Patents for H05K 1 - Printed circuits (98,583)
10/2004
10/21/2004DE102004015283A1 IC-Karte IC card
10/21/2004DE102004014094A1 Verfahren zum Schwalllöten von oberflächenmontierten Leuchtdioden A method for wave soldering of surface mount LEDs
10/20/2004EP1469712A2 In-vehicle electronic device, thermal flowmeter and electronic circuit board
10/20/2004EP1469710A2 Component support and process for manufacturing the same
10/20/2004EP1469707A2 Lighting circuits manufactured from conductive loaded resin-based materials
10/20/2004EP1469513A2 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
10/20/2004EP1469490A1 An audio signal processing circuit and a display device incorporating the same
10/20/2004EP1469485A2 Low cost shielded cable manufactured form conductive loaded resin-based materials
10/20/2004EP1469402A2 System and method for tracking engineering changes relating to a circuit card
10/20/2004EP1468594A2 High density 3-d integrated circuit package
10/20/2004EP1468466A1 Grouped element transmission channel link
10/20/2004EP1468448A2 Package for a non-volatile memory device including integrated passive devices and method for making the same
10/20/2004EP1468446A1 Method for production of dielectric layers using polyfunctional carbosilanes
10/20/2004EP1468054A1 Ink-jet inks containing metal nanoparticles
10/20/2004EP1468042A2 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
10/20/2004CN2650449Y Part fixing structure
10/20/2004CN1539255A Card manufacturing technique and resulting card
10/20/2004CN1539029A Copper on INVAR composite and method of making
10/20/2004CN1538978A Resin composition, composition for solder resist, and cured article obtained therefrom
10/20/2004CN1538801A Electronic line unit with assembling structure of high-reliability welding
10/20/2004CN1538798A Distribution base material and electric equipment and switch device with the distribution base material
10/20/2004CN1538797A Electrostatic discharge protection device of circuit board
10/20/2004CN1538568A Arrangement for connecting two circuit boards by connector, coplanar structural section and microstrip structural section
10/20/2004CN1538565A Connector device for hook on printed substrate
10/20/2004CN1538554A Low cost antenna using conductive plastics or conductive composites
10/20/2004CN1172564C Electromechanical component
10/20/2004CN1172371C Sensor circuit modular unit electronic device using same
10/20/2004CN1172367C Combined part of metal base
10/20/2004CN1172211C Manufacturing method of electrooptical device and dectrooptical device
10/19/2004US6807328 Polished polyimide substrate
10/19/2004US6807066 Power supply terminal and back board
10/19/2004US6807065 Multilayer printed circuit board
10/19/2004US6807063 High-frequency integrated circuit module
10/19/2004US6807061 Stack up assembly
10/19/2004US6807060 Underhood electronic integration
10/19/2004US6807047 Electronic device and interposer board
10/19/2004US6807029 Wiring member of suspension for disc drive having electrically conductive substrate with slit between read wire and write wire
10/19/2004US6806936 Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel
10/19/2004US6806790 Miniature 180 degree power splitter
10/19/2004US6806718 On-circuit board continuity tester
10/19/2004US6806580 Multichip module including substrate with an array of interconnect structures
10/19/2004US6806564 Semiconductor apparatus with decoupling capacitor
10/19/2004US6806562 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
10/19/2004US6806560 Semiconductor device and method for fabricating same
10/19/2004US6806428 Module component and method of manufacturing the same
10/19/2004US6806033 Photoimaged dielectric, its manufacture and use in electronics
10/19/2004US6806028 Reacting metal hydroxides present on the surface of the powdered base metal with a polyvalent alcohol having at least 4 hydroxyl groups; organic binder having acidic groups to form a microgel; photosensitive organic component
10/19/2004US6805998 Method and apparatus for integrated-battery devices
10/19/2004US6805967 Polyamic acid varnish composition and a flexible printed board
10/19/2004US6805829 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
10/19/2004US6805767 Method for producing solid-state image pickup device
10/19/2004US6805560 Apparatus interconnecting circuit board and mezzanine card or cards
10/19/2004US6805291 Method for field programmable radio frequency document identification devices
10/15/2004CA2464585A1 Low cost shielded cable manufactured from conductive loaded resin-based materials
10/14/2004WO2004089049A1 Multilayer substrate and method for producing same
10/14/2004WO2004089048A1 Method for manufacturing an electronic module and an electronic module
10/14/2004WO2004089047A1 Electric connecting part
10/14/2004WO2004088731A2 Methods for fabricating three-dimensional all organic interconnect structures
10/14/2004WO2004088722A2 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
10/14/2004WO2004088688A1 Composite electronic component
10/14/2004WO2004087974A1 Machinable copper alloy
10/14/2004WO2004087811A1 Flame retardant epoxy resin compositions, prepregs and metal-clad laminates
10/14/2004WO2004087793A1 Crosslinked polyimide, composition comprising the same and method for producing the same
10/14/2004WO2004087466A1 Arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area
10/14/2004WO2004032234A3 Semiconductor device power interconnect striping
10/14/2004US20040205433 High reliability memory module with a fault tolerant address and command bus
10/14/2004US20040205070 Trusted platform motherboard having physical presence detection
10/14/2004US20040204307 Mixing two double oxides each containing tungsten or molyb-denum combined with alkali metal earth for one and zirconium or hafnium for other; precision, performance; high frequency circuits
10/14/2004US20040203290 Connector structure
10/14/2004US20040203260 Component arrangement
10/14/2004US20040203259 Electrical connector for conveying signals between two circuit boards
10/14/2004US20040203237 Mounting electronic components
10/14/2004US20040202848 Electronic parts and method producing the same
10/14/2004US20040202823 Ceramic laminate and method for manufacturing the same
10/14/2004US20040202795 Encoding tracking information into glass using single screen and laser ablation
10/14/2004US20040202560 Circuit board adapted to fan and fan structure
10/14/2004US20040202432 TO-CAN type optical module
10/14/2004US20040202214 Flexible circuit design for improved laser bias connections to optical subassemblies
10/14/2004US20040201971 Printed circuit board having outer power planes
10/14/2004US20040201969 Method for packaging small size memory cards
10/14/2004US20040201968 Multi-bank memory module
10/14/2004US20040201941 Direct application voltage variable material, components thereof and devices employing same
10/14/2004US20040201446 Conductive substrate with resistance layer, resistance board, and resistance circuit board
10/14/2004US20040201405 Topology for providing clock signals to multiple circuit units on a circuit module
10/14/2004US20040201390 Test interconnect for bumped semiconductor components and method of fabrication
10/14/2004US20040201387 Circuitry for measuring mechanical stress impressed on a printed circuit board
10/14/2004US20040201367 Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor device
10/14/2004US20040201134 Forming method of magnetic body, magnetic body, and printed circuit board
10/14/2004US20040201096 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/14/2004US20040201095 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
10/14/2004US20040201094 Semiconductor device
10/14/2004US20040201091 Stacked module systems and methods
10/14/2004US20040201056 Audio signal processing circuit and a display device incorporating the same
10/14/2004US20040200900 Modular architecture sensing and computing platform
10/14/2004US20040200889 System and method for improving hard drive actuator lead attachment
10/14/2004US20040200880 Apparatus and method for corrective soldering
10/14/2004US20040200801 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process
10/14/2004US20040200726 Reducing space between wire bonding pads by preventing nickel plating layer and gold plating layer from protruding at the lower portion of a copper pattern by filling the spaces between the copper patterns with a and applying plating layers on the exposed surface of the copper; semiconductor packages
10/14/2004US20040200638 Bonding pads for a printed circuit board
10/14/2004US20040200633 Compliant electrical contact assembly