Patents for H05K 1 - Printed circuits (98,583)
08/2004
08/17/2004US6776862 Improvements in densification of a multilayered ceramic board fabricated by a so-called ?non-shrinkage process?
08/17/2004US6776861 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces
08/17/2004US6776859 Anisotropic bonding system and method using dynamic feedback
08/17/2004US6776827 Method and solution for treating fluorocarbon surfaces
08/17/2004US6776624 Socket for electrical parts
08/17/2004US6776476 Ink jet printhead chip with active and passive nozzle chamber structures
08/17/2004US6775906 Method of manufacturing an integrated circuit carrier
08/17/2004US6775899 Method for inspecting printing state and substrate
08/12/2004WO2004068923A1 Metal core multilayer printed wiring board
08/12/2004WO2004068922A1 Multilayer printed board, electronic apparatus, and packaging method
08/12/2004WO2004068920A1 Heat dissipating arrangement for an electronic appliance
08/12/2004WO2004068919A2 Printed circuit board noise attenuation using lossy conductors
08/12/2004WO2004068812A2 Transmission line conductor arrangement
08/12/2004WO2004068595A1 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device
08/12/2004WO2004068580A1 High-frequency circuit package and mounting configuration thereof
08/12/2004WO2004068516A1 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet
08/12/2004WO2004068506A1 Conductive paste
08/12/2004WO2004068389A2 Method of forming a conductive metal region on a substrate
08/12/2004WO2004067796A1 Pre-plating surface treatments for enhanced galvanic-corrosion resistance
08/12/2004WO2004067665A1 Method for gluing fpcb’s
08/12/2004WO2004067664A1 Thermo-activated adhesive material for fpcb agglutinations
08/12/2004WO2004067647A2 High conductivity inks with low minimum curing temperatures
08/12/2004WO2004067638A1 Resin composition containing hollow particles, prepreg containing such composition and laminated sheet
08/12/2004WO2004067634A1 Poly(phenylene ether) resin composition, prepreg, and laminated sheet
08/12/2004WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate
08/12/2004WO2004067615A2 Epoxy resin compositions, methods of preparing, and articles made therefrom
08/12/2004WO2004067601A1 Polymerizable composition, thermoplastic resin composition, crosslinked resin, and crosslinked resin composite materials
08/12/2004WO2004067600A1 Electronic material composition, electronic product and method of using electronic material composition
08/12/2004WO2004067310A1 Electrical combination instrument
08/12/2004US20040158023 Halogen-free resin composition
08/12/2004US20040157085 Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same
08/12/2004US20040157039 Insulating material containing cycloolefin polymer
08/12/2004US20040156583 Circuit board and circuit board connection structure
08/12/2004US20040156576 Optical via to pass signals through a printed circuit board
08/12/2004US20040156213 LED lamp for vehicle signal light
08/12/2004US20040156179 Electronics box having internal circuit cards interconnected to external connectors sans motherboard
08/12/2004US20040156175 Heat dissipating structure of printed circuit board and fabricating method thereof
08/12/2004US20040156174 System and method for dissipating heat from an electronic board
08/12/2004US20040156146 Circuit board, disk apparatus and methods of identifying a head IC
08/12/2004US20040155734 High frequency module
08/12/2004US20040155733 High frequency substrate
08/12/2004US20040155724 Microwave device having a slotted coaxial cable-to-microstrip connection and related methods
08/12/2004US20040155721 Method and apparatus for reducing electromagnetic radiation
08/12/2004US20040155717 Crystal oscillator device and electronic apparatus using the same
08/12/2004US20040155712 High-frequency circuit
08/12/2004US20040155356 Ceramic circuit board and method for manufacturing the same
08/12/2004US20040155335 Surface mount solder method and apparatus for decoupling capacitance and process of making
08/12/2004US20040155324 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device
08/12/2004US20040155323 Semiconductor device
08/12/2004US20040155318 plurality of contiguous semiconductor devices each separated by a scribe lane; signal line; and a plurality of electrical connections, each electrically coupling a different semiconductor devices to said signal line
08/12/2004US20040155227 Conductive paste, article produced therewith with a conductive coating on glass, ceramic or enameled steel and method for the production thereof
08/12/2004US20040155021 Flexible heater for heating electrical components in operator control handle
08/12/2004US20040154830 Ceramic circuit board and method for manufacturing the same
08/12/2004US20040154827 Plated via interposer and method of making
08/12/2004US20040154824 Contact assembly for a rotatable circuit element
08/12/2004US20040154815 Shielding Arrangement
08/12/2004US20040154757 Power conversion unit and method of providing power to a window covering
08/12/2004US20040154726 Photoreactive resin composition, method for making circuit substrate using same, and method for making ceramic multilayer substrate using same
08/12/2004US20040154529 Substrate holder, method for producing substrate holder, and method for producing mold
08/12/2004DE202004008277U1 Electrical connection between electrical components in an inductive heating system is provided by flexible ribbon cable
08/12/2004DE10303454A1 Coded electronic circuit arrangement especially for automobile LED rear lights, includes feeder line having number of coded conductors
08/12/2004DE10301682A1 Fastening high power shunt-resistance foil onto ceramic substrate, employs bonding agent forming intermetallic phase
08/12/2004DE102004004279A1 Vorrichtung und Verfahren zum korrektiven Löten Apparatus and method for corrective soldering
08/12/2004CA2513691A1 Pre-plating surface treatments for enhanced galvanic-corrosion resistance
08/11/2004EP1445998A1 A shield can for shielding electronic components on a PWB
08/11/2004EP1445994A1 WIRING BOARD SHEET AND ITS MANUFACTURING METHOD, MULTILAYER BOARD, AND ITS MANUFACTURNG METHOD
08/11/2004EP1445984A2 Flexible heater for heating electrical components in operator control handle
08/11/2004EP1445799A2 Heat dissipation device for a semiconductor on a printed circuit board
08/11/2004EP1445795A2 Methof of manufacturing a circuit carrier with integrated passive circuit elements
08/11/2004EP1445351A1 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
08/11/2004EP1444822A1 Image sensing apparatus including a microcontroller
08/11/2004EP1444733A2 Electronic device carrier adapted for transmitting high frequency signals
08/11/2004EP1444710A1 Thin film capacitor using conductive polymers
08/11/2004EP1444707A1 Fully automatic process for magnetic circuit assembly
08/11/2004EP1444665A2 Metalized dielectric substrates for eas tags
08/11/2004EP1444284A2 Planarized microelectronic substrates
08/11/2004EP1444096A1 Fluoropolymer laminates and a process for manufacture thereof
08/11/2004EP1163828B1 An arrangement relating to conductor carriers and methods for the manufacture of such carriers
08/11/2004EP1023770A4 Surface mount lc filter with polymer layers
08/11/2004CN2632988Y Paster-type digital tube
08/11/2004CN1520703A Method for forming image on object surface including circuit substrate
08/11/2004CN1520599A Thin film capacitor, and electronic circuit component
08/11/2004CN1520446A Water-dispersible resin compsn. for use in boring hole in printed wiring board, sheet comprising compsn., and method for boring hole in printed wiring board using sheet
08/11/2004CN1520250A Method for mutually connecting multolayer printed circuit board
08/11/2004CN1519867A Inductive components, laminated electronic components, laminated electronic components modulars and method for mfg. these components and modulars
08/11/2004CN1519795A Wiring substrate and electrooptic device and their mfg. method
08/11/2004CN1519535A Measuring probe, esp. device for measuring thickness of thin layer
08/11/2004CN1519120A 柔性印刷电路板 A flexible printed circuit board
08/11/2004CN1162058C Chip support and its mfg. method
08/11/2004CN1162057C 电子部件 Electronic components
08/11/2004CN1162056C 印刷线路板 Printed circuit boards
08/11/2004CN1161838C Package substrate
08/11/2004CN1161835C Semiconductor device and making method thereof
08/11/2004CN1161637C Method and mfg. liqiud crystal display module and single face printed circuit board obtained thereby
08/11/2004CN1161426C Electroconductive thick film paste and its producing process and laminated ceramic electronic element
08/10/2004US6775800 System and method for high speed processing of turbo codes
08/10/2004US6775151 Structure for mounting an electronic circuit unit
08/10/2004US6775150 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
08/10/2004US6775141 Heat dissipation structure for use in combination with electronic circuit board
08/10/2004US6775122 Circuit board with added impedance