| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/27/2004 | WO2004017703A3 Method for forming printing inspection data |
| 05/27/2004 | WO2003058719B1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof |
| 05/27/2004 | US20040103383 Design, layout and method of manufacture for a circuit that taps a differential signal |
| 05/27/2004 | US20040102093 Electronic device having a USB connector |
| 05/27/2004 | US20040102073 Cam bumplett apparatus and system |
| 05/27/2004 | US20040101995 Method for manufacturing circuit devices |
| 05/27/2004 | US20040101994 Reducing line to line capacitance using oriented dielectric films |
| 05/27/2004 | US20040101993 Component connections using bumps and wells |
| 05/27/2004 | US20040101696 Double-sided copper clad laminate and method for manufacturing the same |
| 05/27/2004 | US20040101689 Hardener composition for epoxy resins |
| 05/27/2004 | US20040101626 Solution polymerization; solvent extraction; imidation; reduced dielectric constant; for use in electronics/printed circuits |
| 05/27/2004 | US20040101620 Method for aluminum metalization of ceramics for power electronics applications |
| 05/27/2004 | US20040101190 Characteristic amount calculating device for soldering inspection |
| 05/27/2004 | US20040100781 Optically connectable circuit board with optical component(s) mounted thereon |
| 05/27/2004 | US20040100780 Motherboard power-leveler |
| 05/27/2004 | US20040100778 Power converter package and thermal management |
| 05/27/2004 | US20040100754 Enhanced high-frequency via interconnection for improved reliability |
| 05/27/2004 | US20040100608 Circuit substrate, manufacturing method thereof, electro-optical device, and electronic apparatus |
| 05/27/2004 | US20040100292 Socketless/boardless test interposer card |
| 05/27/2004 | US20040100233 Method for eliminating noise interference and acoustic noise by printed circuit board ground plane layout |
| 05/27/2004 | US20040099999 Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| 05/27/2004 | US20040099960 Economical high density chip carrier |
| 05/27/2004 | US20040099958 Crack resistant interconnect module |
| 05/27/2004 | US20040099942 Ceramic multilayer substrate and method for manufacturing the same |
| 05/27/2004 | US20040099848 Use of conductor compositions in electronic circuits |
| 05/27/2004 | US20040099716 Solder joint reliability by changing solder pad surface from flat to convex shape |
| 05/27/2004 | US20040099647 Laser trimming of resistors |
| 05/27/2004 | US20040099646 Laser trimming of annular passive components |
| 05/27/2004 | US20040099440 Technique for accommodating electronic components on a multiplayer signal routing device |
| 05/27/2004 | US20040099439 Circuit board |
| 05/27/2004 | US20040099438 Electrode or circuit pattern; overcoating carbon, impregnating with binder; curing |
| 05/27/2004 | US20040099374 Binders comprising condensation polymers used for lamination of flexible circuits and packaging electronics |
| 05/27/2004 | US20040099368 Transfer printing |
| 05/27/2004 | US20040099364 Method of producing a composite sheet and method of producing a laminate by using the composite sheet |
| 05/27/2004 | DE29924634U1 Electrical control circuit arrangement for control module, has circuit carrier substrate having printed circuit formed crossing electrically conductive path formed by bonding wire and another printed circuit |
| 05/27/2004 | DE20300806U1 Powerful LED lamp with at least two circuit boards, carrying numerous LEDs secured to lamp cap, with second circuit board mounted in spaced manner from first circuit board surface fitted with LEDs |
| 05/27/2004 | DE10350829A1 Production of multiple layer made from unfired ceramic comprises applying thin layer on ceramic, and partially removing after functional structures are applied |
| 05/27/2004 | DE10348652A1 Messsonde, insbesondere für eine Vorrichtung zur Messung der Dicke dünner Schichten Measuring probe, in particular for an apparatus for measuring the thickness of thin layers |
| 05/27/2004 | DE10344494A1 Störschutzverfahren für Motorsteuerungsmodule Störschutzverfahren for engine control modules |
| 05/27/2004 | DE10229120B4 Verfahren, Adapterkarte und Anordnung zum Einbau von Speichermodulen Method, adapter card and arrangement for installation of memory modules |
| 05/27/2004 | DE10121970B4 Leistungshalbleitermodul in Druckkontaktierung Power semiconductor module in pressure contact |
| 05/27/2004 | CA2505396A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 05/26/2004 | EP1422985A1 A method of supporting electronic components and an electronic device with elestic support for an electronic component |
| 05/26/2004 | EP1422981A2 Packaging and thermal management in electronic apparatus |
| 05/26/2004 | EP1422717A1 Memory system and memory subsystem |
| 05/26/2004 | EP1422261A2 Flame-retardant thermosetting resin composition |
| 05/26/2004 | EP1422208A1 MICROWAVE DIELECTRIC COMPOSITE COMPOSITION . |
| 05/26/2004 | EP1422207A1 Microwave dielectric composition and method for producing the same |
| 05/26/2004 | EP1422196A1 Method for producing spherical oxide powder and apparatus for producing spherical powder, composite dielectric material, and substrate and process for producing substrate |
| 05/26/2004 | EP1422055A1 Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| 05/26/2004 | EP1421834A1 Component arrangement |
| 05/26/2004 | EP1421618A2 Power electronics component |
| 05/26/2004 | EP1421617A2 Power electronics component |
| 05/26/2004 | EP1421549A1 A pin pad |
| 05/26/2004 | EP1421041A2 Dielectric ceramic composition |
| 05/26/2004 | EP1420949A1 Solid sheet material especially useful for circuit boards |
| 05/26/2004 | EP1420928A1 Grinding of liquid crystalline polymers |
| 05/26/2004 | EP1354237A4 Fat conductor |
| 05/26/2004 | EP1127387A4 Non-circular micro-via |
| 05/26/2004 | EP1034193A4 Phenol-novolacs with improved optical properties |
| 05/26/2004 | CN1500372A Laminate for formation of capacitor layer and method for prodn. thereof |
| 05/26/2004 | CN1500296A Electrically conductive patterns, antennas and methods of manufacture |
| 05/26/2004 | CN1500278A Compsn. for filling through-holes in printed wiring boards |
| 05/26/2004 | CN1500277A Use of conductor compsns. in electronic circuits |
| 05/26/2004 | CN1500276A Conductive paste, article produced therewith with conductive coating on glass, ceramics or enameled steel and method for production thereof |
| 05/26/2004 | CN1499914A Structure for installing magnetic core winding on service |
| 05/26/2004 | CN1499913A Wiring board and its mfg. method |
| 05/26/2004 | CN1499617A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499616A Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 05/26/2004 | CN1499596A Mfg. method of assembly set with electronic component and mfg. method for related products |
| 05/26/2004 | CN1499591A Encapsulation structure of electronic component and its mfg. method |
| 05/26/2004 | CN1499544A Flat capacitor and IC socket using same, making method of such capacitor |
| 05/26/2004 | CN1499432A 非接触通信介质 Noncontact communication medium |
| 05/26/2004 | CN1499273A Circuit substrate, its mfg. method, electrooptical device and electronic appliance |
| 05/26/2004 | CN1499246A Electronic building block and its mfg. method |
| 05/26/2004 | CN1498749A Super-thin copper foil with carrier, its mfg. method and printed wiring base plate |
| 05/26/2004 | CN1151707C Laminating method and product of 8-layer printed circuit board |
| 05/26/2004 | CN1151556C Piezoelectric vibrator and production method for piezoelectric vibrator |
| 05/26/2004 | CN1151535C Ion reflection comprising flexible printed circuit board |
| 05/26/2004 | CN1151374C Self-addressable self-assembling microelectronic system and devices for molecular biological analysis and diagnostics |
| 05/26/2004 | CN1151202C Thermosetting resin composition use in ink stocking method |
| 05/26/2004 | CN1151009C Fabricating interconnects and tips using sacrificial substrates |
| 05/25/2004 | US6742144 Local heating of memory modules tested on a multi-motherboard tester |
| 05/25/2004 | US6741480 Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems |
| 05/25/2004 | US6741478 Compact electronic circuit unit having circulator, manufactured with high productivity |
| 05/25/2004 | US6741471 Expansion board apparatus and removing method |
| 05/25/2004 | US6741315 Liquid crystal device and electronic apparatus |
| 05/25/2004 | US6741221 Low cost antennas using conductive plastics or conductive composites |
| 05/25/2004 | US6741148 High efficiency coupled line filters |
| 05/25/2004 | US6741122 Routing technique to adjust clock skew using frames and prongs |
| 05/25/2004 | US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 05/25/2004 | US6740984 Ball grid array chip packages having improved testing and stacking characteristics |
| 05/25/2004 | US6740983 Efficient burn in |
| 05/25/2004 | US6740975 Wiring substrate having no through holes formed in wiring correspondence regions |
| 05/25/2004 | US6740973 Stacked structure for an image sensor |
| 05/25/2004 | US6740965 Flip-chip package substrate |
| 05/25/2004 | US6740964 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 05/25/2004 | US6740962 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 05/25/2004 | US6740824 Ground connector assembly with substrate strain relief and method of making same |
| 05/25/2004 | US6740822 Printed circuit board having footprints, circuit module having a printed circuit board, and method of manufacturing a printed circuit board |