| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/22/2004 | WO2004061006A1 Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same |
| 07/22/2004 | WO2004060957A1 Phosphorus-modified epoxy resin |
| 07/22/2004 | WO2004060656A1 Laminated film and method for producing same |
| 07/22/2004 | WO2004060619A1 Sheet-cutting apparatus |
| 07/22/2004 | WO2004050733A3 Phenolic resins |
| 07/22/2004 | WO2004049070A3 Photosensitive resin composition comprising a halogen-free colorant |
| 07/22/2004 | WO2004040829A3 High spread highly randomized generatable interleavers |
| 07/22/2004 | WO2003100903B1 Non-uniform transmission line and method of fabricating the same |
| 07/22/2004 | WO2003003421A3 Optical chip packaging via through hole |
| 07/22/2004 | US20040143062 Thermosetting resin composition |
| 07/22/2004 | US20040142603 Attachable modular electronic systems |
| 07/22/2004 | US20040142511 Lead frame and production process thereof and production process of thermally conductive substrate |
| 07/22/2004 | US20040142507 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 07/22/2004 | US20040142275 Photosensitive resin composition, process for forming relief pattern, and electronic component |
| 07/22/2004 | US20040142191 using a transparent and heat resistant polyimide film as a protection coverfilm instead of using a higher cost black polyimide film and using a black epoxy adhesive containingcarbon black powder instead of using a common epoxy adhesive. |
| 07/22/2004 | US20040142165 conductive particles included in the second layer are coalesced with each other to become wiring |
| 07/22/2004 | US20040142161 Circuit board electrically insulating material, circuit board and method for manufacturing the same |
| 07/22/2004 | US20040142155 Film for circuit board |
| 07/22/2004 | US20040142154 Wiring board and its production process |
| 07/22/2004 | US20040142118 Flexible electronic device and production method of the same |
| 07/22/2004 | US20040141709 Attenuator and conditioner |
| 07/22/2004 | US20040141627 Hearing-aid assembly using folded flex circuits |
| 07/22/2004 | US20040141298 Ball grid array package construction with raised solder ball pads |
| 07/22/2004 | US20040141296 Stress resistant land grid array (LGA) module and method of forming the same |
| 07/22/2004 | US20040141263 Surge-protecting printed circuit board layout |
| 07/22/2004 | US20040141061 Image sensing and printing device |
| 07/22/2004 | US20040141028 Recording head unit, manufacturing method thereof, and recorder using the unit |
| 07/22/2004 | US20040140877 Microconverter and laminated magnetic-core inductor |
| 07/22/2004 | US20040140858 Crystal oscillation device and electronic device using the same |
| 07/22/2004 | US20040140571 Mounting structure of electronic device |
| 07/22/2004 | US20040140561 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 07/22/2004 | US20040140553 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
| 07/22/2004 | US20040140551 Semiconductor device, method for manufacturing same and thin plate interconnect line member |
| 07/22/2004 | US20040140550 High-frequency package |
| 07/22/2004 | US20040140549 Wiring structure and its manufacturing method |
| 07/22/2004 | US20040140548 Modular debugger to adapt various chip sizes and logic analyzers |
| 07/22/2004 | US20040140542 Prefabricated semiconductor chip carrier |
| 07/22/2004 | US20040140538 Flex-based ic package construction employing a balanced lamination |
| 07/22/2004 | US20040140123 Printed circuit board comprising a contact sleeve that is mounted thereon |
| 07/22/2004 | US20040140116 High voltage module and method for producing same |
| 07/22/2004 | US20040139603 Wired board with bump electrode and method of fabricating the same |
| 07/22/2004 | US20040139600 Process for massively producing tape type flexible printed circuits |
| 07/22/2004 | US20040139598 Circuits including a titanium substrate |
| 07/22/2004 | US20040139589 Method of producing circuit carriers with integrated passive components |
| 07/22/2004 | DE20180409U1 Druckkopfpatrone mit asymmetrischen Kontakten Print Cartridge with asymmetric contacts |
| 07/22/2004 | DE10361087A1 Manufacture of printed circuit board with embedded capacitors by forming ground layer copper foil on inner layer of printed circuit board, and coating polymer capacitor paste having high-dielectric constant on ground layer copper foil |
| 07/22/2004 | DE10360441A1 Control circuit board e.g. for power distributor circuit in motor vehicles, has lateral recess coated with conductive layer, which is joined to control circuit board |
| 07/22/2004 | DE10357251A1 Montageanordnung für elektronische Bauteile A mounting assembly of electronic components |
| 07/22/2004 | DE10329657A1 Gedruckte Schaltkarte mit darin eingebetteten Kondensatoren und Verfahren zur Herstellung derselben Printed circuit board with embedded capacitors and methods for making same |
| 07/22/2004 | DE10309502A1 Lothügelstruktur und Verfahren zur Herstellung derselben Lothügelstruktur and methods for making the same |
| 07/22/2004 | DE10234585B4 Optoelektronisches SMD-Bauteil für den Empfang von elektromagnetischer Strahlung, insbesondere Sonnenlicht, und dessen Verwendung in einem Strahlungssensor An opto-electronic SMD component for receiving electromagnetic radiation, in particular sunlight, and its use in a radiation sensor |
| 07/22/2004 | DE102004001836A1 Schaltkreis-Trägerkörper und Verfahren zu dessen Herstellung Circuit-carrier body and process for its preparation |
| 07/22/2004 | DE10162749B4 Schaltungsanordnung Circuitry |
| 07/21/2004 | EP1439743A2 Process for applying conductive tracks on the surface of plastic moulded parts and the obtained moulded parts |
| 07/21/2004 | EP1439742A1 Manufacturing method for a circuit board for electronic apparatus |
| 07/21/2004 | EP1439581A2 Interconnection structure |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439209A1 Curable resin composition and cured product thereof |
| 07/21/2004 | EP1413004A4 Ball grid array antenna |
| 07/21/2004 | EP1360881B1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures |
| 07/21/2004 | EP1234189B1 Multi-layered electronic parts |
| 07/21/2004 | EP1222725A4 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 07/21/2004 | EP1175816B1 Method and device for placing components on substrates |
| 07/21/2004 | EP1166361A4 Apparatus and method for an integrated circuit having high q reactive components |
| 07/21/2004 | EP1092337A4 Apparatus and method for improving computer memory speed and capacity |
| 07/21/2004 | EP0985486B1 Leadless solder |
| 07/21/2004 | EP0961809A4 Low temperature method and compositions for producing electrical conductors |
| 07/21/2004 | CN2627735Y Radiator integrated solid relay |
| 07/21/2004 | CN1515071A Apparatus and method for tuning inter-stage mathching network of integrated multistage |
| 07/21/2004 | CN1515032A Ball grid array x-ray oreintation mark |
| 07/21/2004 | CN1515031A Process for mfg. of printed circuit boards with plated resistors |
| 07/21/2004 | CN1515012A Improved method for forming magnetic layers in printed circuit boards |
| 07/21/2004 | CN1514764A Ceramic multilayer substrate manufacturing method unfired composite multilayer body |
| 07/21/2004 | CN1514492A Semiconductor storage module |
| 07/21/2004 | CN1514449A Electric resistance material |
| 07/21/2004 | CN1158896C Apparatus including electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including printed circuit board having mating contacts |
| 07/21/2004 | CN1158751C Oscillation circuit and turning unit |
| 07/20/2004 | US6765805 Circuit component |
| 07/20/2004 | US6765804 Printed circuit interface to an I/O connector |
| 07/20/2004 | US6765800 Multiple channel modules and bus systems using same |
| 07/20/2004 | US6765451 Method and apparatus for shielding a component of an electronic component assembly from electromagnetic interference |
| 07/20/2004 | US6765406 Circuit board configured to provide multiple interfaces |
| 07/20/2004 | US6765298 Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads |
| 07/20/2004 | US6765288 Stacked chip mounting without special prepackaged unit |
| 07/20/2004 | US6765275 Two-layer electrical substrate for optical devices |
| 07/20/2004 | US6765152 Multichip module having chips on two sides |
| 07/20/2004 | US6764931 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 07/20/2004 | US6764747 Circuit board and method of producing the same |
| 07/20/2004 | US6764746 Low temperature-fired porcelain articles and electronic parts |
| 07/20/2004 | US6764344 Disc drive circuit board edge connector |
| 07/20/2004 | US6764325 Zero insertion force heat-activated retention pin |
| 07/20/2004 | US6764316 Straddle-mount electrical connector |
| 07/20/2004 | US6763994 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/20/2004 | US6763585 Method for producing micro bump |
| 07/20/2004 | US6763580 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
| 07/20/2004 | US6763575 Printed circuit boards having integrated inductor cores |
| 07/20/2004 | CA2328676C Plug connector |
| 07/20/2004 | CA2222857C Process to create metallic stand-offs on an electronic circuit |
| 07/15/2004 | WO2004059804A1 Flat cable harness |
| 07/15/2004 | WO2004059801A1 Interconnection system with improved high frequency performance |