Patents for H05K 1 - Printed circuits (98,583)
01/2005
01/06/2005US20050001309 Printed wiring board for mounting semiconductor
01/06/2005US20050001308 Integrated circuit carrier
01/06/2005US20050001299 Substrate for semiconductor package wire bonding method using thereof
01/06/2005US20050001278 Chip package substrate having soft circuit board and method for fabricating the same
01/06/2005US20050000730 Printed wiring board, electronic component mounting method, and electronic apparatus
01/06/2005US20050000729 Multilayer wiring board for an electronic device
01/06/2005US20050000728 Wiring board provided with a resistor and process for manufacturing the same
01/06/2005US20050000725 Manufacturing method for a printed circuit board
01/06/2005US20050000645 Method for bonding reinforcing plate
01/06/2005US20050000414 Method and apparatus for applying conductive ink onto semiconductor substrates
01/06/2005CA2529815A1 Low emi with high mechanical strength method of connecting signal connections
01/06/2005CA2528505A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion
01/05/2005EP1494516A2 Wiring board and manufacturing method thereof
01/05/2005EP1494514A2 Wiring board provided with a resistor and process for manufacturing the same
01/05/2005EP1494513A1 Circuit board device for information apparatus, multilayered module board, and navigator
01/05/2005EP1494362A1 Signal reception device, signal reception circuit, and reception device
01/05/2005EP1494319A2 Flexible substrate and a connection method thereof that can achieve reliable connection
01/05/2005EP1494299A2 Electronic equipment and method for extracting battery or electronic component thereof
01/05/2005EP1494285A1 Circuit module and method for manufacturing the same
01/05/2005EP1494277A2 Module with a built-in semiconductor and method for producing the same
01/05/2005EP1494247A1 Polymide resin for electrical insulating material
01/05/2005EP1494077A2 Image forming apparatus and image forming method
01/05/2005EP1493780A1 Conductive composition, conductive film, and process for the formation of the film
01/05/2005EP1493312A1 Printed circuit board and method for producing the same
01/05/2005EP1493188A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof
01/05/2005EP1493187A2 Lighting device and method
01/05/2005DE202004014353U1 Socket base for electrical components, such as fuses, in motor vehicle, has circuit board connected to connector contact, and arranged in different plane to punched conductor
01/05/2005DE202004012466U1 Einpreßverbinder Press-fit
01/05/2005DE10327767A1 Schaltungsbaugruppe und Herstellungsverfahren dafür Circuit module and manufacturing method thereof
01/05/2005DE10327360A1 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
01/05/2005DE10325550A1 Elektrisches Kontaktierungsverfahren Electrical contacting methods
01/05/2005DE10324047A1 Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit Electronic unit as well as methods for producing an electronic unit
01/05/2005DE10297505T5 Verschaltgerät-Steuergerät Verschaltgerät controller
01/05/2005DE102004028058A1 Elektronische Einrichtung Electronic device
01/05/2005DE10016037B4 Verfahren zur Herstellung eines Etiketts oder einer Chipkarte Process for the preparation of a label or a chip card
01/05/2005CN1561657A Electronic circuit comprising conductive bridges and method for making such bridges
01/05/2005CN1561655A Vented vias for via in pad technology assembly process yield improvements
01/05/2005CN1561157A Signal transmission structure
01/05/2005CN1561156A Soft printed circuit board
01/05/2005CN1561155A Flexible circuit board
01/05/2005CN1560933A Electronic component
01/05/2005CN1560672A Backlight module and heat sink structure
01/05/2005CN1183815C Method for mfg. glass ceramic multi-substrate
01/05/2005CN1183814C Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board
01/05/2005CN1183813C Parts mounting baseplate and making method therefor
01/05/2005CN1183812C Method for manufacturing double-side flexible printed circuit board
01/05/2005CN1183810C Terminal structure
01/05/2005CN1183809C An electronic circuit board, and structure comprising insulaintg structure and circuit board
01/05/2005CN1183636C Control device and soldering method
01/05/2005CN1183626C Small interconnector
01/05/2005CN1183404C Liquid crystal display apparatus
01/05/2005CN1183057C Low temperature sintered ceramic and electronic parts
01/04/2005US6839885 Determining via placement in the printed circuit board of a wireless test fixture
01/04/2005US6839304 Drug delivery management system
01/04/2005US6839243 Electronic component and method of producing the same
01/04/2005US6839241 Circuit module
01/04/2005US6839219 Laminate for forming capacitor layer and method for manufacturing the same
01/04/2005US6839214 Overvoltage protection device
01/04/2005US6839202 Electromagnetic wave shielded write and read wires on a support for a magnetic media drive
01/04/2005US6839199 Disk drive including electrical traces integrally formed upon disk drive housing
01/04/2005US6838954 High efficiency quarter-wave transformer
01/04/2005US6838949 Voltage control oscillator and manufacturing method thereof
01/04/2005US6838900 Middle pull-up point-to-point transceiving bus structure
01/04/2005US6838893 Probe card assembly
01/04/2005US6838775 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge
01/04/2005US6838764 Insulators for high density circuits
01/04/2005US6838759 Small memory card
01/04/2005US6838546 Less anisotropic films
01/04/2005US6838401 Heat-resistant fibrous paper
01/04/2005US6838400 A woven fiberglass cloth comprising 0.01-2% of an oxide or salt of copper and/or cromium to reduce the glass transmittance of ultra-violet light; reinforced prepregs; printed circuit boards and cards; laminated chip carrier
01/04/2005US6838377 High frequency circuit chip and method of producing the same
01/04/2005US6838351 Manufacturing method of circuit board, circuit board, and liquid discharging apparatus
01/04/2005US6838317 Techniques for joining an opto-electronic module to a semiconductor package
01/04/2005US6838021 Irregular shaped copper particles and methods of use
01/04/2005US6837747 Filtered connector
01/04/2005US6837720 Connector for electrically coupling one or more devices in a processor-based system
01/04/2005US6837719 Connector with included filtered power delivery
12/2004
12/30/2004US20040268287 High speed bus with radio frequency microstrip
12/30/2004US20040268271 High data rate differential signal line design for uniform characteristic impedance for high performance integrated circuit packages
12/30/2004US20040266384 High frequency and low noise interconnect system
12/30/2004US20040266252 Structure of terminal member
12/30/2004US20040266249 Pivot component coupled with first circuit board for control of relative alignment of first circuit board connection component with second circuit board connection component
12/30/2004US20040266239 Foldable electronic device formed by pivotally connecting two casings through hinge
12/30/2004US20040266060 Cost-reducing and process-simplifying wiring board and manufacturing method thereof
12/30/2004US20040265686 Electronic equipment and method for extracting battery or electric component thereof
12/30/2004US20040265615 Fineness particle sizes; spraying pyrolysis
12/30/2004US20040265609 Metal-clad laminate
12/30/2004US20040265608 Biaxially oriented polyester film and laminates thereof with copper
12/30/2004US20040265601 Adhesion, heat resistance; bonding polyimide to copper foils
12/30/2004US20040265595 Functionalized polyphenylene ether
12/30/2004US20040265551 Laminate of a resin or a composite obtained by mixing a resin and a powdery functional material that is reduced in thickness and size, improved in packaging density and having an improved accuracy of patterning, use for an inductive element
12/30/2004US20040265537 Supported greensheet structure and method in mlc processing
12/30/2004US20040265499 Method of forming patterns on articles
12/30/2004US20040265190 Microcomponent
12/30/2004US20040264945 DVD apparatus having fabrication cost reduced
12/30/2004US20040264884 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
12/30/2004US20040264882 Optical transmission module
12/30/2004US20040264838 Embedded optical coupling in circuit boards
12/30/2004US20040264837 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof
12/30/2004US20040264195 Led light source having a heat sink