Patents for H05K 1 - Printed circuits (98,583)
06/2004
06/30/2004CN1156206C Vibrator holder
06/30/2004CN1156205C Method for installing electronic device and circuit board
06/30/2004CN1156203C Printed circuit boards for mounting semiconductor integrated circuit die
06/30/2004CN1156060C Pin base and its producing method
06/30/2004CN1155655C Epoxy resin composition
06/30/2004CN1155531C Inorganic particle-coated glass fiber strands and products including the same
06/30/2004CN1155530C Glass fiber strands coated with thermally conductive inorganic particles and products including the same
06/29/2004US6757751 High-speed, multiple-bank, stacked, and PCB-mounted memory module
06/29/2004US6757386 Apparatus, system, and method for efficient reduction of electromagnetic interference in telecommunications equipment
06/29/2004US6757178 Electronic circuit equipment using multilayer circuit board
06/29/2004US6757177 Stacked backplane assembly
06/29/2004US6757176 Circuit board
06/29/2004US6757175 Method and embedded bus bar structure for implementing power distribution
06/29/2004US6757174 Switching power-supply module
06/29/2004US6757137 Stiffness controlled disk drive suspension with limiter feature
06/29/2004US6756975 Matrix type display apparatus, method of production thereof, and thermo-compression bonding head
06/29/2004US6756936 Microwave planar motion sensor
06/29/2004US6756680 Flip chip C4 extension structure and process
06/29/2004US6756663 Semiconductor device including wiring board with three dimensional wiring pattern
06/29/2004US6756628 Capacitor sheet with built in capacitors
06/29/2004US6756606 Apparatus and method for marking defective sections of laminate substrates
06/29/2004US6756563 System and method for forming holes in substrates containing glass
06/29/2004US6756469 Polysilazane-modified polyamine hardeners for epoxy resins
06/29/2004US6756304 Method for producing via-connections in a substrate and substrate equipped with same
06/29/2004US6755666 Guide insert for PCI connector receptacle
06/29/2004US6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
06/29/2004CA2355668C Modular power supply for generating a high voltage dc output
06/29/2004CA2349058C Power supply module and power supply unit using the same
06/24/2004WO2004054340A1 Multilayer printed circuit board and method for manufacturing same
06/24/2004WO2004054335A1 Circuit board with plug connector
06/24/2004WO2004054334A1 Electronic part mounting structure and mounting method
06/24/2004WO2004054333A2 Cross connect via for multilayer printed circuit boards
06/24/2004WO2004054332A2 Strip-line topology for a high speed pcb with low dissipation
06/24/2004WO2004054032A1 Even dissipation of particles' transfer
06/24/2004WO2004053983A1 Metal core substrate packaging
06/24/2004WO2004053900A2 Flame sensor
06/24/2004WO2004053544A2 Photonic circuit board
06/24/2004WO2004052967A1 Plant fiber reinforced plastic formed article
06/24/2004WO2004052804A1 Ceramic composition being fired at low temperature and having high strength and method for preparing the same, and laminated electronic parts using the same
06/24/2004WO2004052650A1 Electrode structure and method of manufacture
06/24/2004WO2004052489A2 Methods for assembly and sorting of nanostructure-containing materials and related articles
06/24/2004WO2004047508A3 Technique for accommodating electronic components on a multilayer signal routing device
06/24/2004WO2004040285A3 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors
06/24/2004WO2004034754A3 Circuit board stiffener
06/24/2004WO2004006297A3 Low dielectric materials and methods of producing same
06/24/2004WO2003048981A3 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid
06/24/2004US20040121990 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
06/24/2004US20040121897 major composition containing BaO, SrO, SiO2, ZrO2, and Al2O3; 2 to 10 parts by weight of a Zn B-silicate glass composition, per 100 parts by weight of the major composition.
06/24/2004US20040121811 Radio frequency apparatus
06/24/2004US20040121752 High Frequency switch
06/24/2004US20040121655 Add-in card to backplane connecting apparatus
06/24/2004US20040121652 Interconnection system with improved high frequency performance
06/24/2004US20040121624 Printed circuit board
06/24/2004US20040121528 Electronic unit integrated into a flexible polymer body
06/24/2004US20040121515 Programmable multi-chip module
06/24/2004US20040121266 inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of ceramic (e.g., BaTiO3) and a resin, and a process for manufacturing the printed circuit board
06/24/2004US20040121178 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
06/24/2004US20040120631 Optical printed circuit board for long-distance signal transmission
06/24/2004US20040120127 Compact circuit module having high mounting accuracy and method of manufacturing the same
06/24/2004US20040120121 Densely packed electronic assemblage with heat removing element
06/24/2004US20040120120 Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
06/24/2004US20040120101 Anti-tampering enclosure for electronic circuitry
06/24/2004US20040120098 Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection
06/24/2004US20040119653 Antenna mounting printed-circuit board
06/24/2004US20040119565 High-frequency wiring board
06/24/2004US20040119553 Center-tap termination circuit and printed circuit board having the same
06/24/2004US20040119549 Cross talk compensation circuit
06/24/2004US20040119160 Programmable multi-chip module
06/24/2004US20040119159 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge
06/24/2004US20040119157 Remote thermal vias for densely packed electrical assemblage
06/24/2004US20040119156 Electronic circuit assembly having high contrast fiducial
06/24/2004US20040119147 Apparatus and method for improving AC coupling on circuit boards
06/24/2004US20040118917 Reading head
06/24/2004US20040118824 Conveyorized blind microvia laser drilling system
06/24/2004US20040118604 Substrate-imprinting apparatus, methods of manufacture, and products formed therefrom
06/24/2004US20040118603 Methods and apparatus for a flexible circuit interposer
06/24/2004US20040118602 Printed circuit board with embedded capacitors and manufacturing method thereof
06/24/2004US20040118601 Multichip module having chips on two sides
06/24/2004US20040118600 Printed circuit board with embedded capacitors therein, and process for manufacturing the same
06/24/2004US20040118597 Apparatus and method for improving coupling across plane discontinuities on circuit boards
06/24/2004US20040118595 Rigid-flex circuit board system
06/24/2004US20040117985 Electronic circuit construction method, as for a wireless RF tag
06/24/2004US20040117984 Method of fabricating multi-layered printed circuit board for optical waveguides
06/24/2004US20040117982 Method of removing heat from an electronic assemblage
06/24/2004DE20320315U1 Foil conduction harness joining conduction paths of foil conduction harness e.g. for motor vehicle internal electronics, has conduction paths of branch line directly contacted with associated conduction paths of supply line
06/24/2004DE10313050B3 Mobile communications terminal e.g. for automobile audio system, with Bluetooth (RTM) antenna provided by metal frame used for electrostatic discharge protection of printed circuit board
06/24/2004DE10258613A1 Dielectric resonator tuning method during operation, e.g. for short-range radar sensor, by applying quick-drying liquid to surface of dielectric of resonator and monitoring resonator frequency
06/24/2004DE10257777A1 Einrichtung zur Bearbeitung von integrierten Schaltkreisen Means for processing of integrated circuits
06/24/2004DE10257527A1 Schaltungsträger Circuit board
06/24/2004DE10256433A1 Contact between chip module and other components in chip card using isotropic conductive adhesive having grooves in it to provide separate areas to prevent short circuit between contacts in same level
06/24/2004DE10256104A1 System zur elektrischen Kontaktierung mit einem Leiter, insbesondere für eine Heizungs- oder Klimaanlage für ein Kraftfahrzeug System for making electrical contact with a conductor, in particular for a heating or air conditioning system for a motor vehicle
06/23/2004EP1432297A2 Flat module
06/23/2004EP1432293A1 Printed wiring board and production method for printed wiring board
06/23/2004EP1432292A1 Carrier-attached copper foil and printed board using the copper foil
06/23/2004EP1432053A1 Battery pack and thermostat used for it
06/23/2004EP1432031A1 Anti-tampering enclosure for electronic circuitry
06/23/2004EP1432027A1 HIGH FREQUENCY IC PACKAGE, HIGH FREQUENCY UNIT USING IT, AND METHOD FOR MANUFACTURING THE SAME
06/23/2004EP1432024A2 Method of forming a penetration electrode and substrate having a penetration electrode
06/23/2004EP1431984A1 Polymer resistor composition having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
06/23/2004EP1430758A1 Electrical circuit arrangement comprised of a number of electrically interconnected circuit components