Patents for H05K 1 - Printed circuits (98,583)
08/2004
08/10/2004US6774931 Inspection method and device by movement of the field of view of the camera
08/10/2004US6774887 Joystick
08/10/2004US6774741 Non-uniform transmission line and method of fabricating the same
08/10/2004US6774640 Substrate having reference point connected with layer being evaluated for shift of inner layer traces, and test points at distance from reference point; measuring presence of short between reference and test points indicates amount of shift
08/10/2004US6774500 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment
08/10/2004US6774493 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products
08/10/2004US6774492 Chip package assembly having chip package mounted on printed circuit board
08/10/2004US6774486 Circuit boards containing vias and methods for producing same
08/10/2004US6774483 Semiconductor assembly with a semiconductor module
08/10/2004US6774475 Vertically stacked memory chips in FBGA packages
08/10/2004US6774327 Hermetic seals for electronic components
08/10/2004US6774316 Wiring board and production method thereof
08/10/2004US6774314 Electronic device and coupler
08/10/2004US6774160 Curable epoxy resin compositions and the cured residues thereof
08/10/2004US6774021 Pattern forming method and pattern forming device
08/10/2004US6773957 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
08/10/2004US6773866 Aromatic polyimide precursor, wherein a 10 mu m thick polyimide film made from the resin and deposited on a silicon substrate has light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 mpa.
08/10/2004US6773848 Arrangement of electrochemical cells and circuit board
08/10/2004US6773827 Multilayer exterior electrodes
08/10/2004US6773572 Overcoating porous resin; plating; semiconductor
08/10/2004US6773533 Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
08/10/2004US6773281 Strain relief for flexible circuit
08/10/2004US6773273 Electrical card connector assembly
08/10/2004US6773267 Electronic assembly having a removable power supply
08/10/2004US6772515 Method of producing multilayer printed wiring board
08/10/2004US6772511 Method for producing a semiconductor device
08/06/2004CA2456850A1 Flexible heater for heating electrical components in operator control handle
08/05/2004WO2004066699A1 Multi-layer ceramic substrate and method for manufacture thereof
08/05/2004WO2004066694A1 Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
08/05/2004WO2004066692A1 Placement of a camera module in a portable device
08/05/2004WO2004066691A1 Circuit board device and method for interconnecting wiring boards
08/05/2004WO2004066444A1 A tile for an antenna array
08/05/2004WO2004066431A1 Flex-circuit-based high speed transmission line
08/05/2004WO2004066408A1 Metal layer of an electronic component and method for the production thereof
08/05/2004WO2004066364A2 Binder diffusion patterning of a thick film paste layer
08/05/2004WO2004066316A1 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same
08/05/2004WO2004065489A1 Composite deelectric material and substrate
08/05/2004WO2004065325A1 Dielectric ceramic composition, dielectric ceramic and laminated ceramic part including the same
08/05/2004WO2004064965A1 Transmitter for wireless control
08/05/2004WO2004004017A3 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof
08/05/2004US20040152848 Curable resin composition and cured product thereof
08/05/2004US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
08/05/2004US20040152345 Process for applying conductor tracks to the surface of plastics moldings, and the resultant moldings
08/05/2004US20040151978 Method and apparatus for direct-write of functional materials with a controlled orientation
08/05/2004US20040151925 Ceramic containing alumina; low temperature sintering; heat conductivity
08/05/2004US20040151893 Low temperature method and composition for producing electrical conductors
08/05/2004US20040151882 Wiring board with core layer containing inorganic filler
08/05/2004US20040151419 PCB embedded and surface mounted optical distribution systems
08/05/2004US20040151080 Magneto-optical head and magneto-optical storage device
08/05/2004US20040150977 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board
08/05/2004US20040150970 Impedance matching of differential pair signal traces on printed wiring boards
08/05/2004US20040150969 High speed circuit board and method for fabrication
08/05/2004US20040150966 Integrated library core for embedded passive components and method for forming electronic device thereon
08/05/2004US20040150965 Information-processing device having a crossbar-board connected to back panels on different sides
08/05/2004US20040150964 Information-processing device having a crossbar-board connected to back panels on different sides
08/05/2004US20040150961 System and method for configuring a circuit
08/05/2004US20040150954 Power module for multi-chip printed circuit boards
08/05/2004US20040150946 Electronic units and method for packaging and assembly of said electronic units
08/05/2004US20040150931 Control device
08/05/2004US20040150812 Mounting information-collecting device, connector, and mounting information-collecting method
08/05/2004US20040150565 Printed circuit board dipole antenna structure with impedance matching trace
08/05/2004US20040150562 Printed circuit board antenna structure
08/05/2004US20040150494 Transmission line type components
08/05/2004US20040150487 Semi-suspended coplanar waveguide on a printed circuit board
08/05/2004US20040150486 Method and apparatus for improving signal integrity in a high speed flex cable
08/05/2004US20040150388 Testing method for a printed circuit board formed with conductive traces for high-frequency diferential signal transmission
08/05/2004US20040150116 Thermal enhance MCM package
08/05/2004US20040150114 Multi-chip electronic package having laminate carrier and method of making same
08/05/2004US20040150107 Stack package and fabricating method thereof
08/05/2004US20040150105 Contact structure for reliable metallic interconnection
08/05/2004US20040150101 Information handling system
08/05/2004US20040150095 Multilayer; carrier and semiconductive chips; electroconductive and dielectric layers
08/05/2004US20040149890 Surface-mounting type optical device
08/05/2004US20040149689 Method for producing metal/ceramic bonding substrate
08/05/2004US20040149585 Electroplating copper bottom layer, depositing insulation pattern and forming permeable core; adding polyimide vias and insulation then filling; forming top metal lines staggered with bottom lines and topping with protective layer
08/05/2004US20040149583 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
08/05/2004US20040149490 Coaxial via hole and process of fabricating the same
08/05/2004US20040149489 Electronic module and method for assembling same
08/05/2004US20040149488 Flat flex cable
08/05/2004US20040149478 Electronic units and method for packaging and assembly of said electronic units
08/05/2004US20040149368 Process for the constrained sintering of asymmetrically configured dielectric layers
08/05/2004US20040148765 Electronic package repair process
08/05/2004DE202004003471U1 Circuit board arrangement for liquid crystal display has connecting arrangements for selectively connecting expanded I/O daughter board and tuner daughter board to main board
08/05/2004DE10317403A1 Verfahren zur Verklebung von FPCB's A method for bonding FPCB's
08/05/2004DE10304190A1 Elektrisches Kombiinstrument Electric instrument cluster
08/05/2004DE10303956A1 Leiterplattenanordnung Printed circuit board assembly
08/05/2004DE10303950A1 Steuerelektronik für ein Flurförderzeug, insbesondere deichselgeführtes Flurförderzeug Control electronics for a truck, especially drawbar-run truck
08/05/2004DE10303294A1 Connector for electric or electronic implement, e.g. smoke alarm, radio, compact disc player, shaver etc., supplied selectively from battery or network adapter, via intermediate decoupling diodes, containing extra circuit board
08/05/2004DE10303263A1 Sensor module contains sealing arrangement that acoustically isolates microphone so that detection is only possible in direction perpendicular to active surface over opening in circuit board
08/05/2004DE10302104A1 Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen A method for manufacturing of circuit carriers with integrated passive components
08/05/2004DE10297040T5 Elektrostatische Entladungsgerät für Netzwerksysteme Electrostatic discharge device for network systems
08/04/2004EP1443812A2 Device for circuit board
08/04/2004EP1443811A2 High speed circuit board and method for fabrication
08/04/2004EP1443809A2 Electronic circuit unit and method for manufacturing the same
08/04/2004EP1443666A2 Multiband high-frequency switching module
08/04/2004EP1443619A1 Stripping of flat conductors
08/04/2004EP1443599A1 Printed circuit board dipole antenna structure with impedance matching trace
08/04/2004EP1443591A1 Printed circuit board antenna structure
08/04/2004EP1443561A2 Stacked chip electronic package having laminate carrier and method of making same
08/04/2004EP1443560A2 Multi-chip electronic package having laminate carrier and method of making same