2003 | US20030214860 Circuit board having traces with distinct transmission impedances |
| 11/20/2003 | US20030214802 Signal transmission structure with an air dielectric |
| 11/20/2003 | US20030214800 System and method for processor power delivery and thermal management |
| 11/20/2003 | US20030214797 Multilayer printed circuit board |
| 11/20/2003 | US20030214796 High frequency module mounting structure in which solder is prevented from peeling |
| 11/20/2003 | US20030214795 Electronic component with bump electrodes, and manufacturing method thereof |
| 11/20/2003 | US20030214793 Ceramic electronic component and method for making the same |
| 11/20/2003 | US20030214792 Multi-feature-size electronic structures |
| 11/20/2003 | US20030214776 Capacitors having a high energy density |
| 11/20/2003 | US20030214558 Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly |
| 11/20/2003 | US20030214370 RF filtered DC interconnect |
| 11/20/2003 | US20030214030 Breaking out signals from an integrated circuit footprint |
| 11/20/2003 | US20030213988 Semiconductor memory module |
| 11/20/2003 | US20030213963 High speed electronic interconnection using a detachable substrate |
| 11/20/2003 | US20030213847 Imaging module for optical reader comprising refractive diffuser |
| 11/20/2003 | US20030213831 Method of connecting circuit boards |
| 11/20/2003 | US20030213770 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure |
| 11/20/2003 | US20030213619 Ground discontinuity improvement in RF device matching |
| 11/20/2003 | US20030213618 Output stage layout for minimum cross coupling between channels |
| 11/20/2003 | US20030213615 Wiring board, fabrication method of wiring board, and semiconductor device |
| 11/20/2003 | US20030213614 A porous receiving layer is permeated with the fine conductive particles and organometallic compounds from the deposited lamination to provide interlayer connections; electroconductivity |
| 11/20/2003 | US20030213121 Solid-state energy storage module employing integrated interconnect board |
| 11/20/2003 | DE20314298U1 LED assembly has several circuit boards each with several mountings for LEDs, each circuit board being mounted on baseboard with electric connections |
| 11/20/2003 | DE20312116U1 Arc discharge protection system for high-voltage electrical equipment has electrode disk, voltage switching circuit, rectifier and trigger circuit |
| 11/20/2003 | CA2429245A1 Card-edge connector and card member |
| 11/19/2003 | EP1363483A2 Multilayer printed circuit board laminate and process for manufacturing the same |
| 11/19/2003 | EP1363482A1 Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| 11/19/2003 | EP1363481A2 Heat pipe circuit board |
| 11/19/2003 | EP1363327A2 High speed electronic interconnection using a detachable substrate |
| 11/19/2003 | EP1363325A1 Member for electronic circuit, method for manufacturing the member, and electronic part |
| 11/19/2003 | EP1362502A1 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement |
| 11/19/2003 | EP1362501A1 Electronic device and method of manufacturing the same |
| 11/19/2003 | EP1362500A1 An electronic device and a circuit arrangement |
| 11/19/2003 | EP1257693B1 Composite copper foil and manufacturing method thereof |
| 11/19/2003 | CN1457629A Arrangement with integrated circuit mounted on bearing means and power supply module arrangement |
| 11/19/2003 | CN1128469C Method for connecting electronic device with flexible circuit carrier and flexible electronic carrier |
| 11/19/2003 | CN1128452C Resistance wiring board and method for manufacturing same |
| 11/18/2003 | US6650844 Interconnecting circuit boards using free space optics |
| 11/18/2003 | US6650548 Apparatus, method and system for interfacing electronic circuits |
| 11/18/2003 | US6650547 Rotary structure for relaying signals |
| 11/18/2003 | US6650546 Chip component assembly |
| 11/18/2003 | US6650525 Component carrier |
| 11/18/2003 | US6650457 Rearview mirror constructed for efficient assembly |
| 11/18/2003 | US6650456 Ultra-high frequency interconnection using micromachined substrates |
| 11/18/2003 | US6650203 Filter arrangement |
| 11/18/2003 | US6650087 Vehicle having an electrical connection box and electrical connection box for use in the vehicle |
| 11/18/2003 | US6650080 Actuating mechanism for setting a manipulatable member in at least two degrees of freedom |
| 11/18/2003 | US6650022 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system |
| 11/18/2003 | US6650016 Flip chips |
| 11/18/2003 | US6649932 Electrical print resolution test die |
| 11/18/2003 | US6649930 Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same |
| 11/18/2003 | US6649831 I-channel surface-mount connector with extended flanges |
| 11/18/2003 | US6649550 Glass ceramics dielectric material and sintered glass ceramics |
| 11/18/2003 | US6649516 Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions |
| 11/18/2003 | US6649506 Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
| 11/18/2003 | US6649444 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 11/18/2003 | US6649274 Organic adhesive interface thereby facilitating peeling of the carrier foil |
| 11/18/2003 | US6649265 Carbon-based metal composite material, method for preparation thereof and use thereof |
| 11/18/2003 | US6648693 Guide rail and cam system with integrated lock-down and kick-out spring for SMT connector for pluggable modules |
| 11/18/2003 | US6648652 Signal transmission connector and cable employing same |
| 11/18/2003 | US6648478 Vehicle mirror system with vehicle heading sensor assembly |
| 11/18/2003 | US6648453 Ink jet printhead chip with predetermined micro-electromechanical systems height |
| 11/18/2003 | US6648445 Terminals for circuit board |
| 11/18/2003 | US6648208 Method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor |
| 11/18/2003 | US6647868 Position adjustment in laser-assisted pressing |
| 11/18/2003 | US6647845 Sheet retainer for punching ceramic green sheet and punching apparatus |
| 11/18/2003 | US6647620 Method of making center bond flip chip semiconductor carrier |
| 11/18/2003 | US6647619 Positioning arrangement and method |
| 11/18/2003 | CA2281857C Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer, communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method |
| 11/13/2003 | WO2003094587A1 Improvements relating to heatsinks |
| 11/13/2003 | WO2003094586A1 Circuit board with smd component and cooling body |
| 11/13/2003 | WO2003094585A1 Cooled power switching device |
| 11/13/2003 | WO2003094584A1 Method for creating a trench structure in a polymer substrate |
| 11/13/2003 | WO2003094583A1 Circuit board with contact surface elements for the production of an electrical connection |
| 11/13/2003 | WO2003094582A2 A system and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 11/13/2003 | WO2003093840A1 Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board |
| 11/13/2003 | WO2003093576A1 Heat-resistant synthetic fiber sheet |
| 11/13/2003 | WO2003039974A3 Package enclosing multiple packaged chips |
| 11/13/2003 | WO2002101438A3 Attenuator and conditioner |
| 11/13/2003 | WO2001059885A8 Compliant pin and its method of manufacture |
| 11/13/2003 | US20030212836 Customer replacement unit monitor programming cable |
| 11/13/2003 | US20030212245 Heating, compression; electronics |
| 11/13/2003 | US20030211873 Water-proof collapsible cellular terminal apparatus |
| 11/13/2003 | US20030211797 Multilayer dielectrics and electroconductive yarns with cavities between; circuit carrier |
| 11/13/2003 | US20030211792 Crosslinked epoxy resin |
| 11/13/2003 | US20030211759 Adapter for surface mount devices to through hole applications |
| 11/13/2003 | US20030211406 Process for thick film circuit patterning |
| 11/13/2003 | US20030211345 Electronics |
| 11/13/2003 | US20030211328 Blend of epoxy resin, curing agent, phosphate and aluminum hydroxide |
| 11/13/2003 | US20030211303 Multilayer lamination; blend of polyurethane and bromostyrene polymer |
| 11/13/2003 | US20030211302 High foaming ratio, thickness |
| 11/13/2003 | US20030211246 Printed circuits; forming patterns; multilayer |
| 11/13/2003 | US20030211234 Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
| 11/13/2003 | US20030210869 Optical fiber systems |