Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
12/2003
12/04/2003WO2003030186A3 Nickel coated copper as electrodes for embedded passive devices
12/04/2003WO2003028119A3 Light emitting diode with integrated heat dissipater
12/04/2003WO2002095801B1 Improved connection assembly for integrated circuit sensors
12/04/2003US20030224923 High thermal expansion glass and tape composition
12/04/2003US20030224921 Use of zeolites in preparing low temperature ceramics
12/04/2003US20030224663 Apparatus for providing controlled impedance in an electrical contact
12/04/2003US20030224631 Interconnecting structure for electrically connecting two printed circuit boards
12/04/2003US20030224630 Actuatable connector system
12/04/2003US20030224629 Integrated circuit socket with capacitors and shunts
12/04/2003US20030224568 Method of fabricating capacitor
12/04/2003US20030224555 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
12/04/2003US20030224546 Method and apparatus for reducing noise in electrical power supplied to a semiconductor
12/04/2003US20030224266 High-precision that can perform the design, testing, and formation of wiring easily and at high speed, can reduce the cost involved in the formation and design, can accommodate further miniaturization, and can cope with design changes.
12/04/2003US20030224199 Metal/ceramic bonding article and method for producing same
12/04/2003US20030224187 Surface of the polyimide film contacting with the metal seed layer is modified so as to have a thickness of not more than 200 Angstrom; copper plated layer over seed layer
12/04/2003US20030224177 Epoxy resin composition
12/04/2003US20030224176 High nitrogen containing triazine-phenol-aldehyde condensate
12/04/2003US20030224119 Method of preparing a higher solids phenolic resin
12/04/2003US20030223352 Reduction of forward crosstalk using time division multiplexing
12/04/2003US20030223210 Modular LED circuit board
12/04/2003US20030223208 Power plane region of printed circuit board with power blocks having an arc-shaped boundary
12/04/2003US20030223206 Connection structure for radio frequency circuit that exceeds in RF characteristics
12/04/2003US20030223205 Method of producing an electronic device and electronic device
12/04/2003US20030223204 Electronic apparatus, printed wiring board, and connector fixing method
12/04/2003US20030223203 Method of mounting a butterfly package on a PCB
12/04/2003US20030223202 Electronic circuit board
12/04/2003US20030223198 Stacked device assembly
12/04/2003US20030222727 Non-uniform transmission line and method of fabricating the same
12/04/2003US20030222667 Probe card assembly
12/04/2003US20030222379 Method of manufacturing metal clad laminate for printed circuit board
12/04/2003US20030222343 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
12/04/2003US20030222340 Enhancement of current-carrying capacity of a multilayer circuit board
12/04/2003US20030222337 Die connected with integrated circuit component for electrical signal passing therebetween
12/04/2003US20030222335 Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production
12/04/2003US20030222314 High capacitance package substrate
12/04/2003US20030222126 Method of manufacturing semiconductor device
12/04/2003US20030222051 Process for forming printed circuit film used in waterproof keyboard
12/04/2003US20030221865 Printed circuit board (PCB) which minimizes cross talk and reflections and method therefor
12/04/2003US20030221864 Printed board assembly and method of its manufacture
12/04/2003US20030221863 Data bus with separate matched line impedances and method of matching line impedances
12/04/2003US20030221853 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
12/04/2003US20030221314 Method for manufacturing double-sided circuit board
12/04/2003US20030221313 Method for making stacked integrated circuits (ICs) using prepackaged parts
12/04/2003DE20314664U1 Signaling lamp for road vehicle, incorporates array of LED's with curved top surfaces fitting into lenses which refract light rays to form beams with small angle of divergence
12/04/2003CA2487294A1 Method for patterning carbon nanotube coating and carbon nanotube wiring
12/04/2003CA2483297A1 Compliant component for supporting electrical interface component
12/03/2003EP1367879A2 Electrical device
12/03/2003EP1367876A1 Wiring carrier including manufacturing process and electrical device equipped with the same
12/03/2003EP1367874A2 Printed circuit board having permanent solder mask
12/03/2003EP1367871A2 Wiring forming system and wiring forming method for forming wiring on wiring board
12/03/2003EP1367870A1 Holding device for light emitting diode for vehicle signaling system and method of making the same
12/03/2003EP1367869A2 Radio frequency circuit connection structure
12/03/2003EP1367713A2 Electric module
12/03/2003EP1367533A2 Uncovering device for uncovering of electrically conductive materials in non-conductive supports and method for controlling the uncovering device
12/03/2003EP1366313A1 Mechatronic transmission control
12/03/2003CN1460397A High-frequency module
12/03/2003CN1460312A Demountable clamping for land grid array connectors
12/03/2003CN1460308A 微波电路 Microwave Circuits
12/03/2003CN1459808A Plated terminals
12/03/2003CN1459427A Dielectric chinaware
12/03/2003CN1459352A Ink jet printer head and method and device for welding flexible printed circuit wire of printer head
12/03/2003CN1129991C Socket for pin grid array component and actuating mechanism thereof
12/03/2003CN1129981C Improved connector scheme for power pod power delivery system
12/03/2003CN1129744C Air conditioner
12/02/2003US6658530 High-performance memory module
12/02/2003US6658296 Implantable cardioverter defibrillator having an articulated flexible circuit element and method of manufacturing
12/02/2003US6657871 Multiple channel modules and bus systems using same
12/02/2003US6657866 Electronics assembly with improved heatsink configuration
12/02/2003US6657849 Formation of an embedded capacitor plane using a thin dielectric
12/02/2003US6657767 Rearview mirror assembly construction
12/02/2003US6657707 Metallurgical inspection and/or analysis of flip-chip pads and interfaces
12/02/2003US6657606 Liquid crystal display device having a flexible circuit board
12/02/2003US6657530 Multi-layered inductance element
12/02/2003US6657450 Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes
12/02/2003US6657318 Semiconductor integrated circuit device and method for mounting circuit blocks in semiconductor integrated circuit device
12/02/2003US6657295 Multilayer interconnect board and multilayer semiconductor device
12/02/2003US6657292 Package board for multiple-pin ball grid array package, multiple-pin ball grid array package, and semiconductor device
12/02/2003US6657275 Pad and via placement design for land side capacitors
12/02/2003US6657137 Connection structure and connection method of for connecting two circuit boards
12/02/2003US6657136 Termination board for mounting on circuit board
12/02/2003US6657135 Connection structure and electronic circuit board
12/02/2003US6657134 Stacked ball grid array
12/02/2003US6657133 Ball grid array chip capacitor structure
12/02/2003US6656864 Dielectric ceramics and dielectric resonator
12/02/2003US6656627 Battery pack
12/02/2003US6655286 Method for preventing distortions in a flexibly transferred feature pattern
12/02/2003US6655217 Transmitter
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
12/02/2003US6655017 Manufacturing unit with flexible circuit bonded to two separate base plates eliminates bending of rigid plate
12/02/2003CA2293110C Conductive elastomer interconnect
11/2003
11/27/2003WO2003098775A1 Improvements to a power backup device for cordless telephones
11/27/2003WO2003098745A1 Method of attaching circuitry to a modular jack connector using electrically conductive paste
11/27/2003WO2003098744A1 Optically transparent elastomeric interconnects and method of using same
11/27/2003WO2003098304A1 Plug-in type optical module
11/27/2003WO2003097732A1 Dispersible dielectric barium titanate-based particles, methods of their formation, and composite layers comprising them
11/27/2003WO2003097725A1 Polyimide film and method for production thereof, and polyimide/metal laminate using polyimide
11/27/2003WO2003097557A1 Method for producing a ceramic-copper composite substrate
11/27/2003WO2003062311A3 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
11/27/2003WO2003041463A3 Method and apparatus for emi shielding
11/27/2003WO2002078359A3 Insulation strip for a pots splitter card
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