| Patents for H05K 1 - Printed circuits (98,583) |
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| 12/02/2004 | US20040238970 Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same |
| 12/02/2004 | US20040238955 Semiconductor device and method of fabricating the same |
| 12/02/2004 | US20040238953 Built-up bump pad structure and method for same |
| 12/02/2004 | US20040238949 Semiconductor package and method of production thereof |
| 12/02/2004 | US20040238942 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
| 12/02/2004 | US20040238941 Semiconductor connection substrate |
| 12/02/2004 | US20040238932 Array printed circuit board |
| 12/02/2004 | US20040238834 LED display apparatus |
| 12/02/2004 | US20040238819 Serpentine and corduroy circuits to enhance the stretchablity of a stretchable electronic device |
| 12/02/2004 | US20040238603 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus |
| 12/02/2004 | US20040238595 Substrate holder |
| 12/02/2004 | US20040238522 Temperature controlled vacuum chuck |
| 12/02/2004 | US20040238483 Reducing corrugated edge pattern range and skirt spreading length variation; can employ aluminum metal or alloy and brazing filler bonding; utilizing acid free ferric chloride and water |
| 12/02/2004 | US20040238216 Via shielding for power/ground layers on printed circuit board |
| 12/02/2004 | US20040238215 Circuit board and fabricating process thereof |
| 12/02/2004 | US20040238213 Uniform impedance printed circuit board |
| 12/02/2004 | US20040238212 Electronic circuit comprising conductive bridges and method for making such bridges |
| 12/02/2004 | US20040238211 Circuit board, circuit board mounting method, and electronic device using the circuit board |
| 12/02/2004 | US20040238209 Multilayer wiring board, method of manufacturing the wiring board and substrate material for the wiring board |
| 12/02/2004 | US20040238208 Standoff/mask structure for electrical interconnect |
| 12/02/2004 | US20040238207 Conductive paste and ceramic multilayer substrate |
| 12/02/2004 | US20040238206 Selective reference plane bridge(s) on folded package |
| 12/02/2004 | US20040238205 Printed circuit board with controlled solder shunts |
| 12/02/2004 | US20040238194 Flex cable having a return-signal path and method for reducing length and impedance of a return-signal path |
| 12/02/2004 | US20040238113 Precision attachment of printed circuit board to magnetic disk head; differentiating movement trajectory of suction heads along longitudinal direction without interfering with stepped portion |
| 12/02/2004 | US20040238099 Eliminates conventional grinding and ultrasonic machining |
| 12/02/2004 | DE10350195A1 Nonwoven-Bindemittel für Glasfasern (Fiberglass nonwoven binder) Nonwoven binder for glass fibers (fiberglass nonwoven binder) |
| 12/02/2004 | DE10322316A1 Electronic component comprises several layers of glass material arranged above each other and joined to form a uniform block |
| 12/02/2004 | DE10321583A1 Solder substance for soldering components to a circuit board and containing reflective or phosphorescent particles for observing areas which have not been covered |
| 12/02/2004 | DE10320838A1 Verbundwerkstoff sowie elektrischer Schaltkreis oder elektrisches Modul Composite and electrical circuit or electrical module |
| 12/02/2004 | DE10320716A1 Anordnung von Leiterelementen Arrangement of circuit elements |
| 12/02/2004 | DE10311693B3 Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness |
| 12/02/2004 | DE102004019877A1 Klebeschicht zum Kleben von Harz auf eine Kupferoberfläche Adhesive layer for bonding resin on a copper surface |
| 12/02/2004 | DE10035990B4 Verfahren zur Herstellung elektronischer Bauelemente aus Keramik A process for the production of electronic components made of ceramic |
| 12/01/2004 | EP1482772A2 Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process |
| 12/01/2004 | EP1482771A2 Metal/ceramic circuit board and method for producing same |
| 12/01/2004 | EP1482567A1 Light-emitting device comprising led chip and method for manufacturing this device |
| 12/01/2004 | EP1482547A2 Standoff/mask structure for electrical interconnect |
| 12/01/2004 | EP1482543A2 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 12/01/2004 | EP1481577A2 Method and devices for qualifying substrate-processing production processes |
| 12/01/2004 | EP1481424A2 A modular integrated circuit chip carrier |
| 12/01/2004 | EP1480834A1 Marking substrates |
| 12/01/2004 | EP1352185B1 Hydraulic motor-vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 12/01/2004 | CN1552099A Modular component |
| 12/01/2004 | CN1551828A Solid sheet material especially useful for circuit boards |
| 12/01/2004 | CN1551720A Multilayer ceramic device |
| 12/01/2004 | CN1551719A Module with built-in circuit component and method for producing the same |
| 12/01/2004 | CN1551717A Multilayer printed wiring board and integrated circuit using the same |
| 12/01/2004 | CN1551716A Method of forming composite insulating layer and process of producing wiring board |
| 12/01/2004 | CN1551713A Multi-layer circuit board and magnetic shielding method for same |
| 12/01/2004 | CN1551712A Electronic circuit connection structure and its connection method |
| 12/01/2004 | CN1551711A Copper foil for printed-wiring board |
| 12/01/2004 | CN1551709A Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards |
| 12/01/2004 | CN1551708A Multi-layer wiring board |
| 12/01/2004 | CN1551615A Imaging apparatus |
| 12/01/2004 | CN1551494A Chip electronic components and mounting structure for the same |
| 12/01/2004 | CN1551468A Surface mounted power supply circuit apparatus and method for manufacturing it |
| 12/01/2004 | CN1551379A Mounting structure of piezoelectric transformer and method of mounting piezoelectric transformer |
| 12/01/2004 | CN1551350A Semiconductor device |
| 12/01/2004 | CN1551343A Electronic component packaging structure and method for producing the same |
| 12/01/2004 | CN1551339A Thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| 12/01/2004 | CN1551320A Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device |
| 12/01/2004 | CN1551260A Ultra low inductance multi layer ceramic capacitor |
| 12/01/2004 | CN1551221A Circuit module having interleaved groups of circuit chips |
| 12/01/2004 | CN1550807A Optical module group and making method ,optical communication device and electronic device |
| 12/01/2004 | CN1550556A Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 12/01/2004 | CN1550471A Resin compatible yarn binder and uses thereof |
| 12/01/2004 | CN1550333A Liquid drop blowing-out device and method ,electro-optical device and manufacturing method thereof |
| 12/01/2004 | CN1178568C Yarn treatment system |
| 12/01/2004 | CN1178566C Multi-layer circuit plate and its mfg. method |
| 12/01/2004 | CN1178564C Wiring method and wiring device and IC card manufacturing method |
| 12/01/2004 | CN1178562C Wiring board having connectora nd method of manufacturing the same |
| 12/01/2004 | CN1178561C Single module system fo electrical and electronic device |
| 12/01/2004 | CN1178296C Circuit board and its making method and high output module |
| 12/01/2004 | CN1178237C Method for manufacturing laminated ceramic electronic element, and ethod for mfg. laminated inductor |
| 12/01/2004 | CN1178229C Conducting resin and ceramic electronic unit using it |
| 12/01/2004 | CN1177898C Photosensitive conductive paste |
| 12/01/2004 | CN1177654C Method for makinga sonoprobe |
| 11/30/2004 | US6826053 Electronic device |
| 11/30/2004 | US6826031 Ceramic electronic component and production method therefor |
| 11/30/2004 | US6825900 Display apparatus |
| 11/30/2004 | US6825894 Liquid crystal display device |
| 11/30/2004 | US6825743 Substrate enhancement for improved signal characteristics on a discontinuous transmission line |
| 11/30/2004 | US6825651 Test method for characterizing currents associated with powered components in an electronic system |
| 11/30/2004 | US6825568 Flip chip package structure and flip chip device with area bump |
| 11/30/2004 | US6825420 Conductor of flexible material, component comprising such flexible conductor, and method of manufacturing such conductor |
| 11/30/2004 | US6825245 Solvent-free; controlling viscosity; material handling |
| 11/30/2004 | US6825055 Method for assembling integral type electronic component and integral type electronic component |
| 11/30/2004 | US6824884 Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate |
| 11/30/2004 | US6824880 Process for improving adhesion of resistive foil to laminating materials |
| 11/30/2004 | US6824857 Circuit elements having an embedded conductive trace and methods of manufacture |
| 11/30/2004 | US6824827 Method of making a polyimide film having a thin metal layer |
| 11/30/2004 | US6824603 Composition and method for printing resistors, capacitors and inductors |
| 11/30/2004 | US6824393 Fragmented backplane system for I/O applications |
| 11/30/2004 | US6824391 Electrical connector having customizable circuit board wafers |
| 11/30/2004 | US6824390 Method and arrangement for replacing a board-mounted electric circuit component |
| 11/30/2004 | US6823586 Method of mounting a butterfly package on a PCB |
| 11/30/2004 | US6823585 Method of selective plating on a substrate |
| 11/30/2004 | CA2355218C Visible and fluorescent dye containing laminate materials |
| 11/30/2004 | CA2350289C Printed circuit board connection |