H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2004
11/11/2004	DE10317596A1 Verfahren zur Erzeugung von Lotkugeln auf einem elektrischen Bauelement A process for the production of solder balls on an electrical component
11/11/2004	DE10317095A1 Bauelemententräger und Verfahren zu dessen Herstellung Carrier components and process for its preparation
11/11/2004	DE102004008886A1 Verfahren und System zum Entwerfen einer integrierten Schaltung mit reduziertem Rauschen Method and system for designing an integrated circuit with reduced noise
11/11/2004	CA2523971A1 A method for processing a thin film substrate
11/10/2004	EP1475863A1 Filtered connector
11/10/2004	EP1475836A1 Circuit module having interleaved groups of circuit chips
11/10/2004	EP1475743A1 Conductive paste and method of forming antenna for transponder
11/10/2004	EP1475398A1 Indole resins, epoxy resins and resin compositions containing the same
11/10/2004	EP1474959A1 Method for embedding a component in a base and forming a contact
11/10/2004	EP1474867A1 Television tuner and printed circuit board used therein
11/10/2004	EP1474811A1 Etching solution for forming an embedded resistor
11/10/2004	EP1474091A1 Blister pack system
11/10/2004	EP1474090A1 Device for detecting the removal of a product from a packing system by an electronic unit
11/10/2004	CN2655593Y 电子装置 Electronic devices
11/10/2004	CN1545827A Throughplating of flexible printed boards
11/10/2004	CN1545826A Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil
11/10/2004	CN1545533A Etching liquid for thermoplastic polyimide resin
11/10/2004	CN1545374A Flexible wiring board pieces and wiring sheets
11/10/2004	CN1545373A 信号传输结构 Signal transmission structure
11/10/2004	CN1545085A Data processing of a bitstream signal
11/10/2004	CN1175715C 多层印刷线路板 Multilayer printed circuit boards
11/10/2004	CN1175521C Variable capacitance coupling antenna and method for making same and non-contact chip card
11/10/2004	CN1175328C Electric wrist watch and making method therefor
11/10/2004	CN1175270C Machine for electric test of printed circuits with adjustable position of sound needles
11/10/2004	CN1175048C Curable polyphenylene ether-thermosetting resin and process
11/10/2004	CN1175033C Composite of powdered fillers and polymer bond and process for preparing them
11/10/2004	CN1174858C Laminated board
11/10/2004	CN1174857C Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/09/2004	US6817002 Method and apparatus for PCB array with compensated signal propagation
11/09/2004	US6816486 Cross-midplane switch topology
11/09/2004	US6816387 Expansion board apparatus and removing method
11/09/2004	US6816385 Compliant laminate connector
11/09/2004	US6816380 Electronic devices with small functional elements supported on a carrier
11/09/2004	US6816378 Stack up assembly
11/09/2004	US6816377 Electronic control unit
11/09/2004	US6816375 Heat sink attachment
11/09/2004	US6816025 Cross talk compensation circuit
11/09/2004	US6815837 Electronic package with strengthened conductive pad
11/09/2004	US6815810 High-frequency semiconductor device
11/09/2004	US6815739 Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
11/09/2004	US6815709 Structure having flush circuitry features and method of making
11/09/2004	US6815621 Chip scale package, printed circuit board, and method of designing a printed circuit board
11/09/2004	US6815620 Flexible circuit with electrostatic damage limiting feature
11/09/2004	US6815619 Circuit board
11/09/2004	US6815085 Printed circuit board capacitor structure and method
11/09/2004	US6815073 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film
11/09/2004	US6815053 Lowly heat-expandable laminate
11/09/2004	US6815046 Method of producing ceramic multilayer substrate
11/09/2004	US6815045 Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same
11/09/2004	US6814795 Rapidly solidifies without forced drying; silver or aluminum and glass particles dispersed in thermoplastic polymer system; photovoltaic cells
11/09/2004	US6814591 Electrical connector housing
11/09/2004	US6814588 Overmold cable terminator
11/09/2004	US6814583 Through-board PCB edge connector, system and method
11/09/2004	US6814463 LED flashlight and printed circuit board therefor
11/04/2004	WO2004095904A1 Board deflection metrology using photoelectric amplifiers
11/04/2004	WO2004095899A1 Power delivery apparatus, systems, and methods
11/04/2004	WO2004095886A1 High-frequency dielectric heating device and printed board with thermistor
11/04/2004	WO2004095832A1 Imaging device and mobile terminal using this imaging device
11/04/2004	WO2004095685A2 Low cost rf oscillator devices manufactured from conductive loaded resin-based materials
11/04/2004	WO2004095603A2 Method of producing membrane electrode assemblies
11/04/2004	WO2004095544A2 Substrate with multiple conductive layers and methods for making and using same
11/04/2004	WO2004095536A2 Stretchable and elastic interconnects
11/04/2004	WO2004095093A1 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method
11/04/2004	WO2004094724A1 Wet-process nonwoven fabric and process for producing the same
11/04/2004	WO2004094499A1 Thermosetting resin composition, multilayer body using same, and circuit board
11/04/2004	WO2004094338A1 Lead-free glass for forming dielectric, glass ceramics composition for forming dielectric, dielectric and method for producing laminated dielectric
11/04/2004	WO2004094314A2 Conductor-within-a-via microwave launch
11/04/2004	WO2004054333A3 Cross connect via for multilayer printed circuit boards
11/04/2004	US20040221199 Systems and methods for probing processor signals
11/04/2004	US20040221106 Upgradable memory system with reconfigurable interconnect
11/04/2004	US20040221083 High frequency bus system
11/04/2004	US20040220044 Ceramic composition and method
11/04/2004	US20040219847 Method for flexibilizing glass fiber nonwoven bound with cured urea formaldehyde resin
11/04/2004	US20040219837 Filtering electromagnetic interference from low frequency transmission lines at a device enclosure
11/04/2004	US20040219771 Pattern forming method and pattern forming device
11/04/2004	US20040219719 Device having resin package and method of producing the same
11/04/2004	US20040219713 Elimination of RDL using tape base flip chip on flex for die stacking
11/04/2004	US20040219463 Easily removal of marking without defect; patterning multilayer photoresist masking layer covering marking; etching
11/04/2004	US20040219375 Bonding layer for bonding resin on copper surface
11/04/2004	US20040219342 Electronic substrate with direct inner layer component interconnection
11/04/2004	US20040219341 Film carrier tape for mounting electronic devices thereon and production method thereof
11/04/2004	US20040218848 Flexible electronic/optical interconnection film assembly and method for manufacturing
11/04/2004	US20040218808 Systems and methods for detecting defects in printed solder paste
11/04/2004	US20040218373 Plated terminations
11/04/2004	US20040218372 LSI package provided with interface module and method of mounting the same
11/04/2004	US20040218367 Function module with built-in heat dissipation fin
11/04/2004	US20040218366 Multilayer circuit board
11/04/2004	US20040218364 Application specific heatsink assembly
11/04/2004	US20040218363 Application specific heat-dissipating apparatus that provides electrical isolation for components
11/04/2004	US20040218361 Function module with built-in plate-type heat dissipation device
11/04/2004	US20040218342 Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication
11/04/2004	US20040218084 Microminiature image pickup device
11/04/2004	US20040217903 Low cost antennas using conductive plastics or conductive composites
11/04/2004	US20040217865 RFID tag
11/04/2004	US20040217830 RF multilayer circuit board
11/04/2004	US20040217469 Package structure with increased capacitance and method
11/04/2004	US20040217466 Function module and its manufacturing method
11/04/2004	US20040217463 Circuit board
11/04/2004	US20040217461 Microelectronic adaptors, assemblies and methods
11/04/2004	US20040217455 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor

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