| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/15/2004 | WO2004059797A1 An add-in card to backplane connecting apparatus |
| 07/15/2004 | WO2004058501A1 Method for producing aramid laminate |
| 07/15/2004 | WO2004025671A9 Electronic transformer/inductor devices and methods for making same |
| 07/15/2004 | WO2003084295A3 Inductor and decoupling structures for filters and design method thereof |
| 07/15/2004 | WO2003077313A3 Multilayered ceramic substrate for integrated power components and method for the production of said substrate |
| 07/15/2004 | US20040137803 Flanged terminal pins for dc/dc converters |
| 07/15/2004 | US20040137766 Connecting device for flexible electrical connection of circuit boards |
| 07/15/2004 | US20040137659 [method of fabricating a solder mask and structure of a substrate] |
| 07/15/2004 | US20040137372 Utilizes the dependence of the chemical etching rate on the controlled laser exposure dose for forming variable laser irradiated and crystallized regions of the exposed glass, that have variable etch rates dependent on laser irradiance |
| 07/15/2004 | US20040136725 Optical communication device |
| 07/15/2004 | US20040136335 Structure of circuit boards for wireless communication apparatus |
| 07/15/2004 | US20040136229 Arrangement of integrated circuits in a memory module |
| 07/15/2004 | US20040136169 Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device |
| 07/15/2004 | US20040136168 Techniques for reducing the number of layers in a multilayer signal routing device |
| 07/15/2004 | US20040136164 Systems and methods that use at least one component to remove the heat generated by at least one other component |
| 07/15/2004 | US20040136162 Heat dissipating device for electronic components of electronic control devices |
| 07/15/2004 | US20040136123 Circuit devices and method for manufacturing the same |
| 07/15/2004 | US20040136099 Printed circuit board assembly with multi-channel block-type optical devices packaged therein |
| 07/15/2004 | US20040135920 Camera case structure for a mobile communication device |
| 07/15/2004 | US20040135662 Electronic transformer/inductor devices and methods for making same |
| 07/15/2004 | US20040135656 Flex-circuit-based high speed transmission line |
| 07/15/2004 | US20040135445 Vibration motor holding apparatus and portable electronic equipment having the same |
| 07/15/2004 | US20040135269 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 07/15/2004 | US20040135258 Contact structure, display device and electronic device |
| 07/15/2004 | US20040135249 Semiconductor devices and substrates used in thereof |
| 07/15/2004 | US20040135243 Semiconductor device, its manufacturing method and electronic device |
| 07/15/2004 | US20040135240 Molded substrate stiffener with embedded capacitors |
| 07/15/2004 | US20040135239 EMI heatspreader/lid for integrated circuit packages |
| 07/15/2004 | US20040134974 Solder bump structure and method for forming a solder bump |
| 07/15/2004 | US20040134875 Circuit-parts sheet and method of producing a multi-layer circuit board |
| 07/15/2004 | US20040134685 Two signal one power plane circuit board |
| 07/15/2004 | US20040134684 Laminate comprised of flat conductor elements |
| 07/15/2004 | US20040134683 Waveguide |
| 07/15/2004 | US20040134681 Circuit board and its manufacturing method |
| 07/15/2004 | US20040134680 Use of perimeter stops to support solder interconnects between integrated circuit assembly components |
| 07/15/2004 | US20040134549 Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 07/15/2004 | DE202004006434U1 Circuit with circuit board carrying conductive grid for use in industrial technology, typically in car manufacture, with electric components |
| 07/15/2004 | DE19918084B4 Hochlastfähige Steuerungsanordnung für elektrische Komponenten High load capability control arrangement for electrical components |
| 07/15/2004 | DE19732223B4 Aggregateträger für elektrische Verbraucher, insbesondere Türaggregateträger für Kraftfahrzeugtüren Subframe for electrical loads, especially door subframe for motor vehicle doors |
| 07/15/2004 | DE19514646B4 Leicht hochrüstbarer Computer und dafür geeignete CPU-Platine Easy hochrüstbarer computer and suitable for this CPU board |
| 07/15/2004 | DE10357789A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 07/15/2004 | DE10300956B3 Bauelement mit Höchstfrequenzverbindungen in einem Substrat Component with high frequency links in a substrate |
| 07/15/2004 | DE10300462A1 Phosphormodifiziertes Epoxidharz A phosphorus-modified epoxy resin |
| 07/15/2004 | DE10300006A1 Elektrischer Verbinder und elektrische oder elektronische Baugruppe mit elektrischem Verbinder Electrical connectors and electrical or electronic assembly with electrical connector |
| 07/15/2004 | DE10260786A1 Flachkabelstrang Flat harness |
| 07/15/2004 | DE10260184A1 Memory module with in-built tester with electronic circuit board carrying numerous components with tester of electric functioning of components fitted on circuit board separately from memory components such that it generates control signal |
| 07/15/2004 | DE10260139A1 Kompaktes elektropneumatisches Mehrwegeventil The compact electro-pneumatic multiport valve |
| 07/14/2004 | EP1437930A2 Filtered electrical connector assembly for an overmolded electronic package |
| 07/14/2004 | EP1437928A1 Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring boards |
| 07/14/2004 | EP1437684A1 Module for a hybrid card |
| 07/14/2004 | EP1437378A1 Process for the valorization of waste epoxy resin materials |
| 07/14/2004 | EP1436839A2 Electronic unit, circuit design for the same, and production method |
| 07/14/2004 | EP1436605A1 Sensor substrate and method of fabricating same |
| 07/14/2004 | EP1436237A1 Bonding method and product |
| 07/14/2004 | EP1436142A1 Metal-containing web processed with a continuous etch process |
| 07/14/2004 | EP1208618B1 Control device and soldering method |
| 07/14/2004 | EP1040737B1 Arrangement for implementing a magnetic circuit on a circuit board |
| 07/14/2004 | CN2626189Y Connection lead structure for electronic component and circuit board |
| 07/14/2004 | CN2626188Y Connection lead structure for electronic component and circuit board |
| 07/14/2004 | CN2626186Y Rigid flexible base plate and camera using the same |
| 07/14/2004 | CN2626161Y Doublefaced plugging back plate |
| 07/14/2004 | CN1513285A Method and device for structuring printed circuit board |
| 07/14/2004 | CN1512935A Inkjet deposition apparatus and method |
| 07/14/2004 | CN1512919A Microdeposition apparatus |
| 07/14/2004 | CN1512918A Interchangeable microdeposition head apparatus and method |
| 07/14/2004 | CN1512917A Waveform generation for microdeposition control system |
| 07/14/2004 | CN1512810A Camera casing structure of mobile communication device |
| 07/14/2004 | CN1512579A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512578A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512569A Heat conductive multilayer substrate and substrate for power module |
| 07/14/2004 | CN1512568A Film carrier tape for electronic part and its producing method |
| 07/14/2004 | CN1512525A Capacitor and capacitor built-in circuit substrate and its producing method |
| 07/14/2004 | CN1157788C Electrostatic discharge protection device for high-density printed circuit board |
| 07/14/2004 | CN1157773C Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 07/14/2004 | CN1157714C Flex support and seal apparatus for disc drive |
| 07/14/2004 | CN1157355C Novel ester compound and themrosetting resin composition using the same |
| 07/14/2004 | CN1157298C Shell for thermal printing head |
| 07/13/2004 | US6762944 Deformation-resistant mounting structure of portable device |
| 07/13/2004 | US6762942 Break away, high speed, folded, jumperless electronic assembly |
| 07/13/2004 | US6762939 Thermal solution for a mezzanine card |
| 07/13/2004 | US6762925 Ceramic electronic component and method for making the same |
| 07/13/2004 | US6762913 Method for controlling common mode impedance in disk drive head suspensions |
| 07/13/2004 | US6762511 Thermosetting resin composition |
| 07/13/2004 | US6762503 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 07/13/2004 | US6762498 Reducing the signal reflection without endangering the mechanical stability of the substrate |
| 07/13/2004 | US6762494 Electronic package substrate with an upper dielectric layer covering high speed signal traces |
| 07/13/2004 | US6762489 Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
| 07/13/2004 | US6762434 Electrical print resolution test die |
| 07/13/2004 | US6762428 Cream solder inspection method and apparatus therefor |
| 07/13/2004 | US6762369 Multilayer ceramic substrate and method for manufacturing the same |
| 07/13/2004 | US6762368 Reducing inductance of a capacitor |
| 07/13/2004 | US6762367 Electronic package having high density signal wires with low resistance |
| 07/13/2004 | US6762366 Ball assignment for ball grid array package |
| 07/13/2004 | US6762362 Apparatus and method for connecting a power supply to multiple backplanes within an electronic equipment cabinet |
| 07/13/2004 | US6762237 Carbon tubes dispersed in polymer matrix; high energy capacitors |
| 07/13/2004 | US6762075 Semiconductor module and producing method therefor |
| 07/13/2004 | US6762073 Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material |
| 07/13/2004 | US6761963 Integrated thin film capacitor/inductor/interconnect system and method |
| 07/13/2004 | US6761790 Filling a through hole on a prepreg including a releasing resin film with a conductive paste containing a conductive filler; peeling said releasing resin film; laminating a metal foil; and heating and pressurizing the laminated product. |
| 07/13/2004 | US6761586 Board connector and method of attaching board connector |