Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
11/2003
11/27/2003US20030220185 Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate
11/27/2003US20030220129 Mobile phone with dual PCB structure
11/27/2003US20030220012 Compliant component for supporting electrical interface component
11/27/2003US20030219956 Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
11/27/2003US20030219927 Solder balls and conductive wires for a semiconductor package, and an improved manufacturing method, and evaporation method therefor
11/27/2003US20030219608 Metal transfer sheet, producing method thereof, and producing method of ceramic condenser
11/27/2003US20030219588 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
11/27/2003US20030218878 Modular mounting arrangement and method for light emitting diodes
11/27/2003US20030218871 Accuracy during temperature variations; laminate of dielectric and metal wire; controlling expansion
11/27/2003US20030218870 Low temperature co-fired ceramic with improved shrinkage control
11/27/2003US20030218851 Voltage variable material for direct application and devices employing same
11/27/2003US20030218515 Radio frequency circuit module on multi-layer substrate
11/27/2003US20030218261 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products
11/27/2003US20030218238 Semiconductor device and electronic device
11/27/2003US20030218235 Surface mount solder method and apparatus for decoupling capacitance and process of making
11/27/2003US20030218233 Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit
11/27/2003US20030218190 Electronic device and method of manufacturing the same, and electronic instrument
11/27/2003US20030218165 Organic semiconductor device and method
11/27/2003US20030217457 Method for preparing composite materials of a positive temperature coefficient thermistor
11/27/2003DE20314013U1 Fahrzeug mit einem elektrischen Bordnetz und einem Drucktaster Vehicle with an electric system and a push button
11/27/2003DE10213547C1 Blister pack, for tablets/capsules, has a carrier plate for the pack with a covering layer incorporating the conductor paths to the separate pockets to register the removal from a pocket
11/26/2003EP1365638A2 Process for improving the electrical conductivity and the corrosion and wear resistance of a flexible circuit
11/26/2003EP1365481A2 Card-edge connector and card member
11/26/2003EP1365451A1 Module component
11/26/2003EP1364921A1 Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate
11/26/2003EP1364920A1 Dielectric ceramic
11/26/2003EP1364788A2 Ink jet print head and method and apparatus for bonding flexible printed circuit cable for ink jet print head
11/26/2003EP1364566A2 Electronic component, component mounting equipment, and component mounting method
11/26/2003EP1364562A1 Vacuum deposited circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same
11/26/2003EP1364403A2 High-density flip-chip interconnect
11/26/2003EP1364401A2 Microelectronic package having bumpless laminated interconnection layer
11/26/2003EP1364220A2 Electronic pressure sensitive transducer apparatus and method for manufacturing same
11/26/2003EP1363922A2 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
11/26/2003EP1363811A1 Method for producing a moulded component comprising an integrated conductor strip and moulded component
11/26/2003EP1264683B1 Copper-clad laminate
11/26/2003CN2588574Y 电子卡连接器 Electronic card connector
11/26/2003CN1459219A Flexible printed wiring board
11/26/2003CN1459117A Method for producing electronic parts, and member for production thereof
11/26/2003CN1458963A Poly ester synthetic (phenyl ether), polyester film, laminates sheet, printed wiring board, and maltilayer printed wiring board
11/26/2003CN1458913A Porous ceramic and method for prepartion thereof and microstrip substrate
11/26/2003CN1458911A Chopped strand for glass paper
11/26/2003CN1458873A Machining device and machining method
11/26/2003CN1458815A Metal core base plate and its producing process
11/26/2003CN1129291C Cover body connecting mechanism
11/26/2003CN1129206C Connector
11/26/2003CN1129154C Machine operation panel
11/26/2003CN1129146C Method for making resistance element substrate used in variohm
11/25/2003US6654257 Noise protection sheet
11/25/2003US6654250 Low-stress compressive heatsink structure
11/25/2003US6654249 Circuit arrangement
11/25/2003US6654200 Disk drive including electrical traces integrally formed upon disk drive housing
11/25/2003US6654064 Image pickup device incorporating a position defining member
11/25/2003US6653915 Coaxial transmission lines having grounding troughs on a printed circuit board
11/25/2003US6653736 Multilayer flexible wiring boards
11/25/2003US6653727 Semiconductor chip package with direction-flexible mountability
11/25/2003US6653574 Multi-layered substrate with a built-in capacitor design and a method of making the same
11/25/2003US6653573 Wiring board comprising granular magnetic film
11/25/2003US6653572 Multilayer circuit board
11/25/2003US6653433 Polyimide composition having improved peel strength when clad
11/25/2003US6653232 Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus
11/25/2003US6653056 Process for patterning non-photoimagable ceramic tape
11/25/2003US6652993 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
11/25/2003US6652958 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources
11/25/2003US6652956 X-ray printing personalization technique
11/25/2003US6652805 Highly filled composites of powdered fillers and polymer matrix
11/25/2003US6652342 Wiring board and gas discharge type display apparatus using the same
11/25/2003US6652310 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member
11/25/2003US6652290 Connecting devices and method for interconnecting circuit components
11/25/2003US6652161 Optical wavelength division multiplexer and/or demultiplexer mounted in a pluggable module
11/25/2003US6652075 Electronically addressable microencapsulated ink and display thereof
11/25/2003US6652073 Structure of a flexible printed circuit for inkjet printheads and the manufacturing process therefor
11/25/2003US6651871 Substrate coated with a conductive layer and manufacturing method thereof
11/25/2003US6651870 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
11/25/2003US6651324 Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
11/25/2003US6651323 Method for making a printed wire board having a heat-sinking solder pad
11/25/2003US6651322 Method of reworking a multilayer printed circuit board assembly
11/25/2003US6651315 Electrical devices
11/20/2003WO2003096777A2 Adapter for surface mount devices to through hole applications
11/20/2003WO2003096776A1 Flexible printed wiring board for chip-on-film
11/20/2003WO2003096414A2 Power supply component assembly on a printed circuit and method for obtaining same
11/20/2003WO2003096384A2 Conductive ink
11/20/2003WO2003096362A2 High energy density capacitors
11/20/2003WO2003095729A1 Plural layer woven electronic textile, article and method
11/20/2003WO2003077264A3 Emi shielded module
11/20/2003WO2003067940A3 Circuit carrier and production thereof
11/20/2003WO2003028044A3 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
11/20/2003WO2003019656A3 Interconnect module with reduced power distribution impedance
11/20/2003WO2002103455A3 Method and apparatus for imaging with fiber optic arrays on non-flat surfaces
11/20/2003WO2002093647A3 Electronic package with high density interconnect and associated methods
11/20/2003WO2002056154A3 Usb securing device with keypad
11/20/2003US20030217349 BWB transmission wiring design system
11/20/2003US20030216490 Multilayer printed circuits; fluoropolymer dielectric, coupler and filler mixture
11/20/2003US20030216244 Represented by (1-x)(Mg1/3 Ta2/3) O2-xZrO2 where x is between 0 and 0.2; high dielectric constants; stable temperature coefficients of the resonant frequency
11/20/2003US20030216240 Comprising an inorganic filler such as titania and glass containing boron, silicon, aluminum, calcium, zinc, and one or more of sodium, lithium and potassium; improved bending strength
11/20/2003US20030216068 Optically transparent elastomeric interconnects and method of using same
11/20/2003US20030216066 Zero insertion force heat-activated retention pin
11/20/2003US20030216062 Card-edge connector and card member
11/20/2003US20030216061 Method of attaching circuitry to a modular jack connector using electrically conductive paste
11/20/2003US20030215654 Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
11/20/2003US20030215623 An addition copolymer comprising an unsaturated acrylic ester monomer with carbamate groups and an isocyanurate group, styrene, and a brominated styrene; dielectrics use for a printed circuit board laminate
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