| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/17/2004 | US20040113286 Image sensor package without a frame layer |
| 06/17/2004 | US20040113282 [structure of flip chip package with area bump] |
| 06/17/2004 | US20040113267 Electronic device |
| 06/17/2004 | US20040113266 [semiconductor package module and manufacturing mehod thereof] |
| 06/17/2004 | US20040113261 wiring pattern; connecting terminals via apertures : flip chips |
| 06/17/2004 | US20040113260 Electronic parts packaging structure and method of manufacturing the same |
| 06/17/2004 | US20040113258 Semiconductor power module |
| 06/17/2004 | US20040113257 Integrated circuit package and printed circuit board arrangement |
| 06/17/2004 | US20040113127 Dielectic polymeric binder and electroconductive particles |
| 06/17/2004 | US20040112884 Electric heating system for a motor vehicle |
| 06/17/2004 | US20040112732 Printed circuit board intergrated switch |
| 06/17/2004 | US20040112637 Built-up printed circuit board with stacked via-holes and method for manufacturing the same |
| 06/17/2004 | US20040112635 Electronic component |
| 06/17/2004 | US20040112627 Polytetrafluoroethylene mixed powder for insulation use in product for transmission of high frequency signal and product for transmission of high frequency signal using the same |
| 06/17/2004 | US20040112617 Non-circular micro-via |
| 06/17/2004 | US20040112504 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 06/17/2004 | US20040111882 Process for producing a printed wiring board-forming sheet and multi-layered printed wiring board |
| 06/17/2004 | DE19608683B4 Verfahren zum Herstellen eines Substrates A method for manufacturing a substrate |
| 06/17/2004 | DE10354986A1 Hochfrequenzantenne Radio-frequency antenna |
| 06/17/2004 | DE10354202A1 Heat removal device for electronic components of electronic control device e.g. for vehicles, has heat conducting connection joined to circuit board in vicinity of electronic component/unit |
| 06/17/2004 | DE10354007A1 Preparation of thin layer capacitor low leakage current and high breakdown voltage, for use in microfabrication technology, |
| 06/17/2004 | DE10318297A1 Keramisches Multilayersubstrat und Verfahren zu dessen Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10317675A1 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10254547A1 Arrangement for mechanical protection of chip module assembly, has distance holder filling gaps on circuit board between chips, at least partly passing over edges of chips, and slightly higher than chips |
| 06/17/2004 | DE10245596B3 Vorverkabeltes Ausstattungsteil, Leitungsstrang und Verfahren zu seiner Herstellung Pre wired piece of equipment, wiring harness and method for its manufacture |
| 06/16/2004 | EP1429590A1 Thin film circuit board device and its manufacturing method |
| 06/16/2004 | EP1429589A2 Circuit carrier |
| 06/16/2004 | EP1429389A1 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/16/2004 | EP1429371A2 Device for treatment of integrated circuits |
| 06/16/2004 | EP1429164A2 Optical communication device |
| 06/16/2004 | EP1428418A1 Surface mounting package |
| 06/16/2004 | EP1428260A2 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 06/16/2004 | EP1428258A1 Thin electronic label and method for making same |
| 06/16/2004 | EP1427585A1 Security tag and process for making same |
| 06/16/2004 | EP1427521A1 Microcomponent |
| 06/16/2004 | EP1360885B1 Element for electromagnetic shielding and method for manufacturing thereof |
| 06/16/2004 | EP0806056B1 Glass bonding layer for a ceramic circuit board support substrate |
| 06/16/2004 | CN1505918A Substrate adhesion enhancement to film |
| 06/16/2004 | CN1505916A Method of manufacturing flexible wiring board |
| 06/16/2004 | CN1505784A Topology for 66 mhz pci bus riser card system |
| 06/16/2004 | CN1505743A Flexible circuit board with led lighting |
| 06/16/2004 | CN1505459A Circuit apparatus |
| 06/16/2004 | CN1505458A Wiring base material, electrical equipment and switching device possessing the same |
| 06/16/2004 | CN1505456A A printed circuit board and processing method thereof |
| 06/16/2004 | CN1505455A Interconnection structure of electric conductive wirings |
| 06/16/2004 | CN1505147A Electronic parts packaging structure and method of manufacturing the same |
| 06/16/2004 | CN1505141A Structure comprising a barrier layer of a tungsten alloy and manufacturing method thereof |
| 06/16/2004 | CN1505135A Laminated electronic component |
| 06/16/2004 | CN1154404C Method for presetting up low resistor on circuit board and high-current detector for electric vehicle |
| 06/16/2004 | CN1154403C Printed wiring board, method of producing the same and electronic equipment |
| 06/16/2004 | CN1154230C Surface sound wave device |
| 06/16/2004 | CN1154186C Metallization in semiconductor devices |
| 06/16/2004 | CN1154185C Miltilayer wiring structure and producing method thereof |
| 06/15/2004 | US6751361 Method and apparatus for performing fixturing in a machine vision system |
| 06/15/2004 | US6751113 Arrangement of integrated circuits in a memory module |
| 06/15/2004 | US6751101 Electronic component and method of producing the same |
| 06/15/2004 | US6751082 Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias |
| 06/15/2004 | US6750740 High efficiency interdigital filters |
| 06/15/2004 | US6750737 High frequency switch and radio communication apparatus with layered body for saw filter mounting |
| 06/15/2004 | US6750732 Circuit board with EMI suppression |
| 06/15/2004 | US6750537 Substrate structure |
| 06/15/2004 | US6750534 Heat spreader hole pin 1 identifier |
| 06/15/2004 | US6750422 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 06/15/2004 | US6750405 Two signal one power plane circuit board |
| 06/15/2004 | US6750404 High density printed wiring board having in-via surface mounting, pads |
| 06/15/2004 | US6750403 Reconfigurable multilayer printed circuit board |
| 06/15/2004 | US6750396 I-channel surface-mount connector |
| 06/15/2004 | US6750148 Method of manufacturing wireless suspension blank |
| 06/15/2004 | US6750136 Contact structure production method |
| 06/15/2004 | US6750132 Flip chip package, circuit board thereof and packaging method thereof |
| 06/15/2004 | US6750084 Method of mounting a leadless package and structure therefor |
| 06/15/2004 | US6749994 Water-soluble cellulose derivative, a photopolymerizable monomer, an acrylic resin having a hydroxyl group, a photoinitiator, and an inorganic powder; high sensitivity for precise patterning even when a thick film |
| 06/15/2004 | US6749928 Producing time is shortened, and crack or warp are hard to occur, reduction of cost can be attained |
| 06/15/2004 | US6749927 Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
| 06/15/2004 | US6749775 Conductive via composition |
| 06/15/2004 | US6749442 Flexible circuit board connecting device |
| 06/15/2004 | US6749439 Circuit board riser |
| 06/15/2004 | US6748650 Preserves the planarity of a substrate |
| 06/15/2004 | US6748645 Aligned modular printed circuit film elements |
| 06/10/2004 | WO2004049772A1 Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 06/10/2004 | WO2004049462A1 An illuminator and production method |
| 06/10/2004 | WO2004049437A1 Crack resistant interconnect module |
| 06/10/2004 | WO2004049401A2 Laser trimming of resistors |
| 06/10/2004 | WO2004049356A1 Ceramic package and chip resistor, and method for manufacture thereof |
| 06/10/2004 | WO2004049336A1 Laminate for hdd suspension using thin copper foil and its manufacturing method |
| 06/10/2004 | WO2004049070A2 Photosensitive resin composition comprising a halogen-free colorant |
| 06/10/2004 | WO2004048470A1 Hardener composition for epoxy resins |
| 06/10/2004 | WO2004048082A1 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 06/10/2004 | WO2004048017A1 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 06/10/2004 | WO2004034410A9 Via-less electronic structures and methods |
| 06/10/2004 | WO2004029994A3 Multilayer substrate |
| 06/10/2004 | WO2004025671A3 Electronic transformer/inductor devices and methods for making same |
| 06/10/2004 | WO2003073251A9 Power delivery to base of processor |
| 06/10/2004 | WO2002068245A8 Method for producing a moulded component comprising an integrated conductor strip and moulded component |
| 06/10/2004 | US20040110955 Arylalkyl aminofunctional silanes for epoxy laminates |
| 06/10/2004 | US20040110908 comprises aromatic polyester; high glass transition temperature and low dissipation factor; improved solvent solubility; dielectrics; electronics |
| 06/10/2004 | US20040110874 polycyclic compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin |
| 06/10/2004 | US20040110321 Method of forming thick-film wiring and method of producing laminated electronic component |
| 06/10/2004 | US20040110024 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC). |
| 06/10/2004 | US20040110015 Copper-clad laminate |