Patents for H05K 1 - Printed circuits (98,583)
08/2004
08/26/2004US20040163554 Uphill screen printing in the manufacturing of microelectronic components
08/26/2004US20040163519 Punching tool with re-usable, neutral structural groups
08/26/2004US20040163308 Method of producing plants, plant cultivating device, and light-emitting panel
08/26/2004US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts
08/26/2004US20040163248 Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method
08/26/2004US20040163247 Circuit forming board and method of manufacturing circuit forming board
08/26/2004US20040163245 Low dielectric loss signal line
08/26/2004US20040163234 Resistive vias in a substrate
08/26/2004DE202004009717U1 Circular electrical light bulb has number of LED elements mounted on a circuit board strip in such a way as to produce uniform output
08/26/2004DE10320090A1 Electronic assembly, especially a circuit board, has conducting tracks between components made from carbonized plastic and or agglomerated nano-particles mounted on a plastic substrate
08/26/2004DE10305855A1 HF-Multilayer-Platine RF multilayer board
08/25/2004EP1450590A2 Circuitized substrate and method of making same
08/25/2004EP1450439A2 Planar contact structure with contact legs for variable plug position
08/25/2004EP1450416A1 Carrier substrate for electronic components
08/25/2004EP1450405A2 Drive IC and display device having the same
08/25/2004EP1450401A1 Module structure and module comprising it
08/25/2004EP1450400A1 Module part
08/25/2004EP1450382A2 Method for forming permanent magnet targets for position sensors
08/25/2004EP1450135A1 Inductive sensor and rotary encoder using the same
08/25/2004EP1449413A1 Method and apparatus for securing a circuit board to a rigid surface
08/25/2004EP1449412A1 Data bus connection for memory device
08/25/2004EP1449224A1 Method of producing a multilayer microelectronic substrate
08/25/2004EP1449223A2 Resistor nanocomposite compoisitons
08/25/2004EP1448948A2 Guided munitions electronics package and method
08/25/2004EP1448725A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
08/25/2004EP1448316A1 Hot melt conductor paste composition
08/25/2004EP1062849A4 Circuit board features with reduced parasitic capacitance and method therefor
08/25/2004CN2636390Y PCB adjustable capacitor for adjusting remote transmitting frequency
08/25/2004CN1524401A Alignment of vias in circuit boards or similar structures
08/25/2004CN1524111A Flameproofed thermoplastic molding compounds
08/25/2004CN1524033A Method of manufacturing ceramic laminated body
08/25/2004CN1524026A System and method for integrating optical layers in a PCB for inter-board communications
08/25/2004CN1523664A Packaging substrate and inversion type semiconductor device
08/25/2004CN1523650A LSI packaging and assembly method thereof
08/25/2004CN1523617A High density inductor and method for producing same
08/25/2004CN1523536A 存储卡 Memory Card
08/25/2004CN1523409A Drive ic and display device having the same
08/25/2004CN1523320A Inductive sensor and rotary encoder provided with an inductive sensor
08/25/2004CN1523058A Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
08/25/2004CN1522985A Preparation method of lead zirconate titanate thick film material
08/25/2004CN1164160C Method and device for processing substrates
08/25/2004CN1164158C Multi-layer circuit board for semiconductor chip assembly
08/25/2004CN1164157C Printed circuit board capable of preventing short circuit during welding
08/25/2004CN1164153C Method for mounting terminal on circuit board and circuit board
08/25/2004CN1164152C Multi-layer circuit board including reactance element and method for minitrimming reactance element
08/25/2004CN1164151C Double locations of slots and jacks
08/25/2004CN1164030C Flat electronic device and installing structure thereof
08/25/2004CN1163958C Lamination for multi-layer printed circuit
08/25/2004CN1163638C Electrodeposit copper foil mfg method
08/25/2004CN1163431C Borate glass based ceramic tape
08/24/2004US6782522 Semiconductor device having wide wiring pattern in outermost circuit
08/24/2004US6782243 Printed circuit board including EMI reducing circuits, an information processing apparatus having the board and a method to select the circuits
08/24/2004US6781850 Protection against folding and displacement for a flexible printed circuit board in a contact-making region
08/24/2004US6781848 Single-piece molded module housing
08/24/2004US6781845 Parallel printed circuit board assembly
08/24/2004US6781839 Vertical surface mount apparatus with thermal carrier and method
08/24/2004US6781815 Capacitor sheet, electro-optical device with capacitor, flexible substrate, composite build-up substrate, and electronic apparatus
08/24/2004US6781662 Compression-bond connection substrate, liquid crystal device, and electronic equipment
08/24/2004US6781506 Foils have sufficient isotropic roughness for good adhesion of the resistive material and require less resistive material to obtain a given sheet resistivity than conventional metal foils
08/24/2004US6781497 Apparatus and method for situating an inductive element onto a rod in an electrical circuit
08/24/2004US6781488 Connected construction of a high-frequency package and a wiring board
08/24/2004US6781230 Flat circuit interconnecting device
08/24/2004US6781215 Intermediate base for a semiconductor module and a semiconductor module using the intermediate base
08/24/2004US6781093 Circuit singulation system and method
08/24/2004US6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same
08/24/2004US6781056 Heater for temperature control integrated in circuit board and method of manufacture
08/24/2004US6780943 Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin
08/24/2004US6780927 For forming flexible gasket useful in sealing of electromagnetically shielded housings in electronic devices
08/24/2004US6780738 Pattern forming method, method of making microdevice, method of making thin-film magnetic head, method of making magnetic head slider, method of making magnetic head apparatus, and method of making magnetic recording and reproducing apparatus
08/24/2004US6780677 Process for mounting electronic device and semiconductor device
08/24/2004US6780565 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same
08/24/2004US6780549 Photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a silica sol filler with a diameter of between 5 nm-0.5 mu m
08/24/2004US6780520 Bonding nickel/copper alloy plate onto ceramic substrate, applying photoresist, ethching, then removing photoresist; reduces the displacement failure during mounting of semiconductor
08/24/2004US6780511 N-substituted arylamino-phenol-formaldehyde condensates
08/24/2004US6780493 Wiring board and a process of producing a wiring board
08/24/2004US6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same
08/24/2004US6780267 Electronic device of ceramic
08/24/2004US6780057 Coaxial dual pin sockets for high speed I/O applications
08/24/2004US6780055 Terminal structure of high frequency signal transmitting part
08/24/2004US6780023 Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
08/24/2004US6779783 Method and structure for tape ball grid array package
08/24/2004US6779730 Perforated antenna for an integrated circuit card, and an integrated circuit card including such an antenna
08/24/2004CA2457299A1 Circuitized substrate and method of making same
08/19/2004WO2004071145A1 A shielding arrangement
08/19/2004WO2004071144A1 A shield can for shielding electronic components on a pwb
08/19/2004WO2004071141A2 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus
08/19/2004WO2004070887A1 Smt-enabled component and circuit board
08/19/2004WO2004070768A2 Direct mount led lamp
08/19/2004WO2004070087A1 Composite copper foil, method for production thereof and high frequency transmission circuit using said composite copper foil
08/19/2004WO2004069941A2 High conductivity inks with improved adhesion
08/19/2004WO2004027866A3 Method for creating a link in an integrated metal substrate
08/19/2004WO2003043747A8 Manufacture having double sided features in a metal-containing web formed by etching
08/19/2004US20040162370 Flame-retardant thermosetting resin composition
08/19/2004US20040162365 Insulated ultrafine powder, process for producing same and resin composite material with high dielectric constant using same
08/19/2004US20040162363 Mixture of polyamic acid, photosensitive agent, dispersion and solvent; desolventizing; fineness circuit pattern; curing, exposure, development; heat resistance, dimensional stability and insulating properties
08/19/2004US20040162120 Portable radio communication apparatus and connection member
08/19/2004US20040161953 Technique for identifying multiple circuit components
08/19/2004US20040161922 Electronic device manufacture
08/19/2004US20040161703 Suppressed peeling of end portions peculiar to fine lines
08/19/2004US20040161702 For fabricating circuitized substrates which reduces the formation of shorts