| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/19/2004 | CN1498060A Connecting method of printed circuit board |
| 05/19/2004 | CN1498059A Multi-layer structure unit and its manufacturing method |
| 05/19/2004 | CN1498058A Printed circuit board, combined substrate, manufacturing method of printed circuit board and electronic device |
| 05/19/2004 | CN1497851A High-frequency switch |
| 05/19/2004 | CN1497793A Connecting structure between flexible circuit board and printed circuit board |
| 05/19/2004 | CN1497717A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497712A Circuit device and its manufacturing method |
| 05/19/2004 | CN1497711A Aluminium-ceramic combined component |
| 05/19/2004 | CN1497710A Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device |
| 05/19/2004 | CN1497709A Circuit substrate, installing structure of solder ball network display and electro-light device |
| 05/19/2004 | CN1497693A Belt for carrying automatic welding |
| 05/19/2004 | CN1497691A Manufacturing method of circuit device |
| 05/19/2004 | CN1497690A Manufacturing method of circuit device |
| 05/19/2004 | CN1497689A Chip on film semiconductor device and its manufacturing method |
| 05/19/2004 | CN1497688A Manufacturing method of circuit device |
| 05/19/2004 | CN1497687A Manufacturing method of circuit device |
| 05/19/2004 | CN1497627A Common backed ceramic capacitor for printed-wiring board and its manufacturing method |
| 05/19/2004 | CN1497536A Magnetic head universal rack assembly and its making method |
| 05/19/2004 | CN1497506A Distributing substrate and its manufacturing method |
| 05/19/2004 | CN1497300A 图像显示装置 The image display apparatus |
| 05/19/2004 | CN1496820A Layer structure, its making method and its application |
| 05/19/2004 | CN1150808C Device and method in electronics line systems |
| 05/19/2004 | CN1150613C Organic chip carriers for wire bond-type chip |
| 05/19/2004 | CN1150605C Probe card for testing integrated circuit chip |
| 05/19/2004 | CN1150604C Flat multi-layer ceramic component with subadjacent grooves |
| 05/19/2004 | CN1150277C Novel polymide copolymer and metal laminate contg. same |
| 05/19/2004 | CN1150244C Epoxy resin compsn. and its laminated product |
| 05/19/2004 | CN1150079C Anti-welding composition and printed-circuit board |
| 05/18/2004 | USRE38516 Liquid crystal display with casing structure |
| 05/18/2004 | US6738919 Signal trace phase delay |
| 05/18/2004 | US6738915 System for supplying multiple voltages to devices on circuit board through a sequencing in a predictable sequence |
| 05/18/2004 | US6738600 Ceramic microelectromechanical structure |
| 05/18/2004 | US6738505 Method and apparatus for detecting solder paste deposits on substrates |
| 05/18/2004 | US6738463 Splitter assembly with inverted pots and line connectors |
| 05/18/2004 | US6738251 Metal powder containing not less than 95 mass % of ag, a sintering restrainer containing cr and/or cr compound, a dielectric loss conditioner containing mn and/or mn compound, and a vehicle |
| 05/18/2004 | US6738249 Universal energy conditioning interposer with circuit architecture |
| 05/18/2004 | US6738030 Display device using COF |
| 05/18/2004 | US6737945 Digital broadcast receiving tuner suitable for miniaturization by placing tuner units on oppos surfaces on a board |
| 05/18/2004 | US6737932 Broadband impedance transformers |
| 05/18/2004 | US6737770 Brushless motor |
| 05/18/2004 | US6737752 Flip-chip package containing a chip and a substrate having differing pitches for electrical connections |
| 05/18/2004 | US6737749 Resistive vias for controlling impedance and terminating I/O signals at the package level |
| 05/18/2004 | US6737741 Process for mounting electronic device and semiconductor device |
| 05/18/2004 | US6737740 High performance silicon contact for flip chip |
| 05/18/2004 | US6737738 Multi-level package for a memory module |
| 05/18/2004 | US6737589 Flexible printed wiring board |
| 05/18/2004 | US6737588 Processes for manufacturing flexible wiring boards and the resulting flexible wiring board |
| 05/18/2004 | US6737586 Flat cable and a manufacturing method therefor |
| 05/18/2004 | US6737374 Use of zeolites in preparing low temperature ceramics |
| 05/18/2004 | US6737179 Electronically tunable dielectric composite thick films and methods of making same |
| 05/18/2004 | US6737165 Melt flow index greater than 0.25 g/10 min; stress at break of greater than 15 mpa; |
| 05/18/2004 | US6737158 Porous polymeric membrane toughened composites |
| 05/18/2004 | US6737153 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 05/18/2004 | US6736723 Arcade game having interchangeable features |
| 05/18/2004 | US6736681 Communications connector that operates in multiple modes for handling multiple signal types |
| 05/18/2004 | US6736678 Memory card interface adapter |
| 05/18/2004 | US6736665 Contact structure production method |
| 05/18/2004 | US6736657 Device for transmitting electric current between two components of a steering device for motor vehicles |
| 05/18/2004 | US6736647 Printed circuit board connector |
| 05/18/2004 | US6736552 Optically interconnecting integrated circuit chips |
| 05/18/2004 | US6736306 Semiconductor chip package comprising enhanced pads |
| 05/18/2004 | US6736058 Uphill screen printing in the manufacturing of microelectronic components |
| 05/18/2004 | US6735865 Forming a photo-polymer layer by coating, exposing, development, and post-curing in sodium carbonate solution |
| 05/18/2004 | US6735857 Method of mounting a BGA |
| 05/13/2004 | WO2004040953A1 Holding/convey jig and holding/convey method |
| 05/13/2004 | WO2004040949A1 Printed circuit board for mobile telephones |
| 05/13/2004 | WO2004040948A1 Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040944A1 Transparent window with non-transparent contact surface for a soldering bonding |
| 05/13/2004 | WO2004040829A2 High spread highly randomized generatable interleavers |
| 05/13/2004 | WO2004040701A2 Electrical adapter for protecting electrical interfaces |
| 05/13/2004 | WO2004040691A1 Antenna-equipped printed circuit board |
| 05/13/2004 | WO2004040604A1 Copper foil with dielectric layer for formation of capacitor layer, copper-clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for producing such copper foil with dielectric layer for formation of capacitor layer |
| 05/13/2004 | WO2004040599A1 A circuit board with a planar magnetic element |
| 05/13/2004 | WO2004040342A1 Optical slab waveguide interchip communication bus and synchronisation method |
| 05/13/2004 | WO2004040290A1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 05/13/2004 | WO2004040287A1 Method of manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040285A2 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors |
| 05/13/2004 | WO2004040005A1 Cooling stations for use in a web printing process for the manufacture of electrochemical sensors |
| 05/13/2004 | WO2004039898A1 Ink composition and method for use thereof in the manufacturing of electrochemical sensors |
| 05/13/2004 | WO2004039897A2 Process for making an electrochemical sensor |
| 05/13/2004 | WO2004039600A2 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 05/13/2004 | WO2004039532A1 Method for punching holes in a polymeric glass fibre reinforced substrate |
| 05/13/2004 | WO2003096384A3 Conductive ink |
| 05/13/2004 | WO2003084861A3 Method of manufacturing an electronic device in a cavity with a cover |
| 05/13/2004 | WO2003069969A3 High density 3-d integrated circuit package |
| 05/13/2004 | US20040092141 Electronic system modules and method of fabrication |
| 05/13/2004 | US20040092139 Electronic device with integral connectors |
| 05/13/2004 | US20040092138 Offset stackable pass-through signal connector |
| 05/13/2004 | US20040092137 Electronic module and method for fabricating the same |
| 05/13/2004 | US20040092136 Method and apparatus for electrolytic plating of surface metals |
| 05/13/2004 | US20040092056 Multilayer memory stacking method and multilayer memory made by the method |
| 05/13/2004 | US20040091818 Without chemical roughening pretreatment; coating molded polymer, electroless plating conductive metal and photoresist patterning |
| 05/13/2004 | US20040091726 Thermosetting resin composition and use thereof |
| 05/13/2004 | US20040091719 For use in cellular phone |
| 05/13/2004 | US20040091687 Method for manufacturing printed wiring board with embedded electric device |
| 05/13/2004 | US20040091686 Aromatic liquid-crystalline polyester solution composition |
| 05/13/2004 | US20040091622 Forming a coated prepreg by applying a solventless hot-melt resin system with high thermal conductivity to a prepreg by means of a slot die extrusion head |
| 05/13/2004 | US20040091030 Process to refurbish cable modem circuitry to comply with DOCSIS 2.0 specification |
| 05/13/2004 | US20040090843 Large line conductive pads for interconnection of stackable circuitry |
| 05/13/2004 | US20040090761 Circuit board assembly with separable first and second circuit board devices |