H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
12/2004
12/28/2004	US6835895 Printed wiring board and method for manufacturing the same
12/28/2004	US6835894 Back plane structure for SCSI
12/28/2004	US6835889 Passive element component and substrate with built-in passive element
12/28/2004	US6835785 Polyphenylene ether oligomer compound, derivatives thereof and use thereof
12/28/2004	US6835682 High thermal expansion glass and tape composition
12/28/2004	US6835601 Mother substrate, substrate element, and method for manufacturing the same
12/28/2004	US6835597 Semiconductor package
12/28/2004	US6835533 Photoimageable dielectric epoxy resin system film
12/28/2004	US6835442 Flexible printed wiring board
12/28/2004	US6835412 Metalized dielectric substrates for EAS tags
12/28/2004	US6835331 Conductive composition
12/28/2004	US6835318 Method for forming a recognition mark on a substrate for a KGD
12/28/2004	US6835293 Analysis system
12/28/2004	US6835260 Method to produce pedestal features in constrained sintered substrates
12/28/2004	US6834981 Light-emitting unit, light-emitting unit combination, and lighting apparatus assembled from a plurality of light-emitting units
12/28/2004	US6834429 Ablative method for forming RF ceramic block filters
12/28/2004	US6834427 Method for depopulating of a ball grid array to allow via placement
12/23/2004	WO2004112450A1 Board mounting method and mounting structure
12/23/2004	WO2004112358A1 Modular terminal device
12/23/2004	WO2004112210A1 Electric junction box and its assembling process
12/23/2004	WO2004112196A1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
12/23/2004	WO2004112151A2 Transparent conducting structures and methods of production thereof
12/23/2004	WO2004112135A1 Substrate for semiconductor devices and semiconductor device
12/23/2004	WO2004112129A1 Electronic device
12/23/2004	WO2004112128A2 Low profile stacking system and method
12/23/2004	WO2004111890A1 Printed circuit wiring board designing support device, printed circuit board designing method, and its program
12/23/2004	WO2004111856A1 Memory device supporting a dynamically configurable core organisation
12/23/2004	WO2004110925A1 Metal hydride fine particle, method for producing same, liquid dispersion containing metal hydride fine particle, and metallic material
12/23/2004	WO2004110336A1 Improved package with electronic circuitry
12/23/2004	US20040260859 Memory module with improved data bus performance
12/23/2004	US20040260053 Polyimide resin and cast-on-copper laminate
12/23/2004	US20040259434 Flanged terminal pins for DC/DC converters
12/23/2004	US20040259391 Construction and connection technique in textile structures
12/23/2004	US20040259317 Process for manufacturing a substrate with embedded capacitor
12/23/2004	US20040259007 Electroconductive composition, electroconductive coating and method for forming electroconductive coating
12/23/2004	US20040258899 glass cloth impregnated with polyamideimide copolymers and thermosetting resins comprising epoxy resins, having heat and solvent resistance, and bonding strength to smooth clad metals; printed circuits
12/23/2004	US20040258885 Etched dielectric film in microfluidic devices
12/23/2004	US20040258841 Depositing a first layer of thickfilm dielectric on the substrate, air drying the first layer to allow solvents to escape, increasing the porosity of the first layer, oven drying the layer
12/23/2004	US20040258345 Coupling to waveguides that are embedded in printed circuit boards
12/23/2004	US20040257819 Light-emitting element circuit
12/23/2004	US20040257815 Mounting arrangement for light emitting diodes
12/23/2004	US20040257782 Electronic unit as well as method for manufacturing an electronic unit
12/23/2004	US20040257781 Mounting power handling components on printed circuit boards near high density routing channels
12/23/2004	US20040257780 Capacitor-related systems for addressing package/motherboard resonance
12/23/2004	US20040257773 Stack up assembly
12/23/2004	US20040257772 Stack up assembly
12/23/2004	US20040257750 Heat pipe circuit board
12/23/2004	US20040257749 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
12/23/2004	US20040257729 Flexible circuit with electrostatic damage limiting feature
12/23/2004	US20040257509 Liquid crystal display device and method of fabricating the same
12/23/2004	US20040257279 Dielectric substrate with selectively controlled effective permittivity and loss tangent
12/23/2004	US20040257234 Flame sensor
12/23/2004	US20040257194 Methods for making microwave circuits
12/23/2004	US20040257193 Resistive material
12/23/2004	US20040257178 High frequency transmission line and high frequency board
12/23/2004	US20040257175 Resonator, filter, communication apparatus
12/23/2004	US20040257109 Termination providing apparatus mounted on memory module or socket and memory system using the apparatus
12/23/2004	US20040257103 Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
12/23/2004	US20040257102 Secure content protection for board connections
12/23/2004	US20040257063 System and method for measuring the power consumed by a circuit on a printed circuit board
12/23/2004	US20040256739 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
12/23/2004	US20040256738 Battery protection circuit with integrated passive components
12/23/2004	US20040256731 Dielectric composite material
12/23/2004	US20040256720 Thermal interface apparatus, systems, and methods
12/23/2004	US20040256717 LSI package
12/23/2004	US20040256715 Wiring board, semiconductor device and process of fabricating wiring board
12/23/2004	US20040256714 Laminated electronic component
12/23/2004	US20040256711 Semiconductor device, semiconductor module and hard disk
12/23/2004	US20040256701 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
12/23/2004	US20040256467 Electronic unit, circuit design for the same, and production method
12/23/2004	US20040256466 Thin electronic label and method for making same
12/23/2004	US20040256352 Embossed mask lithography
12/23/2004	US20040256350 deposition of a conductive thickfilm on the dielectric, followed by a subsintering of the conductive thickfilm, patterning is done before/ after sintering, etching is then done to expose the conductor(s), and the conductor(s) are then fired
12/23/2004	US20040256188 Retractable cable assemblies and devices including the same
12/23/2004	US20040256150 Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed
12/23/2004	US20040256149 Symmetric electrical connection system
12/23/2004	US20040256148 Electronic circuit device having flexibility and reduced footprint
12/23/2004	US20040256133 Constructing of an electronic assembly having a decoupling capacitor
12/23/2004	US20040255457 Tile-based routing method of a multi-layer circuit board and related structure
12/23/2004	US20040255456 Method for manufacturing a chip carrier
12/23/2004	DE10336281B3 Electrical component group with screened electromagnetic component has contact elements engaging conductive layer applied to rear side of component substrate and secured to base substrate
12/23/2004	DE10335690A1 Deformation sensor used for e.g. force, pressure, torque and acceleration measurements in vehicle, is mounted with signal processor circuit on flexible insulation film substrate
12/23/2004	DE10324043A1 Manufacturing method for a chip card with a functional insert such as a display, whereby two plastic films with insert holes are overlapped to provide an insert window with at least an electrical contact for an electronic part
12/23/2004	DE10297325T5 Spannungsveränderliches Trägermaterial A variable voltage support material
12/23/2004	CA2525042A1 Improved package with electronic circuitry
12/22/2004	EP1489699A2 Improved contact for error resistant coupling of electrical signals
12/22/2004	EP1489687A1 Dielectric substrate with selectively controlled effective permittivity and loss tangent
12/22/2004	EP1489471A1 Ground connection of a printed circuit board placed in a wristwatch-type electronic device
12/22/2004	EP1489127A1 Polyimide resin and cast-on-copper laminate
12/22/2004	EP1488432A1 "a magnetic structure assembly"
12/22/2004	EP1487759A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate
12/22/2004	EP1433368B1 Electronic circuit comprising conductive bridges and method for making such bridges
12/22/2004	EP1363811B1 Method for producing a moulded vehicle component comprising an integrated conductor strip and moulded vehicle component
12/22/2004	EP1229081B1 Polyimide copolymer and metal laminate containing the same
12/22/2004	EP1106039B1 Method for producing a contact between two conductive layers separated by an insulating layer
12/22/2004	EP0934688B1 A method and a device for shielding of electronic components on a circuit board
12/22/2004	CN2666087Y Printed circuit board with contact surface used for connecting antenna
12/22/2004	CN1556830A 官能化聚苯醚 Functionalized polyphenylene ether,
12/22/2004	CN1556775A Glass ceramic mass and use thereof
12/22/2004	CN1556666A Plane display capable of proventing heat expansion effect accumulating and its printing circuit board

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