| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/04/2004 | US6731244 High efficiency directional coupler |
| 05/04/2004 | US6731189 Multilayer stripline radio frequency circuits and interconnection methods |
| 05/04/2004 | US6731004 Electronic device and method of producing same |
| 05/04/2004 | US6731001 Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
| 05/04/2004 | US6730860 Electronic assembly and a method of constructing an electronic assembly |
| 05/04/2004 | US6730858 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
| 05/04/2004 | US6730856 Ceramic circuit board and method for manufacturing the same |
| 05/04/2004 | US6730854 Resin-formed substrate and resin-formed substrate unit |
| 05/04/2004 | US6730770 Method of preparing a higher solids phenolic resin |
| 05/04/2004 | US6730596 Method of and apparatus for forming interconnection |
| 05/04/2004 | US6730423 Electrical contacting device for an electrochemical fuel cell |
| 05/04/2004 | US6730183 Laminated ceramic electronic components and manufacturing method therefor |
| 05/04/2004 | US6729907 Plug-in connector for an electrical device |
| 05/04/2004 | US6729899 Balance high density 110 IDC terminal block |
| 05/04/2004 | US6729891 Right angle board-to-board connector with balanced impedance |
| 05/04/2004 | US6729889 Electrical connection arrangement and method for the manufacture thereof |
| 05/04/2004 | US6729888 Connecting structure, electro-optical device, and electronic apparatus |
| 05/04/2004 | US6729776 Transparent substrate and hinged optical assembly |
| 05/04/2004 | US6729548 Memory card, and receptacle for same |
| 05/04/2004 | US6729238 Printing of a conductive coating on an electric unit |
| 05/04/2004 | US6729213 Manufacturing method of monolithic electronic components |
| 05/04/2004 | US6729025 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 05/04/2004 | US6729024 Method of forming a non-continuous conductive layer for laminated substrates |
| 05/04/2004 | US6729022 Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards |
| 05/04/2004 | US6729020 Method for replacing a board-mounted electric circuit component |
| 05/04/2004 | US6729001 Method for making a sonoprobe |
| 05/04/2004 | CA2325141C Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace |
| 05/04/2004 | CA2305894C Electronic device structure capable of preventing malfunction caused by electromagnetic waves coming from the outside |
| 04/29/2004 | WO2004036971A1 Method for mounting multishaft servo amplifier module |
| 04/29/2004 | WO2004036969A1 Method and device for joining at least two parts |
| 04/29/2004 | WO2004036968A1 A printed circuit board assembly and a method for providing such an assembly |
| 04/29/2004 | WO2004036964A2 Method for the manufacture of printed circuit boards with integral plated resistors |
| 04/29/2004 | WO2004036799A2 Pcb incorporating integral optical layers |
| 04/29/2004 | WO2004036696A1 Board mounted electrical connector |
| 04/29/2004 | WO2004036491A1 Adapter, memory card, and memory card module |
| 04/29/2004 | WO2004035874A1 Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith |
| 04/29/2004 | WO2004035303A1 Laminate structures, methods for production thereof and uses therefor |
| 04/29/2004 | WO2004008817A3 A multi-configuration processor-memory device |
| 04/29/2004 | WO2003054959A3 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 04/29/2004 | WO2002091811A3 Throughplating of flexible printed boards |
| 04/29/2004 | US20040082724 Novel heterobifunctional monomers and uses therefor |
| 04/29/2004 | US20040082241 Fiberglass nonwoven binder |
| 04/29/2004 | US20040082189 Multi-layer circuit board and method of manufacturing the same |
| 04/29/2004 | US20040082100 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component |
| 04/29/2004 | US20040081811 Integrated thin film capacitor/inductor/interconnect system and method |
| 04/29/2004 | US20040081808 Polyimide film for flexible printed board and flexible printed board using the same |
| 04/29/2004 | US20040081351 Multi-layer printed circuit board fabrication system and method |
| 04/29/2004 | US20040081329 Button apparauts with a speaker |
| 04/29/2004 | US20040080920 Device substrate, production method therefor, electronic device, production method therefor, optic device, production method therefor, and electronic apparatus |
| 04/29/2004 | US20040080459 Integrated dual function circuitry and antenna system |
| 04/29/2004 | US20040080397 Method of protecting a thick film resistor |
| 04/29/2004 | US20040080386 Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| 04/29/2004 | US20040080378 High-frequency module and communication apparatus |
| 04/29/2004 | US20040080057 Sash for land grid arrays |
| 04/29/2004 | US20040080054 Writing determination pattern in dielectric substrate; connecting terminals covering apertures; electroplating of metals |
| 04/29/2004 | US20040080052 Circuit substrate and fabrication method thereof |
| 04/29/2004 | US20040080044 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 04/29/2004 | US20040080021 Integrated thin film capacitor/inductor/interconnect system and method |
| 04/29/2004 | US20040079937 Wiring substrate, electronic device, electro-optical device, and electronic apparatus |
| 04/29/2004 | US20040079927 ESD dissipative ceramics |
| 04/29/2004 | US20040079783 Solder bump fabrication method and apparatus |
| 04/29/2004 | US20040079244 Screen printing apparatus and method of the same |
| 04/29/2004 | US20040079193 Overcoating metal particles with high electroconductive paste; high density integrated circuits |
| 04/29/2004 | US20040078970 Multilayer electroconductive layers; electroless plating; patterning by isotropic etching to control thickness |
| 04/29/2004 | US20040078969 Method of manufacturing circuit board and communication appliance |
| 04/29/2004 | US20040078968 Printed circuit board manufacturing method |
| 04/29/2004 | US20040078967 Z-axis electrical contact for microelectronic devices |
| 04/29/2004 | US20040078957 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/29/2004 | DE10348551A1 Electronic control device for use in motor vehicles and domestic appliances has separate ground structures for voltage regulator and other electronic circuits |
| 04/29/2004 | DE10348010A1 Mehrschichtleiterplatte, Verfahren zu deren Herstellung und Mehrschichtleiterplatte verwendendes Mobilgerät Multi-layer printed circuit board, process for their preparation and multilayer PCB-use mobile device |
| 04/29/2004 | DE10301516B3 Making conductive structures, selectively removes outer conductive layer from foam loaded with controlled concentration of conductive particles |
| 04/29/2004 | DE10295940T5 Plattenförmiger Schaltungsblock und Verfahren zu dessen Herstellung A plate-shaped circuit block and method of producing the |
| 04/29/2004 | DE10252308B3 Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
| 04/29/2004 | DE10249868B3 Verfahren zum Bohren von Löchern in einem aus Polymermaterial mit Glasfaserverstärkung gebildeten Substrat A method for drilling holes in a carrier formed from polymer material with glass fiber reinforcement substrate |
| 04/29/2004 | DE10247409A1 Ceramic substrate body for an electronic switch, comprises a ceramic substrate having a recess for an insertion body which is connected to the substrate via a foam |
| 04/29/2004 | DE10246953A1 Elektronische Schaltungsanordnung Electronic circuitry |
| 04/29/2004 | DE10134986B4 Verbindung gehäusegefaßter integrierter Speicherbausteine mit einer Leiterplatte Connection housing calmer integrated memory devices with a circuit board |
| 04/29/2004 | DE10057606B4 Anordnung zur Verbindung des Ferritkerns eines Planartransformators mit Masse Arrangement for connection of the ferrite core of a planar transformer to ground |
| 04/28/2004 | EP1414282A2 Connection structure between printed circuit board and flexible circuit board |
| 04/28/2004 | EP1414281A1 Circuit module |
| 04/28/2004 | EP1414280A2 The multilayer electronic substrate and its method of manufacturing |
| 04/28/2004 | EP1414279A2 High-frequency module and communication apparatus |
| 04/28/2004 | EP1414050A1 Method for producing nanocomposite magnet using atomizing method |
| 04/28/2004 | EP1413924A1 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 04/28/2004 | EP1413178A1 Card manufacturing technique and resulting card |
| 04/28/2004 | EP1413004A1 Ball grid array antenna |
| 04/28/2004 | EP1412813A2 Microencapsulated electrophoretic display with integrated driver |
| 04/28/2004 | EP1412716A1 Very low phase noise temperature stable voltage controlled oscillator |
| 04/28/2004 | EP1412445A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 04/28/2004 | EP1412429A1 Flameproofed thermoplastic molding compounds |
| 04/28/2004 | EP1412307A2 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate. |
| 04/28/2004 | EP1090401A4 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor |
| 04/28/2004 | EP0987926B1 An electroluminescent light |
| 04/28/2004 | CN1493008A Layerd circuit boards and methods of production thereof |
| 04/28/2004 | CN1148110C Laminating method and product of 8-layer printed circuit board |
| 04/28/2004 | CN1148109C Circuit board |
| 04/28/2004 | CN1147993C Master slice, substrate element and producing method therefor |
| 04/28/2004 | CN1147938C Surface installation structure and electronic elements included inside |
| 04/28/2004 | CN1147792C Signalnig improvement using extended transmission lines on high speed DIMMS |
| 04/27/2004 | US6728557 Hinge assembly for a multi-configuration portable electronic device |