Patents for H05K 1 - Printed circuits (98,583) |
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07/29/2004 | US20040146692 Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
07/29/2004 | US20040146452 Electromagnetic wave absorption material and an associated device |
07/29/2004 | US20040146238 Optical connector device, and optical and electrical circuit combined board using the same |
07/29/2004 | US20040146195 Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method |
07/29/2004 | US20040145935 Memory module with a test device |
07/29/2004 | US20040145877 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
07/29/2004 | US20040145876 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield |
07/29/2004 | US20040145874 Method, system, and apparatus for embedding circuits |
07/29/2004 | US20040145873 Printed circuit board with opto-via holes and process of forming the opto-via holes |
07/29/2004 | US20040145860 Housing for electronic circuit |
07/29/2004 | US20040145858 Multilayer circuit board, manufacturing method therefor, electronic device, and electronic apparatus |
07/29/2004 | US20040145483 Smoke detectors |
07/29/2004 | US20040145441 Inductor with resistive termination |
07/29/2004 | US20040145427 Quadrature hybrid low loss directional coupler |
07/29/2004 | US20040145425 Printed circuit board noise attenuation using lossy conductors |
07/29/2004 | US20040145054 Components, methods and assemblies for stacked packages |
07/29/2004 | US20040145046 Power module and method of manufacturing the same |
07/29/2004 | US20040145044 a first electrical insulating substrate of a mixture of an inorganic filler and a thermosetting resin containing chips connected to wiring patterns formed on substrate surface; inner vias passing through the substrate connected to wiring patterns |
07/29/2004 | US20040145041 Semiconductor apparatus with decoupling capacitor |
07/29/2004 | US20040145038 Composite integrated circuit device |
07/29/2004 | US20040145037 Power semiconductor able of fast heat sinking |
07/29/2004 | US20040144989 Light emitting diode and method for producing it |
07/29/2004 | US20040144959 For printing electrical circuits on electrical conductor substrates; can be cured to highly conductive metal traces |
07/29/2004 | US20040144958 To be applied to low-temperature substrates such as polymer, paper and polyimide-based substrates using any suitable printing technique to provide improved low-temperature substrates with well-adhered traces of high electrical conductivity |
07/29/2004 | US20040144848 Product comprising product sub-parts connected to each other by a crimp connection |
07/29/2004 | US20040144656 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid |
07/29/2004 | US20040144563 Novel bonding structure for a hard disk drive suspension using anisotropic conductive film |
07/29/2004 | US20040144562 Printed wiring board |
07/29/2004 | US20040144561 Metal/ceramic bonding substrate and method for producing same |
07/29/2004 | US20040144476 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature |
07/29/2004 | US20040143959 System and method for improving suspension-to-slider attachment in a hard disk drive |
07/29/2004 | DE10301982A1 Wellenleiter Waveguide |
07/29/2004 | DE10301479A1 Printed circuit board junction box installed in vehicle, has wiring pattern and auxiliary metal pattern having bus bar and metal traces, that allow current to flow through electrical terminals mounted in board |
07/29/2004 | DE10300831A1 Stanzeinrichtung für Green Sheets Punching device for Green Sheets |
07/29/2004 | DE10300818A1 Stanzwerkzeug mit wieder verwendbaren, neutralen Baugruppen Punch with reusable, neutral assemblies |
07/29/2004 | DE10297034T5 Fluoriertes aromatisches Polymer und Verwendung davon Fluorinated aromatic polymer and use thereof |
07/29/2004 | CA2523855A1 Water-soluble electrically conductive composition, modifications, and applications thereof |
07/28/2004 | EP1441389A2 Electronic parts packaging structure and method of manufacturing the same |
07/28/2004 | EP1441232A2 Method for connecting electronic components |
07/28/2004 | EP1441001A2 Flame-retardant polyester film and processed product including the same |
07/28/2004 | EP1440607A1 Carrier arrangement for carrying optical components and connecting optical signals and method of manufacturing the same |
07/28/2004 | EP1440493A2 Bending a tab flex circuit via cantilevered leads |
07/28/2004 | EP1440471A2 Ball grid array with x-ray alignment mark |
07/28/2004 | EP1439971A2 Motor fan system which is intended, in particular, for a motor vehicle heating and/or air-conditioning system |
07/28/2004 | EP1439955A1 High nitrogen containing triazine-phenol-aldehyde condensate |
07/28/2004 | EP1286858B1 External mirror on a motor vehicle |
07/28/2004 | EP0801815B1 Electrical circuit suspension system |
07/28/2004 | CN2629387Y Metal connecting structure of printed circuit board |
07/28/2004 | CN2629386Y Rear soldering pad |
07/28/2004 | CN2629385Y Printing board |
07/28/2004 | CN2629355Y Printed circuit board structure for radio transmission apparatus |
07/28/2004 | CN1516542A Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it |
07/28/2004 | CN1516541A Flexible printed circuit base material |
07/28/2004 | CN1516540A Combination struicture of electronic element and circuit board |
07/28/2004 | CN1516539A Slot and hub double layout |
07/28/2004 | CN1516538A Wiring basic plate and its mfg. method |
07/28/2004 | CN1516537A Circuit device and its mfg. method |
07/28/2004 | CN1516272A Semiconductor device, its mfg. method and thin sheet interconnecting line parts |
07/28/2004 | CN1516243A Crystalline grain in metal film growth control method |
07/28/2004 | CN1516241A Method for forming penetrating electrode and chip with penerating electrode |
07/28/2004 | CN1516203A Constrained sintering method for asymmetrical configurational dielectric layer |
07/28/2004 | CN1516200A Storage module with detector |
07/28/2004 | CN1515928A 液晶显示器 LCD Monitor |
07/28/2004 | CN1159960C Laminating method and product of 8-layer circuit board |
07/28/2004 | CN1159956C Terminal electrode for circuit substrate on which chip package mounted and method for manufacturing the same |
07/28/2004 | CN1159795C High frequency circuit appts. antenna shared device and communication appts. |
07/28/2004 | CN1159734C Built-in fingered flat capacitor and resistor and making method thereof |
07/28/2004 | CN1159705C Low inductance flex-to-PCB spring connector for disc drive |
07/28/2004 | CN1159151C Soft substrate plate |
07/27/2004 | US6768650 Method and structure for reduction of impedance using decoupling capacitor |
07/27/2004 | US6768401 Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards |
07/27/2004 | US6768316 Laser cutting of laminates for electrical insulation testing |
07/27/2004 | US6768211 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging |
07/27/2004 | US6768208 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
07/27/2004 | US6768191 Electronic component with stacked electronic elements |
07/27/2004 | US6768100 Continuous position calibration for servo controlled rotary system |
07/27/2004 | US6768064 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
07/27/2004 | US6768062 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
07/27/2004 | US6768061 Multilayer circuit board |
07/27/2004 | US6768052 Flexible printed circuit with EMI protection |
07/27/2004 | US6767644 Metallized polyimide film |
07/27/2004 | US6767643 Copper-alloy foil to be used for laminate sheet |
07/27/2004 | US6767639 Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them |
07/27/2004 | US6767616 Metal core substrate and process for manufacturing same |
07/27/2004 | US6767477 Etching process to selectively remove copper plating seed layer |
07/27/2004 | US6767445 Method for the manufacture of printed circuit boards with integral plated resistors |
07/27/2004 | US6767252 High speed differential signal edge card connector and circuit board layouts therefor |
07/27/2004 | US6767142 Optoelectronic emitter-receiver device |
07/27/2004 | US6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
07/27/2004 | US6766950 Modular architecture sensing and computing platform |
07/27/2004 | US6766811 Method of removing smear from via holes |
07/27/2004 | US6766577 Method for changeably connecting electronic devices |
07/27/2004 | US6766576 Method for producing a double-sided wiring board |
07/22/2004 | WO2004062335A1 Multichip module including substrate with an array of interconnect structures |
07/22/2004 | WO2004062327A1 Mounting capacitors under ball grid array |
07/22/2004 | WO2004062037A2 Connector and printed circuit board for reducing cross-talk |
07/22/2004 | WO2004062025A1 Edge plated transmission line |
07/22/2004 | WO2004061960A2 Semiconductor device power interconnect striping |
07/22/2004 | WO2004061954A2 Electronic unit integrated into a flexible polymer body |
07/22/2004 | WO2004061905A2 A method for forming ceramic film capacitors |