| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/13/2004 | US6760969 Method for connecting electrical components |
| 07/13/2004 | CA2289782C Alkoxysilane/organic polymer composition for use in producing an insulating thin film and use thereof |
| 07/13/2004 | CA2232523C Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| 07/08/2004 | WO2004057857A1 Image generation device, particularly for installation in the roof area or in the exterior rearview mirror of a motor vehicle |
| 07/08/2004 | WO2004057706A1 Connector for connecting substrate and substrate for connecting connector |
| 07/08/2004 | WO2004057687A2 Light-emitting arrangement |
| 07/08/2004 | WO2004057686A2 Electroluminescent assembly |
| 07/08/2004 | WO2004057670A1 Surface-mounted microwave package and corresponding mounting with multilayer circuit |
| 07/08/2004 | WO2004057519A1 Securing device for a security module connector |
| 07/08/2004 | WO2004057220A1 Compact electropneumatic multipath valve comprising a compact valve control |
| 07/08/2004 | WO2004057055A1 Plating of multi-layer structures |
| 07/08/2004 | WO2004008832A3 Attachable modular electronic systems |
| 07/08/2004 | WO2003031373B1 Thick film conductor compositions for use on aluminum nitride substrates |
| 07/08/2004 | WO2002091571A9 Method and apparatus for reducing electromagnetic radiation |
| 07/08/2004 | US20040132925 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 07/08/2004 | US20040132900 Heat resistance, chemical resistance, waterproofing; curing, cyclization polyamic acids |
| 07/08/2004 | US20040132491 Camera module for mobile communication terminals |
| 07/08/2004 | US20040132372 Solid sheet material especially useful for circuit boards |
| 07/08/2004 | US20040132348 Patch panel |
| 07/08/2004 | US20040132322 Filtered electrical connector assembly for an overmolded electronic package |
| 07/08/2004 | US20040132321 Connection housing for an electronic component |
| 07/08/2004 | US20040132279 Electronic package with filled blind vias |
| 07/08/2004 | US20040132229 Concurrent electrical signal wiring optimization for an electronic package |
| 07/08/2004 | US20040131869 Method for producing a conductive coating on an insulating substrate |
| 07/08/2004 | US20040131832 Metal/ceramic circuit board |
| 07/08/2004 | US20040131824 Selective PCB stiffening with preferentially oriented fibers |
| 07/08/2004 | US20040131765 Method for manufacturing double-sided flexible printed board |
| 07/08/2004 | US20040130877 Substrate for high-frequency module and high-frequency module |
| 07/08/2004 | US20040130848 Sole structure for electrostatic dissipative footwear and method of making same |
| 07/08/2004 | US20040130500 Non-contact communication medium |
| 07/08/2004 | US20040130435 Ball grid array resistor network having a ground plane |
| 07/08/2004 | US20040130428 Surface mount magnetic core winding structure |
| 07/08/2004 | US20040130334 Timing markers used in the measurement and testing of a printed circuit board's controlled impedance |
| 07/08/2004 | US20040130303 Apparatus for providing regulated power to an integrated circuit |
| 07/08/2004 | US20040130013 Electronic parts packaging structure and method of manufacturing the same |
| 07/08/2004 | US20040129789 Data distribution mechanism in the form of ink dots on cards |
| 07/08/2004 | US20040129765 Junction box and soldering method for printed circuit board of the junction box |
| 07/08/2004 | US20040129718 Receiving device for drug blisters |
| 07/08/2004 | US20040129689 Method of making hole in ceramic green sheet |
| 07/08/2004 | US20040129453 Electronic substrate with direct inner layer component interconnection |
| 07/08/2004 | US20040128829 Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| 07/08/2004 | US20040128822 Method for making a multilayer circuit board having embedded passive components |
| 07/08/2004 | DE19608484B4 Bei niedriger Temperatur gebranntes Keramik-Schaltungssubstrat At low temperature-fired ceramic circuit substrate |
| 07/08/2004 | DE19519414B4 Elektrisch betätigtes Ventil Electrically operated valve |
| 07/08/2004 | DE10352653A1 Semiconducting component with cooling plate, has filter element for preventing noise emissions in conducting layer associated with at least one of semiconducting component's electrodes |
| 07/08/2004 | DE10300877B3 Elektrische Versorgungseinheit Electrical supply unit |
| 07/08/2004 | DE10261609A1 Lichtemittierende Anordnung Light emitting device |
| 07/08/2004 | DE10259795A1 Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges An image forming apparatus for installation in the roof or in the outside mirror of a motor vehicle |
| 07/08/2004 | DE10258478A1 Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures |
| 07/08/2004 | DE10054962B4 Leistungsmodul Power module |
| 07/08/2004 | CA2506931A1 Securing device for a security module connector |
| 07/07/2004 | EP1435677A2 Electrical connector and electrical or electronical assembly with an electrical connector |
| 07/07/2004 | EP1435658A1 Substrate and method for producing the same |
| 07/07/2004 | EP1435651A2 Process for the constrained sintering of asymetrically configured dielectric layers |
| 07/07/2004 | EP1435193A2 Nickel coated copper as electrodes for embedded passive devices |
| 07/07/2004 | EP1435021A1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 07/07/2004 | EP1435020A2 Aqueous developable photoimageable thick film compositions |
| 07/07/2004 | EP1434750A2 Thick film conductor compositions for use on aluminum nitride substrates |
| 07/07/2004 | EP1434749A2 Sodium copper titanate compositions containing a rare earth, yttrium or bismuth |
| 07/07/2004 | EP1434748A1 Printed circuit techniques for polyethylene surfaces |
| 07/07/2004 | CN1511435A Shunt power connection for integrated circuit package |
| 07/07/2004 | CN1511347A Substrate for electric component and method for production thereof |
| 07/07/2004 | CN1511331A Plasma display |
| 07/07/2004 | CN1511325A Conductor compositions and use thereof |
| 07/07/2004 | CN1511124A 微波电介质复合组合物 Microwave dielectric composite composition |
| 07/07/2004 | CN1511123A Microwave dielectric composition and method for producing same |
| 07/07/2004 | CN1511120A Reinforcing glass yarns with low dielectric constants |
| 07/07/2004 | CN1510986A Technology for decreasing layer number in signal wiring apparatus |
| 07/07/2004 | CN1510983A Thick-membrane distribution shaping method and manufacturing method for laminated electronic parts |
| 07/07/2004 | CN1510982A Electric signal electric interconnection technology between electronic component and multi-layer route device |
| 07/07/2004 | CN1510981A Gauging point setting method for high-frequency differential signal |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/07/2004 | CN1510979A High-density circuit board without weld pad design and manufacturing method thereof |
| 07/07/2004 | CN1510887A 携带式机器 Portable machines |
| 07/07/2004 | CN1510810A Anti-distort casing for electronic circuit |
| 07/07/2004 | CN1510750A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/07/2004 | CN1510743A Film carried belt for mounting electronic components thereon |
| 07/07/2004 | CN1510703A Dielectric ceramic composition with low-temperature sinter, multilayer ceramic chip capacitor and ceramic electronic device |
| 07/07/2004 | CN1510699A Pellet variable resistance |
| 07/07/2004 | CN1157105C Built-in circuit device assembly and its manufacturing method |
| 07/07/2004 | CN1156949C Receptacle seat of cathode-ray tube and monitor containg same |
| 07/07/2004 | CN1156734C Display Panel |
| 07/07/2004 | CN1156613C Process of controlling grain growth in metal films |
| 07/07/2004 | CN1156539C Fire-retarded resin and fire-retarded resin composition containing said resin |
| 07/07/2004 | CN1156504C Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 07/06/2004 | US6760497 Printed circuit board for electrical and optical signals and method for producing the same |
| 07/06/2004 | US6760339 Multi-layer network device in one telecommunications rack |
| 07/06/2004 | US6760232 Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
| 07/06/2004 | US6760227 Multilayer ceramic electronic component and manufacturing method thereof |
| 07/06/2004 | US6760225 Heat-dissipating structure of circuit board |
| 07/06/2004 | US6760208 Distributive capacitor for high density applications |
| 07/06/2004 | US6760054 Imaging apparatus utilizing laser beams |
| 07/06/2004 | US6759984 Low-loss printed circuit board antenna structure and method of manufacture thereof |
| 07/06/2004 | US6759921 Characteristic impedance equalizer and an integrated circuit package employing the same |
| 07/06/2004 | US6759845 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same |
| 07/06/2004 | US6759749 Circuit structure, manufacturing method thereof and wiring structure |
| 07/06/2004 | US6759744 Electronic circuit unit suitable for miniaturization |
| 07/06/2004 | US6759743 Thick film millimeter wave transceiver module |
| 07/06/2004 | US6759740 Insulating layers of alumina ceramics and dielectric layers of ceramics laminated as a unitary structure, and conductor layers of au, ag, cu and pt are formed on the surfaces and inside of the composite ceramic board |
| 07/06/2004 | US6759739 Multilayered substrate for semiconductor device |