| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/16/2004 | US20040178275 Digital card-structure |
| 09/16/2004 | US20040178251 Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh |
| 09/16/2004 | US20040178250 Oriented connections for leadless and leaded packages |
| 09/16/2004 | US20040178112 Medication package and method |
| 09/16/2004 | US20040178000 Standardized circuit board core |
| 09/16/2004 | US20040177999 Wiring substrate |
| 09/16/2004 | US20040177919 Reel-type package of flexible printed circuit boards and method for supplying thereof |
| 09/16/2004 | US20040177777 Uphill screen printing in the manufacturing of microelectronic components |
| 09/16/2004 | US20040177774 Reinforcement combining apparatus and method of combining reinforcement |
| 09/16/2004 | DE202004007591U1 High frequency base material consisting of PTFE carrier layer coated on at least one side with metal layer, for use in automobile construction and telecommunication industries |
| 09/16/2004 | DE202004003619U1 Exchangeable end caps for low-energy lights with protective tubes are designed so that the mechanical connection between the bulb protection tube and the end cap can be undone |
| 09/16/2004 | DE19904327B4 Verfahren zum Bestücken von Leiterplatten mit Bauteilen A method for PCB assembly with components |
| 09/16/2004 | DE19850884B4 Speichervorrichtung Memory device |
| 09/16/2004 | DE10320646A1 Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
| 09/16/2004 | DE10310141A1 Schaltungsanordnung für zu kühlende Bauelemente und entsprechendes Kühlungsverfahren Circuitry for components to be cooled and corresponding cooling method |
| 09/16/2004 | DE10309520A1 Trägervorrichtung für elektrische Bauelemente A carrier device for electrical components |
| 09/16/2004 | DE10304906A1 SMT-fähiges Bauelement und Leiterplatte sowie SMT-Verfahren SMT-enabled device and PCB and SMT process |
| 09/16/2004 | DE102004010633A1 Elektronisches Baulelement zum Verkleben einer Mehrzahl von Elektroden und Verfahren zum Montieren desselben The same electronic Baulelement for bonding a plurality of electrodes, and method of assembling |
| 09/16/2004 | DE102004010163A1 Dielektrische Zusammensetzung zum Brennen bei niedrigen Temperaturen und elektronische Teile A dielectric composition for firing at low temperatures and electronic parts |
| 09/16/2004 | DE102004006312A1 Verfahren zur Herstellung einer isolierenden Harzzusammensetzung, eine isolierende Harzzusammensetzung, eine mehrschichtige Leiterplatte und ein Verfahren für deren Herstellung A method for manufacturing an insulating resin composition, an insulating resin composition, a multilayer printed wiring board and a method for their preparation |
| 09/16/2004 | CA2517855A1 Coaxial module with surge protector |
| 09/15/2004 | EP1458226A2 Circuit board assembly and flat coil |
| 09/15/2004 | EP1458225A2 Printed-circuit board for high-speed communication |
| 09/15/2004 | EP1458018A1 Electronic component device and manufacturing method therefor |
| 09/15/2004 | EP1457861A1 Topology for providing clock signals to multiple circuit units on a circuit module |
| 09/15/2004 | EP1457809A2 Flat display apparatus |
| 09/15/2004 | EP1457515A1 Resin composition prepreg laminated sheet and semiconductor package |
| 09/15/2004 | EP1457509A1 Epoxy Resin Polymers Composition |
| 09/15/2004 | EP1457466A2 Resin compatible yarn binder and uses thereof |
| 09/15/2004 | EP1457101A1 Method for making a multilayer module with high-density printed circuits |
| 09/15/2004 | EP1457099A1 System for the manufacture of electric and integrated circuits |
| 09/15/2004 | EP1457098A1 Ball grid array package |
| 09/15/2004 | EP1457043A1 Apparatus and method for sharing signal control lines |
| 09/15/2004 | EP1456911A1 Assembly and connecting technique in textile structures |
| 09/15/2004 | EP1456882A2 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 09/15/2004 | EP1366313B1 Mechatronic transmission control |
| 09/15/2004 | EP1218891B1 Conductor composition |
| 09/15/2004 | EP1153531B1 Passive electrical article and method of manufacturing it |
| 09/15/2004 | CN2641988Y Multilayer circuit board structure |
| 09/15/2004 | CN2641987Y Multi-layer flexible film circuit board |
| 09/15/2004 | CN2641986Y Crimping structure of thin film circuit board and printed circuit board |
| 09/15/2004 | CN1529925A Low-profile connector |
| 09/15/2004 | CN1529914A Light source coupler, illuninant device, patterned conductor and method for manufacturing light source coupler |
| 09/15/2004 | CN1529771A Composite foil and its manufacturing process |
| 09/15/2004 | CN1529657A Ink box with asymmetrical-arragned contact point |
| 09/15/2004 | CN1529656A Corrosion prevention for CAC component |
| 09/15/2004 | CN1529544A Circuit board for flip-chip connection and manufacturing method thereof |
| 09/15/2004 | CN1529543A Method for implanting electric terminal on circuit board (A) |
| 09/15/2004 | CN1529542A Method for implanting electric terminal on circuit board (B) |
| 09/15/2004 | CN1529541A Variable universal circuit board |
| 09/15/2004 | CN1529358A Ball gate array packaging and printed circuit board using same |
| 09/15/2004 | CN1167316C Vibrator holder |
| 09/15/2004 | CN1167315C Multi-layer substrate and making method thereof |
| 09/15/2004 | CN1167314C Screen printing method and screen printing apparatus |
| 09/15/2004 | CN1167313C Circuit board with heat-proofing insulating shield sleeve and making method |
| 09/15/2004 | CN1167128C Electrofusion fuse and its array and arrangement |
| 09/15/2004 | CN1167081C Electricity conductive glue and multi-layer ceramic electronic element using same |
| 09/15/2004 | CN1167080C Conductive paste, ceramic multilayer substrate, and method for mfg. ceramic multilayer substrate |
| 09/14/2004 | USRE38579 Wiring board construction and methods of making same |
| 09/14/2004 | US6792300 Low-noise optical probes for reducing light piping |
| 09/14/2004 | US6792179 Optical thumbtack |
| 09/14/2004 | US6791846 Power distribution system with a dedicated power structure and a high performance voltage regulator |
| 09/14/2004 | US6791842 Chip size may be changed without increasing miniaturized package volume |
| 09/14/2004 | US6791818 Electronic device |
| 09/14/2004 | US6791439 Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| 09/14/2004 | US6791429 Transmission line parasitic element discontinuity cancellation |
| 09/14/2004 | US6791192 Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
| 09/14/2004 | US6791186 Mounting substrate and structure having semiconductor element mounted on substrate |
| 09/14/2004 | US6791180 Ceramic circuit board and power module |
| 09/14/2004 | US6791178 Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
| 09/14/2004 | US6791177 Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate |
| 09/14/2004 | US6791170 Onboard semiconductor device |
| 09/14/2004 | US6791165 Device for shielding transmission lines from ground or power supply |
| 09/14/2004 | US6790800 Microwave dielectric ceramic composition having high quality factor |
| 09/14/2004 | US6790792 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| 09/14/2004 | US6790597 Rapid cure, stable to elevated temperatures, are highly flexible, have low moisture uptake |
| 09/14/2004 | US6790596 Having high sensitivity and causing less gelation |
| 09/14/2004 | US6790515 Greensheet carriers and processing thereof |
| 09/14/2004 | US6790478 Method for selectively coating ceramic surfaces |
| 09/14/2004 | US6790102 Twisted flat electrical terminal |
| 09/14/2004 | US6790052 Circuit board straddle mounted connector |
| 09/14/2004 | US6790051 Connector for printed circuit board |
| 09/14/2004 | US6789298 Edges that have been finished so that the edges are free of conductive material which allows testing of the panels for manufacturing defects prior to processing |
| 09/14/2004 | CA2352929C Method of forming chromium coated copper for printed circuit boards |
| 09/14/2004 | CA2270208C Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent |
| 09/14/2004 | CA2199199C Electrical circuit arrangement for the operation of lamps |
| 09/14/2004 | CA2123260C Communications connector terminal arrays having noise cancelling capabilities |
| 09/14/2004 | CA2120523C Electrically conductive compositions and methods for the preparation and use thereof |
| 09/10/2004 | WO2004077906A1 A circuit board and arrangement for minimizing thermal and electromagnetic effects |
| 09/10/2004 | WO2004077905A1 Electronic part manufacturing method and base sheet |
| 09/10/2004 | WO2004077903A1 Method for manufacturing an electronic module, and an electronic module |
| 09/10/2004 | WO2004077902A1 Method for manufacturing an electronic module |
| 09/10/2004 | WO2004077901A2 Printed circuit board and method for fixing wired parts thereto |
| 09/10/2004 | WO2004077900A1 Method for electrically contacting a component to a flat cable |
| 09/10/2004 | WO2004077899A1 Ceramic circuit board and conductive paste used therefor |
| 09/10/2004 | WO2004077897A2 A circuit assembly and electronic device incorporating such an assembly |
| 09/10/2004 | WO2004077689A1 Tuner unit, receiver, electronic apparatus |
| 09/10/2004 | WO2004077622A1 Dielectric sheet |
| 09/10/2004 | WO2004077601A1 Organic resin multi-layered substrate |
| 09/10/2004 | WO2004077560A1 Multilayer printed wiring board |