Patents for H05K 1 - Printed circuits (98,583)
08/2004
08/19/2004US20040161626 Tape substrate and method for fabricating the same
08/19/2004US20040161620 Multilayer laminate; adhesive tapes; flexible printed circuits
08/19/2004US20040161612 Mixture of novolak epoxy resin, modified acrylonitrile-butadiene rubber, cresol-formaldehyde resin, phosphorus compound and filler
08/19/2004US20040161593 Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer
08/19/2004US20040160771 Concave cup printed circuit board for light emitting diode and method for producing the same
08/19/2004US20040160754 Circuit structural body and method for manufacturing the same
08/19/2004US20040160752 Electronic component built-in module and method of manufacturing the same
08/19/2004US20040160751 Printed circuit board and method of manufacturing printed circuit board
08/19/2004US20040160748 Portable apparatus
08/19/2004US20040160745 Printed board unit and electronic apparatus
08/19/2004US20040160721 Printed circuit board having inductive vias
08/19/2004US20040160377 Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials
08/19/2004US20040160300 ESD protection devices and methods of making same using standard manufacturing processes
08/19/2004US20040160287 Method and apparatus for rejecting common mode signals on a printed circuit board and method for making same
08/19/2004US20040159946 Microelectronic assemblies, electronic devices, and apparatuses for supporting microelectronic substrates
08/19/2004US20040159933 Electronic parts packaging structure and method of manufacturing the same
08/19/2004US20040159930 Semiconductor device, method of manufacturing the same, and electronic device using the semiconductor device
08/19/2004US20040159926 Semiconductor device
08/19/2004US20040159925 Semiconductor device and method for manufacture thereof
08/19/2004US20040159921 Connector structure with bond site configured to receive solder having at least two elongated members
08/19/2004US20040159915 Land grid array structures and methods for engineering change
08/19/2004US20040159913 Circuit device and method of manufacture thereof
08/19/2004US20040159710 Compact display assembly
08/19/2004US20040159462 Flexible dielectric electronic substrate and method for making same
08/19/2004US20040159461 Vehicle electronic control unit
08/19/2004US20040159460 Conductor structure
08/19/2004US20040159390 low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder; self-constraining layer containing a refractory ceramic and a wetting agent for the glass in the first layer; densification but no shrinkage on firing
08/19/2004US20040159257 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit
08/19/2004US20040158980 Component built-in module and method for producing the same
08/19/2004US20040158979 Method of manufacturing a semiconductor element-mounting board
08/19/2004US20040158978 Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB
08/19/2004DE202004004980U1 Parallelspeisungsband und biegsames Leuchtband Parallel feed belt and flexible lighting tape
08/19/2004DE10355142A1 Induktor mit resistivem Abschluß Inductor with resistive termination
08/19/2004DE10305520A1 Attenuation of cavity resonance generated in a multilayer hybrid electronic printed circuit board
08/19/2004DE10303446A1 Arrangement for protecting electronic components from electrostatic discharge uses components as lightning conductor that draws electrostatic charge away from electronic component to be protected
08/19/2004DE10301402A1 Electronic circuit board for checking and controlling the output from printing machinery, comprises a base module and one or more expansion modules for carrying out of a specific task
08/19/2004DE102004002696A1 Gehäuse für elektronische Schaltung A housing for electronic circuitry
08/19/2004DE10197260T5 Druckkopfpatrone mit asymmetrischen Kontakten Print Cartridge with asymmetric contacts
08/19/2004CA2515408A1 Direct mount led lamp
08/18/2004EP1448031A1 Concave cup printed circuit board for light emitting diode and method for producing the same
08/18/2004EP1447850A2 Electronic parts packaging structure and method of manufacturing the same
08/18/2004EP1447817A2 Electrically insulated ultrafine powder, process for producing same and resin composite material with high dielectric constant using same
08/18/2004EP1447712A1 METHODS OF PRODUCING PHOTOSENSITIVE CERAMIC COMPOSITION AND MULTI−LAYER SUBSTRATE USING IT
08/18/2004EP1447694A1 Optical via for transmission of signals through a printed circuit board
08/18/2004EP1447391A2 Oxide ceramic material, ceramic substrate employing the same, ceramic laminate device, and power amplifier module
08/18/2004EP1447280A2 Vehicle electronic control unit
08/18/2004EP1447214A1 Polyimide metal layered products and polyamideimide metal layered product
08/18/2004EP1446993A1 I-channel surface-mount connector with extended flanges
08/18/2004EP1446990A1 Multilayer flexible fr4 circuit
08/18/2004EP1446960A2 Telecommunications patch panel
08/18/2004EP1446834A2 Substrate design and process for reducing electromagnetic emission
08/18/2004EP1446251A1 Highly filled composites of powdered fillers and polymer matrix
08/18/2004EP1446238A2 Ultrasonic printed circuit board transducer
08/18/2004EP1446237A2 Manufacture having double sided features in a metal-containing web formed by etching
08/18/2004EP1389404B1 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
08/18/2004EP1325673B1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board
08/18/2004EP1295516B1 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures
08/18/2004EP1295337A4 Process for the manufacture of printed circuit boards with plated resistors
08/18/2004EP1230680B1 Method for integrating a chip in a printed board and integrated circuit
08/18/2004EP0871351B1 Female terminal
08/18/2004EP0839439B1 Method for forming fiducial mark in resin stencil and stencil formed thereby
08/18/2004CN1522557A Fabricating method for printed circuit board
08/18/2004CN1522326A Heat-resistant synthetic fiber sheet
08/18/2004CN1522316A Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
08/18/2004CN1522103A Electrostatic protection structure on circuit board and method thereof
08/18/2004CN1521911A Terminal box and welding method for printed circuit board of terminal box
08/18/2004CN1521884A High-frequency circuit
08/18/2004CN1521847A Electronic parts packaging structure and method of manufacturing the same
08/18/2004CN1521841A 半导体器件 Semiconductor devices
08/18/2004CN1521769A Formation of thin film resistors
08/18/2004CN1521768A Formation of thin film resistors
08/18/2004CN1521210A 环氧树脂组合物 The epoxy resin composition
08/18/2004CN1520974A Punching tool with re-usable, neutral structural groups
08/18/2004CN1163110C Vibrator holder
08/18/2004CN1162904C 半导体器件 Semiconductor devices
08/18/2004CN1162869C Conductive rubber
08/18/2004CN1162818C Indicator
08/18/2004CN1162274C Asymmetric tape auto-joining device
08/17/2004US6778406 Resilient contact structures for interconnecting electronic devices
08/17/2004US6778405 Power module adapter
08/17/2004US6778403 Wiring board having terminal
08/17/2004US6778389 Microelectronic package with tubular housing
08/17/2004US6778247 Method for cutting tape carrier packages of a LCD and LCD structure
08/17/2004US6778198 Glass substrate printed wiring board printhead for electric paper
08/17/2004US6778197 Image forming apparatus
08/17/2004US6778142 Electronic device and a circuit arrangement
08/17/2004US6778058 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate
08/17/2004US6778043 Method and apparatus for adding inductance to printed circuits
08/17/2004US6777821 Ball grid array x-ray orientation mark
08/17/2004US6777804 Flip-chip package substrate
08/17/2004US6777798 Stacked semiconductor device structure
08/17/2004US6777795 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
08/17/2004US6777794 Circuit mounting method, circuit mounted board, and semiconductor device
08/17/2004US6777789 Mounting for a package containing a chip
08/17/2004US6777622 Wiring boards
08/17/2004US6777621 Flat panel display module and method of manufacturing the same
08/17/2004US6777620 Circuit board
08/17/2004US6777612 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
08/17/2004US6777525 Flexibility, toughness, chemical and heat resistance; multilaye rprinted circuit
08/17/2004US6777105 Part