| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 11/24/2004 | CN1548971A Method for testing flexible circuit board connection qualification and flexible circuit board with testing pad |
| 11/24/2004 | CN1548470A Resin composition with high dielectric constant and its usage |
| 11/24/2004 | CN1548393A Insulative ceramic compact |
| 11/24/2004 | CN1177517C Manufacture of multi-layered ceramic substrate |
| 11/24/2004 | CN1177401C Surface mounting type switching mains and its mounting method |
| 11/24/2004 | CN1177362C Radiating structure of integrated circuit (IC) |
| 11/24/2004 | CN1177329C Bidirectional non-solid impedance controlled reference plane and its forming method |
| 11/24/2004 | CN1177255C Flexible printed board |
| 11/23/2004 | US6822878 Circuit board support arrangement, method, and method for using the same |
| 11/23/2004 | US6822876 High-speed electrical router backplane with noise-isolated power distribution |
| 11/23/2004 | US6822841 Circuit board with protection capability and method of protecting a circuit board |
| 11/23/2004 | US6822824 Flex circuit bracket which establishes a diffusion path for a data storage device housing |
| 11/23/2004 | US6822720 Liquid crystal display having improved connection between TFT and TCP |
| 11/23/2004 | US6822526 Voltage plane with high impedance link |
| 11/23/2004 | US6822468 Method and apparatus for implementing printed circuit board high potential testing to identify latent defects |
| 11/23/2004 | US6822339 Semiconductor device |
| 11/23/2004 | US6822320 Microelectronic connection components utilizing conductive cores and polymeric coatings |
| 11/23/2004 | US6822191 Method for producing a trench structure in a polymer substrate |
| 11/23/2004 | US6822170 Embedding resin and wiring substrate using the same |
| 11/23/2004 | US6822169 Flexible printed circuit board and connecting method thereof |
| 11/23/2004 | US6822168 Cable harness arrangement |
| 11/23/2004 | US6821823 Molded substrate stiffener with embedded capacitors |
| 11/23/2004 | US6821555 Edge connectors for printed circuit boards comprising conductive ink |
| 11/23/2004 | US6821474 Method for preparing dielectric composite materials |
| 11/23/2004 | US6821143 Device supporting a light-emitting diode for an automobile signalling system, and a method of manufacturing such a device |
| 11/23/2004 | US6821130 Device and method using a flexible circuit secured for reliably inter-connecting components therein in the presence of vibration events |
| 11/23/2004 | US6821128 Low inductance power connector and method of reducing inductance in an electrical connector |
| 11/23/2004 | US6820798 Method for producing circuit arrangments |
| 11/23/2004 | US6820525 Precision Fiducial |
| 11/23/2004 | US6820332 Laminate circuit structure and method of fabricating |
| 11/23/2004 | US6820328 Method of removing heat from an electronic assemblage |
| 11/23/2004 | US6820321 Holes are formed through a ferromagnetic substrate and plated with conductive material; substrate is used for a magnetic core; rings are etched on a substrate; minimal eddy current effects |
| 11/23/2004 | US6820314 Method of making radio frequency identification tags |
| 11/18/2004 | WO2004100630A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 11/18/2004 | WO2004100628A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof |
| 11/18/2004 | WO2004100626A2 Radiocommunication module on a substrate having a surface area greater than that of the encapsulation case thereof, and corresponding radiocommunication device and platform |
| 11/18/2004 | WO2004100625A1 Rf module and production method thereof |
| 11/18/2004 | WO2004100623A2 Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method |
| 11/18/2004 | WO2004100359A2 Distribution of radio-frequency signals in an electronic circuit |
| 11/18/2004 | WO2004100264A1 Module including circuit elements |
| 11/18/2004 | WO2004100260A1 High-density multi-layered printed wiring board, multi-chip carrier, and semiconductor package |
| 11/18/2004 | WO2004100253A2 Electronic component as well as system support and panel for the production thereof |
| 11/18/2004 | WO2004100227A2 Application specific heat-dissipating apparatus that provides electrical isolation for components |
| 11/18/2004 | WO2004100193A1 Conductor element arrangement |
| 11/18/2004 | WO2004100136A1 An improved electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 11/18/2004 | WO2004099836A1 Conductive patterned sheet utilizing multilayered conductive channels |
| 11/18/2004 | WO2004099826A2 Polished polyimide substrate |
| 11/18/2004 | WO2004099729A2 Measuring device comprising a probe |
| 11/18/2004 | WO2004099728A2 Measuring device comprising a probe |
| 11/18/2004 | WO2004099725A2 Measuring device comprising a probe |
| 11/18/2004 | WO2004099464A1 Method for forming ferrite film |
| 11/18/2004 | WO2004098887A1 Screen printing device mask overlap mounting method, and screen printing device |
| 11/18/2004 | WO2004054332A3 Strip-line topology for a high speed pcb with low dissipation |
| 11/18/2004 | US20040230114 MRI flex circuit catheter imaging coil |
| 11/18/2004 | US20040229480 Memory module |
| 11/18/2004 | US20040229402 Low profile chip scale stacking system and method |
| 11/18/2004 | US20040229396 Multilayer flip-chip substrate interconnect layout |
| 11/18/2004 | US20040229391 LED lamp manufacturing process |
| 11/18/2004 | US20040229070 Copper foil for printed-wiring board |
| 11/18/2004 | US20040229035 Thermally conductive elastomeric pad |
| 11/18/2004 | US20040229025 Voltage tunable photodefinable dielectric and method of manufacture therefore |
| 11/18/2004 | US20040229024 Multi-layer printed circuit board and method for manufacturing the same |
| 11/18/2004 | US20040228778 Finish for glass fabrics used for reinforcing epoxy structures |
| 11/18/2004 | US20040228113 Reflective circuit board, and light module and flat panel display including the reflective circuit board |
| 11/18/2004 | US20040228107 LED backlight module |
| 11/18/2004 | US20040228100 Tailoring impedances of conductive traces in a circuit board |
| 11/18/2004 | US20040228099 Localized enhancement of multilayer substrate thickness for high Q RF components |
| 11/18/2004 | US20040228096 Printed circuit board with improved cooling of electrical component |
| 11/18/2004 | US20040228069 Ultra broadband capacitor assembly |
| 11/18/2004 | US20040228039 Electrical connection between a suspension flexure cable and a head stack assembly flexible circuit |
| 11/18/2004 | US20040228038 Head support mechanism and magnetic disk device |
| 11/18/2004 | US20040227788 Recording apparatus |
| 11/18/2004 | US20040227688 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
| 11/18/2004 | US20040227637 Built-in circuitry and method to test connector loading |
| 11/18/2004 | US20040227259 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment |
| 11/18/2004 | US20040227258 Electronic component packaging structure and method for producing the same |
| 11/18/2004 | US20040227253 Flip chip package, circuit board thereof and packaging method thereof |
| 11/18/2004 | US20040227236 Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing carrier substrate, semiconductor device, and electronic device |
| 11/18/2004 | US20040227233 Interconnection pattern design |
| 11/18/2004 | US20040227230 Heat spreaders |
| 11/18/2004 | US20040227227 Aerosol deposition process |
| 11/18/2004 | US20040227224 Mounting structure of semiconductor device and mounting method thereof |
| 11/18/2004 | US20040227156 Surface mounted power supply circuit apparatus and method for manufacturing it |
| 11/18/2004 | US20040226745 Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board |
| 11/18/2004 | US20040226744 Module with built-in circuit component and method for producing the same |
| 11/18/2004 | US20040226742 Package modification for channel-routed circuit boards |
| 11/18/2004 | US20040226739 Conformal sealing film |
| 11/18/2004 | US20040226696 Surface mount resistors as heat transfer augmentation devices |
| 11/18/2004 | US20040226164 Method and apparatus for improved static attitude of head suspension assemblies with electrical interconnects |
| 11/18/2004 | DE4312409B4 Einstellbarer Kondensator Variable capacitor |
| 11/18/2004 | DE19710187B4 Verfahren zum Herstellen eines Keramikmehrschichtsubstrats A method for manufacturing a ceramic multi-layer substrate |
| 11/18/2004 | DE102004022456A1 Flachdrahtüberbrückungselement Flat wire bridging element |
| 11/17/2004 | EP1478215A2 Package modification for channel-routed circuit boards |
| 11/17/2004 | EP1478174A2 Imaging apparatus |
| 11/17/2004 | EP1478023A1 Module part |
| 11/17/2004 | EP1477928A1 Antenna coil for IC card and manufacturing method thereof |
| 11/17/2004 | EP1477841A1 Liquid crystal display device and manufacturing method thereof |
| 11/17/2004 | EP1477832A1 Optical module comprising an optoelectronic component mounted in a hole of a substrate |
| 11/17/2004 | EP1477049A1 Solder interconnections for flat circuits |
| 11/17/2004 | EP1477048A1 Method for embedding a component in a base |