| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/10/2004 | US20040109315 Stackable led modules |
| 06/10/2004 | US20040109300 Expansion board apparatus and removing method |
| 06/10/2004 | US20040109298 Dielectric material including particulate filler |
| 06/10/2004 | US20040108937 Ball grid array resistor network |
| 06/10/2004 | US20040108862 Printed wiring board, multilayer printed wiring board, and method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| 06/10/2004 | US20040108629 Method for fabricating ceramic substrate |
| 06/10/2004 | US20040108591 Enhanced connectivity for electronic substrates, modules and systems using a novel edge flower terminal array |
| 06/10/2004 | US20040108590 Carrier-based electronic module |
| 06/10/2004 | US20040108587 High density chip carrier with integrated passive devices |
| 06/10/2004 | US20040108486 Various strength of anisotropic magnetic fields; soft magentic powder in binder |
| 06/10/2004 | US20040108368 Solder past printing apparatus and printing method |
| 06/10/2004 | US20040108137 Cross connect via for multilayer printed circuit boards |
| 06/10/2004 | US20040108136 Structure comprising a barrier layer of a tungsten alloy comprising cobalt and/or nickel |
| 06/10/2004 | US20040108135 Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| 06/10/2004 | US20040108134 Printed wiring boards having low inductance embedded capacitors and methods of making same |
| 06/10/2004 | US20040108132 Interconnection structure of electric conductive wirings |
| 06/10/2004 | US20040108130 Mounting structure for electronic component |
| 06/10/2004 | US20040107569 Metal core substrate packaging |
| 06/10/2004 | CA2507471A1 Photosensitive resin composition comprising a halogen-free colorant |
| 06/10/2004 | CA2506367A1 Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 06/09/2004 | EP1427267A1 Multi-milling method for the production of printed circuits and the printed circuits thus obtained |
| 06/09/2004 | EP1427266A1 Method for forming image on object surface including circuit substrate |
| 06/09/2004 | EP1427174A2 Wiring structure for folding portable device |
| 06/09/2004 | EP1427061A2 Differential signal electrical connectors |
| 06/09/2004 | EP1427055A1 Low cost antennas using conductive plastics or conductive composites |
| 06/09/2004 | EP1427051A1 High-frequency module substrate device |
| 06/09/2004 | EP1427030A2 Electronic component |
| 06/09/2004 | EP1427013A2 Control device, particularly for use in automotive engineering |
| 06/09/2004 | EP1427006A1 Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | EP1426674A2 Stackable led modules |
| 06/09/2004 | EP1426464A1 Method for producing metal/ceramic bonding substrate |
| 06/09/2004 | EP1425949A2 Printed circuit board |
| 06/09/2004 | EP1425946A1 An electronic assembly and a method of constructing an electronic assembly |
| 06/09/2004 | EP1425945A1 Pin-free socket compatible with optical-electrical interconnects |
| 06/09/2004 | EP1425792A2 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 06/09/2004 | EP1425767A1 Micro-replicated miniaturised electric components |
| 06/09/2004 | EP1425759A1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 06/09/2004 | EP1425174A2 Inkjet deposition apparatus and method |
| 06/09/2004 | EP1425170A1 Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices |
| 06/09/2004 | EP1425167A2 Method for producing a ceramic substrate and ceramic substrate |
| 06/09/2004 | EP1293009A4 Multi-layer microwave circuits and methods of manufacture |
| 06/09/2004 | EP1125483B1 Case for circuit board for horizontal or vertical mounting |
| 06/09/2004 | DE20280417U1 Element zum elektromagnetischen Abschirmen Element for electromagnetic shielding |
| 06/09/2004 | DE10355330A1 Leiterplatine und damit verbundenes Einbauinstrument Circuit board and associated installation tool |
| 06/09/2004 | DE10254662A1 Assembly support for light emitting diodes, e.g. for outer and inner illumination of vehicles comprises connection pins, a flexible circuit board, and a rigid support joined by its main surfaces to the flexible circuit board |
| 06/09/2004 | DE10254029A1 Verfahren zur Herstellung eines partiell metallisierten Folienelements A process for preparing a partially metallized film element |
| 06/09/2004 | DE10252584A1 Electrical and/or electronic circuit with overvoltage protection provided by arc path between points of conductor ring between coupling element terminal pin and conductor path structure |
| 06/09/2004 | CN2620461Y Structure of module and driving circuit connecting |
| 06/09/2004 | CN2620460Y High-heat radiation hole metallized printed circuitboard of Al or Mg or its alloy base |
| 06/09/2004 | CN2620459Y Jointing lengthening device of printed circuit board with switch |
| 06/09/2004 | CN1504070A Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| 06/09/2004 | CN1504068A Inteconnect |
| 06/09/2004 | CN1504067A Polyimide film for flexible printed board and flexible printed board using same |
| 06/09/2004 | CN1504066A Method for forming printed circuit board and printed circuit board formed thereby |
| 06/09/2004 | CN1503731A Laminate for electronic material |
| 06/09/2004 | CN1503729A Wet etchable laminated body insulation film, and electronic circuit part using the laminated body and the film |
| 06/09/2004 | CN1503704A Layered stacks and methods of production thereof |
| 06/09/2004 | CN1503616A Multilayer ceramic substrate and mfg method thereof |
| 06/09/2004 | CN1503359A Electronic parts packaging structure and method of manufacturing the same |
| 06/09/2004 | CN1503355A Multi-layer ceramic package device and mfg method thereof |
| 06/09/2004 | CN1503354A Ceramic multi-layer substrate and mfg method thereof |
| 06/09/2004 | CN1503338A Multi-layer distribution board and mfg method, electronic device and electronic apparatus |
| 06/09/2004 | CN1503284A Method for forming film capacitor with less leakage current and high insulation voltage-resistance |
| 06/09/2004 | CN1503277A Formation of thin film resistors |
| 06/09/2004 | CN1503276A Formation of thin film resistors |
| 06/09/2004 | CN1502970A Characteristic value calculation for welding detection |
| 06/09/2004 | CN1502661A Polyimide film, mfg method and application |
| 06/09/2004 | CN1153284C Substrate provided with spherical grate array type circuit portion, and installation method therefor |
| 06/09/2004 | CN1153268C Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 06/08/2004 | US6748289 Method for controlling screen printer |
| 06/08/2004 | US6748153 Optical fiber systems |
| 06/08/2004 | US6747879 High power amplifier and chassis |
| 06/08/2004 | US6747875 Surface mount power supplies for standard assembly process |
| 06/08/2004 | US6747862 System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
| 06/08/2004 | US6747450 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same |
| 06/08/2004 | US6747392 Chip electronic components and mounting structure for the same |
| 06/08/2004 | US6747367 Controller system for pool and/or spa |
| 06/08/2004 | US6747356 Multilayer circuit board; reducing the variation in the characteristic impedance of the wirings with high accuracy. |
| 06/08/2004 | US6747259 Assembly of imaging arrays for large format documents |
| 06/08/2004 | US6747217 Alternative to through-hole-plating in a printed circuit board |
| 06/08/2004 | US6747216 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
| 06/08/2004 | US6747215 Fat conductor |
| 06/08/2004 | US6747101 Epoxy acrylates |
| 06/08/2004 | US6746946 Process and apparatus for manufacturing printed circuit boards |
| 06/08/2004 | US6746899 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 06/08/2004 | US6746816 Photosensitive resin composition and circuit board |
| 06/08/2004 | US6746639 Process for preparing polyimide film |
| 06/08/2004 | US6746270 Spring-loaded heat sink assembly for a circuit assembly |
| 06/08/2004 | US6746261 Pressure application device for retaining at least two electronic components disposed opposite each other on each side of a connection board |
| 06/08/2004 | US6745930 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 06/08/2004 | CA2334627C Composite substrate, thin-film electroluminescent device using the substrate, and production process for the device |
| 06/04/2004 | CA2452284A1 Low cost antennas using conductive plastics or conductive composites |
| 06/03/2004 | WO2004047510A2 A method of supporting electronic components and an electronic device with elastic support for an electronic component |
| 06/03/2004 | WO2004047509A1 Cabled signaling system |
| 06/03/2004 | WO2004047508A2 Technique for accommodating electronic components on a multilayer signal routing device |
| 06/03/2004 | WO2004047240A2 Apparatus for crosstalk compensation in a telecommunications connector |
| 06/03/2004 | WO2004047224A2 Device for the electrical wiring and control of a number of peripheral devices |
| 06/03/2004 | WO2004047168A1 Electronic device |
| 06/03/2004 | WO2004046419A1 Method of combining metal with surface of molded cycloolefin resin and metal-combined molded cycloolefin resin |
| 06/03/2004 | WO2004045859A1 Method for producing a partially metallised film-type element |