| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/13/2004 | US20040090760 Electrical connecting element and method of fabricating the same |
| 05/13/2004 | US20040090758 Multi-layered semiconductor device and method of manufacturing same |
| 05/13/2004 | US20040090757 Printed circuit board |
| 05/13/2004 | US20040090755 Small and securely-soldered electronic unit |
| 05/13/2004 | US20040090753 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 05/13/2004 | US20040090748 Printed circuit board and method for installing printed circuit board onto electro-conductive housing |
| 05/13/2004 | US20040090732 Plated terminations |
| 05/13/2004 | US20040090567 Liquid crystal display module and an assembly method therefor |
| 05/13/2004 | US20040090415 Rear electrode structures for electrophoretic displays |
| 05/13/2004 | US20040090381 Low-loss printed circuit board antenna structure and method of manufacture thereof |
| 05/13/2004 | US20040090380 Electrically conductive patterns, antennas and methods of manufacture |
| 05/13/2004 | US20040090291 Method and apparatus for refurbishing analog set top box to provide digital set top box and optional DOCSIS cable modem capability |
| 05/13/2004 | US20040090289 Method of detuning resonant frequencies of a power distribution system |
| 05/13/2004 | US20040089948 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 05/13/2004 | US20040089945 Semiconductor device |
| 05/13/2004 | US20040089943 First and second ceramic substrates housed in a case. The first ceramic substrate has electronic components including a semiconductor component mounted on its surface. The second ceramic substrate is fixed to the top face of the |
| 05/13/2004 | US20040089906 Image sensor structure |
| 05/13/2004 | US20040089700 Preconditioning via plug material for a via-in-pad ball grid array package |
| 05/13/2004 | US20040089472 Multilayer ceramic substrate, its production method, and apparatus used for its production |
| 05/13/2004 | US20040089471 Printed circuit board and method of manufacturing the same |
| 05/13/2004 | US20040089470 Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/13/2004 | US20040089432 Non-woven sheet of aramid floc |
| 05/13/2004 | US20040089413 System and method for modifying electronic design data |
| 05/13/2004 | DE202004003635U1 Electrotechnical component for telecommunications and/or data transfer systems comprises a first rigid installation plate and a second flexible installation plate with embedded strip conductors |
| 05/13/2004 | DE19939933B4 Elektronische Leistungs-Moduleinheit Electronic power module unit |
| 05/13/2004 | DE10347460A1 Circuit board used in electronic devices has a communication circuit which communicates with an external device without using wires, and a storage unit |
| 05/13/2004 | DE10250968A1 Electric LED lighting unit for a motor vehicle has a printed circuit board and a circuit structure with a dampness sensor |
| 05/13/2004 | DE10250758A1 Thermomechanical micro-valve with state signaling has dual stable state bi-metallic or shape memory alloy snap element in hollow volume between circuit boards joined e.g. by multilayering or adhesive |
| 05/13/2004 | DE10250697A1 Circuit board for a power electronics component, e.g. for a motor vehicle control system, has heat conductors that are connected through the circuit board to conduct heat away to a heat sink |
| 05/13/2004 | DE10250674A1 Mirror-symmetrical electronic module for required mirror-symmetrical applications with circuit board and electronic circuit with electronic components and conductive tracks |
| 05/13/2004 | DE10250156A1 Speichermodul und Speicheranordnung mit abzweigfreien Signalleitungen und verteilten kapazitiven Lasten Memory module and the memory array with feeder-free signal lines and distributed capacitive loads |
| 05/13/2004 | DE10248020A1 Verfahren und Vorrichtung zum Fügen von zumindest zwei Bauteilen Method and apparatus for assembling at least two components |
| 05/13/2004 | CA2473976A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 05/12/2004 | EP1418798A2 Printed circuit board and method for installing printed circuit board onto electro-conductive housing |
| 05/12/2004 | EP1418797A2 Wiring board and process of producing the same |
| 05/12/2004 | EP1418679A1 Multiband high-frequency switching module |
| 05/12/2004 | EP1418645A1 Terminal fitting and printed circuit boards assembly |
| 05/12/2004 | EP1418616A1 Electronic parts packaging structure and method of manufacturing the same |
| 05/12/2004 | EP1418536A1 Method for field programming radio frequency identification devices that control remote control devices |
| 05/12/2004 | EP1418535A1 Method and apparatus for field programming radio frequency identification devices |
| 05/12/2004 | EP1418534A1 Method for field programming radio frequency document identification devices |
| 05/12/2004 | EP1418410A1 Flexible wired circuit board for temperature measurement |
| 05/12/2004 | EP1418203A1 High strength conductive polymers |
| 05/12/2004 | EP1417871A2 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 05/12/2004 | EP1417362A1 Yarn of ethylene/tetrafluoroethylene copolymer |
| 05/12/2004 | EP1310036B1 Energy supply unit for transmitting auxiliary energy to an electrical device |
| 05/12/2004 | EP1135783A4 Capacitance-coupled high dielectric constant embedded capacitors |
| 05/12/2004 | EP1123512B1 High density printed circuit board |
| 05/12/2004 | EP1060213B1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures |
| 05/12/2004 | EP0792463B1 Mounting spring elements on semiconductor devices |
| 05/12/2004 | CN2616004Y Electric power apparatus with conducting copper bus |
| 05/12/2004 | CN2615786Y Modular field signal interface fastener for dispersion controlling system |
| 05/12/2004 | CN1496670A Manufacture of printed circuits using single layer processing techniques |
| 05/12/2004 | CN1496669A Laminate comprised of flat conductor elements |
| 05/12/2004 | CN1496571A Capacitor, laminated capacitor and capacitor built-in board |
| 05/12/2004 | CN1496218A Power miniature assembly and its mfg. method |
| 05/12/2004 | CN1496214A Transformer and transformer unit with said transformer |
| 05/12/2004 | CN1496213A Technique for reducing number of layers of multilayer circuit board |
| 05/12/2004 | CN1495870A Composite intermediate connection element of microelectronic component and its making method |
| 05/12/2004 | CN1495736A 光学头装置及其调整方法 The optical head apparatus and adjustment method |
| 05/12/2004 | CN1495686A 显示装置 Display device |
| 05/12/2004 | CN1495435A Printed circuit board with integrated two-axis fulxgate sensor and its making method |
| 05/12/2004 | CN1494966A Method for mfg. metal powder |
| 05/12/2004 | CN1149907C A method and a device for shielding of electronic components on a circuit board |
| 05/12/2004 | CN1149906C Vibrator holder |
| 05/12/2004 | CN1149905C Multi-layered printed circuit board |
| 05/12/2004 | CN1149667C High thermal conductivity silicon nitride circuit substrat, and semiconductor device using the same |
| 05/12/2004 | CN1149666C Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 05/12/2004 | CN1149538C Circuit substrate, circuit-formed suspension substrate, and production methods therefor |
| 05/12/2004 | CN1149242C Soldifiable resin composition, solidified resin and resistance body |
| 05/11/2004 | US6735092 Expansion board apparatus |
| 05/11/2004 | US6735088 Circuit board protection cover and circuit board having circuit board protection cover |
| 05/11/2004 | US6735087 Module and surface-mounted module |
| 05/11/2004 | US6735052 Hard disk drive suspension with integral flexible circuit |
| 05/11/2004 | US6734941 Liquid crystal display device |
| 05/11/2004 | US6734776 Flex circuit relay |
| 05/11/2004 | US6734750 Surface mount crossover component |
| 05/11/2004 | US6734665 Inductive sensor having a sensor coil in the form of a structured conductive layer |
| 05/11/2004 | US6734570 Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
| 05/11/2004 | US6734557 Semiconductor device |
| 05/11/2004 | US6734555 Integrated circuit package and printed circuit board arrangement |
| 05/11/2004 | US6734544 Integrated circuit package |
| 05/11/2004 | US6734542 Component built-in module and method for producing the same |
| 05/11/2004 | US6734540 Semiconductor package with stress inhibiting intermediate mounting substrate |
| 05/11/2004 | US6734539 Stacked module package |
| 05/11/2004 | US6734534 Microelectronic substrate with integrated devices |
| 05/11/2004 | US6734375 Central portion of porous sheet is not impregnated with resin from laminated resin layer; dielectrics; accuracy |
| 05/11/2004 | US6734373 Through hole insertion type electronic component and method of packaging same |
| 05/11/2004 | US6734370 Multilayer modules with flexible substrates |
| 05/11/2004 | US6734369 Surface laminar circuit board having pad disposed within a through hole |
| 05/11/2004 | US6734276 Polyimide and circuit substrate comprising the same |
| 05/11/2004 | US6734029 Method for forming conductive film pattern, and electro-optical device and electronic apparatus |
| 05/11/2004 | US6733954 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module |
| 05/11/2004 | US6733890 Integrated ceramic module and microwave dielectric composition |
| 05/11/2004 | US6733871 Process for producing ceramic member for bonding, ceramic member for bonding, vacuum switch, and vacuum vessel |
| 05/11/2004 | US6733868 Substrate for forming specific pattern, and method for manufacturing same |
| 05/11/2004 | US6733822 Firing an aluminum nitride molding having at least one highly isolated through-hole for via hole formation; specified shrinkage factor; noncracking |
| 05/11/2004 | US6733698 Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions |
| 05/11/2004 | US6733691 Liquid crystal polyester resin composition |
| 05/11/2004 | US6733148 Spread illuminating apparatus with flexible printed circuit |