Patents for H05K 1 - Printed circuits (98,583)
07/2004
07/29/2004US20040146692 Poly (phenylene ether) resin composition, prepreg, and laminated sheet
07/29/2004US20040146452 Electromagnetic wave absorption material and an associated device
07/29/2004US20040146238 Optical connector device, and optical and electrical circuit combined board using the same
07/29/2004US20040146195 Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method
07/29/2004US20040145935 Memory module with a test device
07/29/2004US20040145877 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor
07/29/2004US20040145876 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
07/29/2004US20040145874 Method, system, and apparatus for embedding circuits
07/29/2004US20040145873 Printed circuit board with opto-via holes and process of forming the opto-via holes
07/29/2004US20040145860 Housing for electronic circuit
07/29/2004US20040145858 Multilayer circuit board, manufacturing method therefor, electronic device, and electronic apparatus
07/29/2004US20040145483 Smoke detectors
07/29/2004US20040145441 Inductor with resistive termination
07/29/2004US20040145427 Quadrature hybrid low loss directional coupler
07/29/2004US20040145425 Printed circuit board noise attenuation using lossy conductors
07/29/2004US20040145054 Components, methods and assemblies for stacked packages
07/29/2004US20040145046 Power module and method of manufacturing the same
07/29/2004US20040145044 a first electrical insulating substrate of a mixture of an inorganic filler and a thermosetting resin containing chips connected to wiring patterns formed on substrate surface; inner vias passing through the substrate connected to wiring patterns
07/29/2004US20040145041 Semiconductor apparatus with decoupling capacitor
07/29/2004US20040145038 Composite integrated circuit device
07/29/2004US20040145037 Power semiconductor able of fast heat sinking
07/29/2004US20040144989 Light emitting diode and method for producing it
07/29/2004US20040144959 For printing electrical circuits on electrical conductor substrates; can be cured to highly conductive metal traces
07/29/2004US20040144958 To be applied to low-temperature substrates such as polymer, paper and polyimide-based substrates using any suitable printing technique to provide improved low-temperature substrates with well-adhered traces of high electrical conductivity
07/29/2004US20040144848 Product comprising product sub-parts connected to each other by a crimp connection
07/29/2004US20040144656 Uniform thickness; reacting a nickel compound and sulfamic acid in presence of phosphoric acid
07/29/2004US20040144563 Novel bonding structure for a hard disk drive suspension using anisotropic conductive film
07/29/2004US20040144562 Printed wiring board
07/29/2004US20040144561 Metal/ceramic bonding substrate and method for producing same
07/29/2004US20040144476 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature
07/29/2004US20040143959 System and method for improving suspension-to-slider attachment in a hard disk drive
07/29/2004DE10301982A1 Wellenleiter Waveguide
07/29/2004DE10301479A1 Printed circuit board junction box installed in vehicle, has wiring pattern and auxiliary metal pattern having bus bar and metal traces, that allow current to flow through electrical terminals mounted in board
07/29/2004DE10300831A1 Stanzeinrichtung für Green Sheets Punching device for Green Sheets
07/29/2004DE10300818A1 Stanzwerkzeug mit wieder verwendbaren, neutralen Baugruppen Punch with reusable, neutral assemblies
07/29/2004DE10297034T5 Fluoriertes aromatisches Polymer und Verwendung davon Fluorinated aromatic polymer and use thereof
07/29/2004CA2523855A1 Water-soluble electrically conductive composition, modifications, and applications thereof
07/28/2004EP1441389A2 Electronic parts packaging structure and method of manufacturing the same
07/28/2004EP1441232A2 Method for connecting electronic components
07/28/2004EP1441001A2 Flame-retardant polyester film and processed product including the same
07/28/2004EP1440607A1 Carrier arrangement for carrying optical components and connecting optical signals and method of manufacturing the same
07/28/2004EP1440493A2 Bending a tab flex circuit via cantilevered leads
07/28/2004EP1440471A2 Ball grid array with x-ray alignment mark
07/28/2004EP1439971A2 Motor fan system which is intended, in particular, for a motor vehicle heating and/or air-conditioning system
07/28/2004EP1439955A1 High nitrogen containing triazine-phenol-aldehyde condensate
07/28/2004EP1286858B1 External mirror on a motor vehicle
07/28/2004EP0801815B1 Electrical circuit suspension system
07/28/2004CN2629387Y Metal connecting structure of printed circuit board
07/28/2004CN2629386Y Rear soldering pad
07/28/2004CN2629385Y Printing board
07/28/2004CN2629355Y Printed circuit board structure for radio transmission apparatus
07/28/2004CN1516542A Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it
07/28/2004CN1516541A Flexible printed circuit base material
07/28/2004CN1516540A Combination struicture of electronic element and circuit board
07/28/2004CN1516539A Slot and hub double layout
07/28/2004CN1516538A Wiring basic plate and its mfg. method
07/28/2004CN1516537A Circuit device and its mfg. method
07/28/2004CN1516272A Semiconductor device, its mfg. method and thin sheet interconnecting line parts
07/28/2004CN1516243A Crystalline grain in metal film growth control method
07/28/2004CN1516241A Method for forming penetrating electrode and chip with penerating electrode
07/28/2004CN1516203A Constrained sintering method for asymmetrical configurational dielectric layer
07/28/2004CN1516200A Storage module with detector
07/28/2004CN1515928A 液晶显示器 LCD Monitor
07/28/2004CN1159960C Laminating method and product of 8-layer circuit board
07/28/2004CN1159956C Terminal electrode for circuit substrate on which chip package mounted and method for manufacturing the same
07/28/2004CN1159795C High frequency circuit appts. antenna shared device and communication appts.
07/28/2004CN1159734C Built-in fingered flat capacitor and resistor and making method thereof
07/28/2004CN1159705C Low inductance flex-to-PCB spring connector for disc drive
07/28/2004CN1159151C Soft substrate plate
07/27/2004US6768650 Method and structure for reduction of impedance using decoupling capacitor
07/27/2004US6768401 Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards
07/27/2004US6768316 Laser cutting of laminates for electrical insulation testing
07/27/2004US6768211 Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
07/27/2004US6768208 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
07/27/2004US6768191 Electronic component with stacked electronic elements
07/27/2004US6768100 Continuous position calibration for servo controlled rotary system
07/27/2004US6768064 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
07/27/2004US6768062 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof
07/27/2004US6768061 Multilayer circuit board
07/27/2004US6768052 Flexible printed circuit with EMI protection
07/27/2004US6767644 Metallized polyimide film
07/27/2004US6767643 Copper-alloy foil to be used for laminate sheet
07/27/2004US6767639 Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them
07/27/2004US6767616 Metal core substrate and process for manufacturing same
07/27/2004US6767477 Etching process to selectively remove copper plating seed layer
07/27/2004US6767445 Method for the manufacture of printed circuit boards with integral plated resistors
07/27/2004US6767252 High speed differential signal edge card connector and circuit board layouts therefor
07/27/2004US6767142 Optoelectronic emitter-receiver device
07/27/2004US6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
07/27/2004US6766950 Modular architecture sensing and computing platform
07/27/2004US6766811 Method of removing smear from via holes
07/27/2004US6766577 Method for changeably connecting electronic devices
07/27/2004US6766576 Method for producing a double-sided wiring board
07/22/2004WO2004062335A1 Multichip module including substrate with an array of interconnect structures
07/22/2004WO2004062327A1 Mounting capacitors under ball grid array
07/22/2004WO2004062037A2 Connector and printed circuit board for reducing cross-talk
07/22/2004WO2004062025A1 Edge plated transmission line
07/22/2004WO2004061960A2 Semiconductor device power interconnect striping
07/22/2004WO2004061954A2 Electronic unit integrated into a flexible polymer body
07/22/2004WO2004061905A2 A method for forming ceramic film capacitors