Patents for H05K 1 - Printed circuits (98,583)
08/2004
08/04/2004EP1443555A2 Semiconductor device and method of manufacturing the same
08/04/2004EP1443529A1 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module
08/04/2004EP1443014A1 Electronic control for industrial truck, especially towbar guided industrial truck
08/04/2004EP1442642A1 Method for the selective surface treatment of planar workpieces
08/04/2004EP1442641A1 Field decoupling capacitor
08/04/2004EP1442503A1 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device
08/04/2004EP1442463A1 Multilayer circuit and method of manufacturing
08/04/2004EP1371273B1 Laminate comprised of flat conductor elements
08/04/2004EP1208727B1 Device and bridge card for a computer
08/04/2004EP1145374B1 Remote entry integrally molded transmitter
08/04/2004EP0976311B1 A shielding housing and a method of producing a shielding housing
08/04/2004CN2631191Y One-board
08/04/2004CN1518851A Method for assembly and/or disassembly of electronic module on application card, corresponding method for producing and mechanical fixing clip
08/04/2004CN1518767A Low profile integrated module interconnects
08/04/2004CN1518402A Joint area pattern structure and substrate for mounting electric assembly
08/04/2004CN1518384A Camera assembly of mobile communication terminal
08/04/2004CN1518223A Design, allocation and manufacturing method of shunting differential signal circuit
08/04/2004CN1518208A Crystal oscillating device and electronic equipment using the device
08/04/2004CN1518083A Thin film type carrier band for mounting electronic device and final defect labelling method of using the carrier band
08/04/2004CN1518080A Electronic element packaging structure and its manufacturing method
08/04/2004CN1518078A Wiring substrate and its manufacturing method, semiconductor device, electronic module and electronic instrument
08/04/2004CN1518017A Inducer with resistive terminating action
08/04/2004CN1517749A Flexible electronic device and its manufacturing method
08/04/2004CN1517408A Cured resin composition and its cured product
08/04/2004CN1517402A Fire resistance polyester film and processed product using the film
08/04/2004CN1161010C Method for producing interconnections with electrically conductive cross connections between top and bottom part of substrate and interconnections having such cross connections on substrate
08/04/2004CN1160954C High frequency unit of magnetic tape recorder
08/04/2004CN1160854C Squelch filter for power converter
08/04/2004CN1160848C Predistortion generator coupled with FR amplifier
08/04/2004CN1160781C Discrete semiconductor device and method for producing the same
08/04/2004CN1160779C Semiconductor element-mounting board, manufacturing method for board, semiconductor device and manufacturing method for device
08/04/2004CN1160745C Planar transformer
08/04/2004CN1160588C Flexible wiring base plate, electrooptical apparatus and electronic aparatus
08/03/2004US6772262 Memory module with improved data bus performance
08/03/2004US6771935 Wireless bus
08/03/2004US6771846 Optical interconnect for mezzanine circuit boards
08/03/2004US6771845 Open air optical channel
08/03/2004US6771517 Printed circuit board stiffener
08/03/2004US6771515 Systems having modules with on die terminations
08/03/2004US6771507 Power module for multi-chip printed circuit boards
08/03/2004US6771505 Power electronics unit
08/03/2004US6771484 Multi-layer capacitor, wiring board, and high-frequency circuit
08/03/2004US6771348 Displaying substrate and liquid crystal display device having the same
08/03/2004US6771332 Liquid crystal display device
08/03/2004US6771244 Display apparatus and assembly of its driving circuit
08/03/2004US6771222 Phase-array antenna diplexing
08/03/2004US6771160 Resistor component with multiple layers of resistive material
08/03/2004US6771085 Socketless/boardless test interposer card
08/03/2004US6770981 Composite interposer for BGA packages
08/03/2004US6770979 Semiconductor package and substrate thereof
08/03/2004US6770969 High performance capacitor
08/03/2004US6770967 Remote thermal vias for densely packed electrical assemblage
08/03/2004US6770965 Substrate with embedding resin containing thermoplastic resin, acid anhydride curing agent, curing accelerator and filler with specified particle size; low viscosity, high reliability by matching thermal expansion coefficients
08/03/2004US6770956 Sensor circuit module and electronic device using the same
08/03/2004US6770955 Shielded antenna in a semiconductor package
08/03/2004US6770820 Shielded flat cable
08/03/2004US6770813 Mountable microelectronic package
08/03/2004US6770691 (a) bromine-free epoxy resin and curing agent; (b) a flame retardant additive that is the condensation product of a brominated phenol and a cyanuric halide; (c) thermoplastic resin (polyphenylene ether), and (d) a cyanate ester
08/03/2004US6770493 Integrated circuit package capable of operating in multiple orientations
08/03/2004US6770421 Photo- or heat-curable resin composition and multilayer printed wiring board
08/03/2004US6770380 Resin/copper/metal laminate and method of producing same
08/03/2004US6770319 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance
08/03/2004US6770169 Cured urea formaldehyde resin-bound glass fiber mats
08/03/2004US6770159 Method of fabricating an RF substrate with selected electrical properties
08/03/2004US6769923 Fluted signal pin, cap, membrane, and stanchion for a ball grid array
08/03/2004US6769921 Printed circuit board electromagnetic energy device
08/03/2004US6769920 Method and apparatus for flexible interconnection of computer system components
08/03/2004US6769598 Method of connecting circuit boards
07/2004
07/30/2004CA2455024A1 Stacked chip electronic package having laminate carrier and method of making same
07/30/2004CA2454971A1 Multi-chip electronic package having laminate carrier and method of making same
07/29/2004WO2004064471A2 Electrical supply unit
07/29/2004WO2004064469A1 Board piece and composite wiring board using the board piece
07/29/2004WO2004064468A1 Board piece, composite wiring board using the board piece, and openable/closable device
07/29/2004WO2004064467A1 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board
07/29/2004WO2004064466A1 High-frequency layered part and manufacturing method thereof
07/29/2004WO2004064163A1 Wiring substrate and radiation detector using same
07/29/2004WO2004064162A1 Wiring substrate and radiation detector using same
07/29/2004WO2004064158A2 Component with ultra-high frequency connections in a substrate
07/29/2004WO2004064150A1 Method for manufacturing electronic component mount board and electronic mount board manufactured by this method
07/29/2004WO2004064080A1 Water-soluble electrically conductive composition, modifications, and applications thereof
07/29/2004WO2004063980A1 Module for a hybrid card
07/29/2004WO2004063806A1 Board or substrate for an organic electronic device and use thereof
07/29/2004WO2004063733A1 Image recognition apparatus and image recognition method
07/29/2004WO2004063415A2 Methods for coating surfaces with metal and products made thereby
07/29/2004WO2004062909A1 Bonding sheet and one-side metal-clad laminate
07/29/2004WO2004062873A1 Process for producing polyimide film
07/29/2004WO2003105063A3 Method for manufacturing rfid labels
07/29/2004WO2003074601A3 Printing of organic conductive polymers containing additives
07/29/2004WO2003073356A8 Memory module assembly using partially defective chips
07/29/2004US20040148616 Optical disk apparatus having a plurality of drawer detection sensors
07/29/2004US20040148581 Layout check system
07/29/2004US20040147711 Includes boron atom compound; cure time, glass transition temperature; prepregs
07/29/2004US20040147710 Fluorinated aromatic polymer and use thereof
07/29/2004US20040147658 Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
07/29/2004US20040147656 Heat shields; mixture of oxide in silicone resin
07/29/2004US20040147640 Mixture of phosphoorus containing epoxy resin, promer, hardener , polyphenylene oxide and filler; heat resistance, flame retarders
07/29/2004US20040147165 Apparatus for crosstalk compensation in a telecommunications connector
07/29/2004US20040147145 Straddle-mount electrical connector
07/29/2004US20040147060 Ball grid array package having improved reliability and method of manufacturing the same
07/29/2004US20040146728 thermosetting resin and decabromodiphenylethane prepreg