Patents for H05K 1 - Printed circuits (98,583)
05/2004
05/11/2004US6732908 Microjoint chip carrier including multilayer substrate with plurality of receptacles in top surface, set of microjoint pads on device chips with conductive studs extending outwardly above surface, interconnect wiring connecting receptacles
05/11/2004US6732643 Method for forming pattern using printing process
05/11/2004US6732567 Sintered textured channel; heat conductive detector
05/11/2004US6732428 Method for increasing electronic component density on an electronic circuit board
05/06/2004WO2004039136A1 Method for manufacturing resin substrate and method for manufacturing multilayer resin substrate
05/06/2004WO2004039134A2 Printed circuit heaters with ultrathin low resistivity materials
05/06/2004WO2004039130A1 High-pressure discharge lamp operation device and illumination appliance having the same
05/06/2004WO2004038886A2 Improved energy devices
05/06/2004WO2004038799A1 Electronic member, method for making the same, and semiconductor device
05/06/2004WO2004038495A1 Connection structure of wiring board and connection structure of liquid crystal display panel
05/06/2004WO2004038471A1 An optical board with electrical and optical wiring layers and a method of its production
05/06/2004WO2004038433A1 Sheet-form connector and production method and application therefor
05/06/2004WO2004038289A1 Light-emitting module
05/06/2004WO2004003055A8 Biaxially oriented polyester film and laminates thereof with copper
05/06/2004WO2003034636A8 High speed, controlled impedance air dielectric electronic backplane systems
05/06/2004US20040088447 Computer including optical interconnect, memory unit, and method of assembling a computer
05/06/2004US20040088416 Printed circuit board and method manufacturing the same
05/06/2004US20040087427 Glass ceramic sintered body and wiring board using the sintered body
05/06/2004US20040087216 Electrical adapter for protecting electrical interfaces
05/06/2004US20040087204 Strain relief for flexible circuit
05/06/2004US20040087192 Wiring connection method and wiring connection structure
05/06/2004US20040087191 Semiconductor package with connector
05/06/2004US20040087130 Semiconductor device and mounted semiconductor device structure
05/06/2004US20040087128 Method and materials for printing particle-enhanced electrical contacts
05/06/2004US20040087063 Edge-sealed substrates and methods for effecting the same
05/06/2004US20040087058 Substrate for carrying a semiconductor chip and a manufacturing method thereof
05/06/2004US20040086739 Film carrier tape for mounting electronic part
05/06/2004US20040086240 Multi-board optical transceiver
05/06/2004US20040086026 Flexible wired circuit board for temperature measurement
05/06/2004US20040085795 Memory module and memory configuration with stub-free signal lines and distributed capacitive loads
05/06/2004US20040085742 Capacitor mounting structure
05/06/2004US20040085741 Mechanism to cross high-speed differential pairs
05/06/2004US20040085740 Support for an electrical circuit in particular an electrical breaker
05/06/2004US20040085699 Amalgam of shielding and shielded energy pathways and other elements for single or multiiple circuitries with common reference node
05/06/2004US20040085633 Slim profile indicating instruments
05/06/2004US20040085403 Ink jet printhead chip with active and passive nozzle chamber structures
05/06/2004US20040085279 Flat panel display with signal transmission patterns
05/06/2004US20040085164 Filter circuit apparatus and manufacturing method thereof
05/06/2004US20040085149 Wired transmission path
05/06/2004US20040084973 Energy supply unit for transmitting auxiliary energy to an electrical device
05/06/2004US20040084783 Integrated circuit package capable of operating in multiple orientations
05/06/2004US20040084782 High density area array solder microjoining interconnect structure and fabrication method
05/06/2004US20040084769 Semiconductor device and method for manufacturing the same
05/06/2004US20040084759 Housing preform and electronic apparatus using the same
05/06/2004US20040084538 IC card
05/06/2004US20040084431 Electric heating for motor vehicles
05/06/2004US20040084304 Porous polymeric membrane toughened composites
05/06/2004US20040084212 Mechanism to cross high-speed differential pairs
05/06/2004US20040084210 Apparatus and method for interconnection between a component and a printed circuit board
05/06/2004US20040084208 Article and method for reducing external excitation of MEMS devices
05/06/2004US20040084207 Molded high impedance surface and a method of making same
05/06/2004US20040084205 Warpage-preventive circuit board and method for fabricating the same
05/06/2004US20040084131 Method for manufacturing laminated multilayer electronic components
05/06/2004EP1416781A1 Portable apparatus
05/06/2004EP1416779A2 Multi-layer circuit board and method of manufacturing the same
05/06/2004EP1416778A2 Small and securely-soldered electronic unit
05/06/2004EP1416614A1 Connection adapter for electric motor
05/06/2004EP1416581A1 Non-contact communication medium
05/06/2004EP1416535A2 Tape carrier for tab
05/06/2004EP1416532A1 Module component
05/06/2004EP1416007A1 Epoxy resin composition
05/06/2004EP1416003A1 RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND CURED ARTICLE OBTAINED THEREFROM
05/06/2004EP1415813A2 Edge-sealed substrates and methods for effecting the same
05/06/2004EP1415522A1 Electromagnetic filter for display screens
05/06/2004EP1415484A2 An improved patch panel
05/06/2004EP1415336A2 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween
05/06/2004EP1415021A1 Copper on invar composite and method of making
05/06/2004EP1414350A1 Ultrasound probe wiring method and apparatus
05/06/2004EP1240648B1 Non-silicone conductive paste for the electrical industry, and its use
05/06/2004DE19627543B4 Multi-Layer-Substrat sowie Verfahren zu seiner Herstellung Multi-layer substrate and to processes for its preparation
05/06/2004DE10248383A1 Laminated chip card is produced within an injection mold, where two carrier layers with an intermediate adhesive layer and an electronic component are encapsulated in an injected mass
05/06/2004DE10132786B4 Flüssigkristall anzeigemodul Liquid crystal display module
05/06/2004DE10056665B4 Lenkstockschalter, insbesondere für Fahrzeuge Steering column switch, in particular for vehicles
05/05/2004CN1494820A Ceramic electronic component and method of producing the same
05/05/2004CN1494600A Method for forming resin film and method for mfg. electronic parts
05/05/2004CN1494559A Organic compositions
05/05/2004CN1494372A Substrate for printed circuitboard distributing
05/05/2004CN1494368A Printed cirucitboard and its mfg. method
05/05/2004CN1494367A 照相机 Camera
05/05/2004CN1494366A Wiring board having sandwich layer containing inorganic filling
05/05/2004CN1494365A V type slot circuit board
05/05/2004CN1494149A Electronic apparatus
05/05/2004CN1494123A Integrated circuit packing testing equipment
05/05/2004CN1493616A Polyimide film and metal laminated plate with the same
05/05/2004CN1149008C Vibrator holder
05/05/2004CN1148934C Vibrator holder
05/05/2004CN1148898C Signal transmission method and motherboard structure
05/05/2004CN1148839C 印刷电路板连接器 Printed circuit board connectors
05/05/2004CN1148802C Low alpha emission interconnect system of electronic device and its forming method
05/05/2004CN1148796C Semiconductor chip device and package method thereof
05/05/2004CN1148400C Polyimides and polyamide acids
05/04/2004US6732266 Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elements
05/04/2004US6731523 Modularized power supply
05/04/2004US6731515 Riser assembly and method for coupling peripheral cards to a motherboard
05/04/2004US6731514 Stackable module
05/04/2004US6731511 Wiring board, method of manufacturing the same, electronic component, and electronic instrument
05/04/2004US6731495 Thin film capacitor using conductive polymers
05/04/2004US6731489 5-pin protector
05/04/2004US6731476 Circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and magnetic head using the same
05/04/2004US6731467 Trace interconnect array having increased bandwidth by selective etching of traces and dielectric substrate