| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/25/2004 | US6740821 Selectively configurable circuit board |
| 05/25/2004 | US6740819 Printed wiring board |
| 05/25/2004 | US6740816 Film composite, method for producing the same and its use |
| 05/25/2004 | US6740814 Wiring connection method and wiring connection structure |
| 05/25/2004 | US6740732 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| 05/25/2004 | US6740701 Resistive film |
| 05/25/2004 | US6740685 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards |
| 05/25/2004 | US6740578 Methods of fabricating semiconductor substrate-based BGA interconnections |
| 05/25/2004 | US6740416 Functional thin film formed uniformly on aerogel surface; layers can be infrared reflective film, optical wavequide, electroconductive, fluorescent; intermediate layer is copper phthalocyanine for electroconductive functional layer |
| 05/25/2004 | US6740411 Embedding resin, wiring substrate using same and process for producing wiring substrate using same |
| 05/25/2004 | US6740352 Method for forming bonding pads |
| 05/25/2004 | US6740183 Method of producing ceramic multi-layered substrate |
| 05/25/2004 | US6739881 High integration electronic assembly and method |
| 05/25/2004 | US6739880 Circuit board-to-board interconnection device |
| 05/25/2004 | US6739879 Ball grid array circuit board jumper |
| 05/25/2004 | US6739859 Electric circuit apparatus of injection molding machine |
| 05/25/2004 | US6739761 Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring board |
| 05/25/2004 | US6739028 A hi-z structure in which the capacitors are vertical, instead of horizontal, so that they may be trimmed after manufacturing, for tuning purposes |
| 05/25/2004 | US6739027 Method for producing printed circuit board with embedded decoupling capacitance |
| 05/21/2004 | WO2004043119A1 A mechanism to cross high-speed differential pairs |
| 05/21/2004 | WO2004042915A1 Microwave oscillator |
| 05/21/2004 | WO2004042820A1 Shielding for electronic components and/or circuits that are sensitive to electromagnetic interference (emi) |
| 05/21/2004 | WO2004042814A1 Film carrier tape for mounting electronic component |
| 05/21/2004 | WO2004041529A1 Porous polymeric membrane toughened composites |
| 05/21/2004 | WO2004027629A3 Modular server processing card system and method |
| 05/21/2004 | WO2004025773A3 Coaxial elastomeric connector system |
| 05/21/2004 | WO2004023264A3 Smartconnect universal flash media card adapters |
| 05/21/2004 | WO2003058750B1 Grouped element transmission channel link |
| 05/20/2004 | US20040098573 Configurable initialization of hardware |
| 05/20/2004 | US20040097694 For use in an electronic raw material for flexible printed circuit boards |
| 05/20/2004 | US20040097690 For production of printed circuits or synthetic abrasives |
| 05/20/2004 | US20040097106 Electrical card connector assembly |
| 05/20/2004 | US20040097086 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097081 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097015 Package for integrated circuit with thermal vias and method thereof |
| 05/20/2004 | US20040096781 Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
| 05/20/2004 | US20040096680 Metal foil, resin laminate; reinforcing fibers impregnated with resin; toughness, heat resistance, waterproofing |
| 05/20/2004 | US20040096679 Metal-polyimide laminate |
| 05/20/2004 | US20040096678 Polyarlketone resin film and a laminate thereof with metal |
| 05/20/2004 | US20040096676 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 05/20/2004 | US20040096634 Wiring board and process of producing the same |
| 05/20/2004 | US20040095734 High capacitance package substrate |
| 05/20/2004 | US20040095725 Cooling device capable of reducing thickness of electronic apparatus |
| 05/20/2004 | US20040095710 Circuit module |
| 05/20/2004 | US20040095646 Vehicle mirror system with vehicle heading sensor assembly |
| 05/20/2004 | US20040095632 Rearview mirror constructed for efficient assembly |
| 05/20/2004 | US20040095564 Exposure device |
| 05/20/2004 | US20040095501 Imaging device package camera module and camera module producing method |
| 05/20/2004 | US20040095437 Flexible printed circuit board |
| 05/20/2004 | US20040095214 High frequency antenna |
| 05/20/2004 | US20040095200 Signal transmission circuit and electronic equipment |
| 05/20/2004 | US20040095158 Apparatuses configured to engage a conductive pad |
| 05/20/2004 | US20040094842 Flip chip C4 extension structure and process |
| 05/20/2004 | US20040094835 Silicone metalization |
| 05/20/2004 | US20040094834 Ceramic multilayer substrate and method for manufacturing the same |
| 05/20/2004 | US20040094817 Photo-interrupter and semiconductor device using the same |
| 05/20/2004 | US20040094771 Device with at least two organic electronic components and method for producing the same |
| 05/20/2004 | US20040094751 Composition for filling through-holes in printed wiring boards |
| 05/20/2004 | US20040094521 Carbon dioxide gas laser machining method of multilayer material |
| 05/20/2004 | US20040094512 Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process |
| 05/20/2004 | US20040094330 Electrical component, arrangement for said component and method for producing said arrangement |
| 05/20/2004 | US20040094329 Method of processing high-resolution flex circuits with low distortion |
| 05/20/2004 | US20040094328 Cabled signaling system and components thereof |
| 05/20/2004 | US20040094324 Cable systems and related methods |
| 05/20/2004 | US20040093723 Method of attaching printed circuit boards within an electronic module housing |
| 05/19/2004 | EP1420621A1 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
| 05/19/2004 | EP1420441A1 Semiconductor device and method for manufacturing the same |
| 05/19/2004 | EP1420383A2 Printed circuit board with display element |
| 05/19/2004 | EP1420048A2 Metal laminate |
| 05/19/2004 | EP1419866A1 Method and device for forming module electronic component and module electronic component |
| 05/19/2004 | EP1419679A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards |
| 05/19/2004 | EP1419678A1 Thermosetting electroconductive paste for electroconductive bump use |
| 05/19/2004 | EP1419560A1 High data rate interconnecting device |
| 05/19/2004 | EP1419559A1 Electromagnetic emission reduction technique for shielded connectors |
| 05/19/2004 | EP1419528A2 Interconnect module with reduced power distribution impedance |
| 05/19/2004 | EP1419526A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods |
| 05/19/2004 | EP1418833A2 In vivo sensing device with a circuit board having rigid sections and flexible sections |
| 05/19/2004 | EP0910857B1 Planar transformer |
| 05/19/2004 | EP0764352B1 Microelectronic contacts and assemblies |
| 05/19/2004 | DE4426908B4 Schaltungsanordnung mit kapazitiven Koppelelementen zur galvanischen Trennung zweier Signal-Stromkreise Circuit with capacitive coupling elements for electrical isolation of two signal circuits |
| 05/19/2004 | DE20300294U1 Verbindungsmittel zur flexiblen elektrischen Verbindung von Leiterplatten Flexible connection means for electrical connection of printed circuit boards |
| 05/19/2004 | DE10308060B3 Electrical distribution in vehicles, applies conductive tracks to sheet metal workpieces coated with hot melt adhesive layers, then joins sheets, to connect tracks |
| 05/19/2004 | DE10252636A1 Ceramic multi-layer substrate used in front end module for mobile radio, has uppermost layer with recess and stable intermediate layer below it |
| 05/19/2004 | DE10251955A1 High-power LED insert module for motor vehicle, has dielectric in flat contact with heat sink and conductive track structure |
| 05/19/2004 | DE10251615A1 Steckerelement und Platinenaufbau Connector element and circuit board assembly |
| 05/19/2004 | DE10251036A1 Microwave oscillator as in distance radar for motor vehicles, has hollow conductor with oscillation exciter and heat sink in a conductive plate in the conductor wall |
| 05/19/2004 | DE10242708A1 Protonenleitende Membranen und deren Verwendung The proton-conducting membranes and their use |
| 05/19/2004 | CN2617121Y Multi layer board structure |
| 05/19/2004 | CN1498519A Circuit support element for electronic devices, in particular for communication terminals |
| 05/19/2004 | CN1498449A Offset pathway arrangements for energy conditioning |
| 05/19/2004 | CN1498443A Filter circuit apparatus and manufacturing method thereof |
| 05/19/2004 | CN1498421A Substrate for high-frequency module and high-frequency module |
| 05/19/2004 | CN1498410A Mounting for electrical circuit in particular electrial breaker |
| 05/19/2004 | CN1498070A Electronic equipment |
| 05/19/2004 | CN1498069A Electronic equipmemt |
| 05/19/2004 | CN1498068A High-frequency device |
| 05/19/2004 | CN1498067A Method for processing hole on ceramic sheet |
| 05/19/2004 | CN1498066A Solder structure and soldering method of electronic assembly |
| 05/19/2004 | CN1498063A Manufacturing method of circuit device |
| 05/19/2004 | CN1498061A Multilayer wiring board, touch face-plate and their manufacturing method |