| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/30/2004 | US20040191934 Optically trimming electronic components |
| 09/30/2004 | US20040191695 Processing inorganic nanoparticles and a carrier to form an electroconductive pattern area that adheres to the surface of a substrate |
| 09/30/2004 | US20040191560 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 09/30/2004 | US20040191497 Wiring member and method of manufacturing the same |
| 09/30/2004 | US20040191490 Circuit board, process for producing the same and a power module employing the same |
| 09/30/2004 | US20040190835 Transmitter subassembly ground return path |
| 09/30/2004 | US20040190416 Integrating configuration of combined electronic equipment |
| 09/30/2004 | US20040190294 Method of fixing a power light-emitting diode on a radiator, and a signalling device comprising such a diode |
| 09/30/2004 | US20040190274 Compact low cost plastic MCM to PCB |
| 09/30/2004 | US20040190273 Chip carrier and method for testing electrical performance of passive component |
| 09/30/2004 | US20040190272 Control circuit board and circuit structural body |
| 09/30/2004 | US20040190269 PCB fusing trace arrangement for motor drive applications |
| 09/30/2004 | US20040190267 IC card |
| 09/30/2004 | US20040190217 Mems variable inductor and capacitor |
| 09/30/2004 | US20040189926 Liquid crystal module |
| 09/30/2004 | US20040189542 Flat antenna, antenna unit and broadcast reception terminal apparatus |
| 09/30/2004 | US20040189436 Fuse arrangement |
| 09/30/2004 | US20040189422 Increasing performance of planar inductors used in broadband applications |
| 09/30/2004 | US20040189418 Method and structure for implementing enhanced differential signal trace routing |
| 09/30/2004 | US20040189170 Low cost lighting circuits manufactured from conductive loaded resin-based materials |
| 09/30/2004 | US20040188856 [flip-chip die and flip-chip package substrate] |
| 09/30/2004 | US20040188836 Copper ring solder mask defined ball grid array pad |
| 09/30/2004 | US20040188833 Electronic component of a high frequency current suppression type and bonding wire for the same |
| 09/30/2004 | US20040188828 Heat-conducting multilayer substrate and power module substrate |
| 09/30/2004 | US20040188826 Interposer with signal and power supply through vias |
| 09/30/2004 | US20040188825 Package structure with increased capacitance and method |
| 09/30/2004 | US20040188824 Semiconductor interconnect having laser machined contacts |
| 09/30/2004 | US20040188823 Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
| 09/30/2004 | US20040188815 Circuit substrate and electronic equipment |
| 09/30/2004 | US20040188813 Integrated circuit package with reduced stress on die and associated methods |
| 09/30/2004 | US20040188593 Photosensor control unit |
| 09/30/2004 | US20040188498 Electrically conductive wire |
| 09/30/2004 | US20040188418 Low cost heating devices manufactured from conductive loaded resin-based materials |
| 09/30/2004 | US20040188263 Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil |
| 09/30/2004 | US20040188139 Wiring circuit board having bumps and method of producing same |
| 09/30/2004 | US20040188138 Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards |
| 09/30/2004 | US20040188137 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board |
| 09/30/2004 | US20040188136 Method of production of multilayer circuit board with built-in semiconductor chip |
| 09/30/2004 | US20040188135 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
| 09/30/2004 | US20040188134 manufacturing a material for components that are as thin as possible |
| 09/30/2004 | US20040188133 Tablet computing device with three-dimensional docking support |
| 09/30/2004 | US20040188132 Printed Circuit Board with Isolated Metallic Substrate Comprising an Integrated Cooling System |
| 09/30/2004 | US20040187984 of copper and molybdenum, and aluminum, gold, silver, titanium, nickel, cobalt or silicon; improved corrosion resistance |
| 09/30/2004 | US20040187303 Selective plating using dual lift-off mask |
| 09/30/2004 | US20040187297 Method of fabricating a polymer resistor in an interconnection via |
| 09/30/2004 | DE10311821A1 Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck Method and apparatus for aligning substrate and stencil stencil printing |
| 09/30/2004 | DE10310434A1 Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte Method for RF tuning an electric arrangement and appoint a suitable circuit board |
| 09/30/2004 | DE102004014380A1 Anordnung zum Verbinden zweier elektronischer Platinen durch einen ZIF- oder LIF- Verbinder, wobei ein Teilstück eine koplanare Struktur hat und ein Teilstück eine Mikrostripstruktur Arrangement for connecting two electronic circuit boards by a ZIF or LIF connector, wherein a portion has a coplanar structure, and a portion of a microstrip structure |
| 09/30/2004 | DE10125597B4 Speicherchipanordnung Memory chip arrangement |
| 09/29/2004 | EP1463391A1 Process for attaching a power LED to a heatsink and a signalling device comprising such a LED |
| 09/29/2004 | EP1463390A2 Soldering method and apparatus |
| 09/29/2004 | EP1463388A2 Circuit board, process for producing the same and a power module employing the same |
| 09/29/2004 | EP1463387A1 Multilayer printed circuit board with reduced signal losses at via holes |
| 09/29/2004 | EP1463111A2 Multilayer circuit board with semiconductor chip |
| 09/29/2004 | EP1463083A2 Fuse arrangement |
| 09/29/2004 | EP1463070A2 Mems variable inductor and capacitor |
| 09/29/2004 | EP1462907A1 A security enclosure for a circuit |
| 09/29/2004 | EP1462436A1 Halogen-containing aromatic compound |
| 09/29/2004 | EP1461985A2 Technique for accommodating electronic components on a multilayer signal routing device |
| 09/29/2004 | EP1461387A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 09/29/2004 | EP1461383A1 Thermosetting resin composition for high performance laminates |
| 09/29/2004 | EP1461370A1 Organic compositions |
| 09/29/2004 | EP1228285B1 Electronic control device for controlling electric units of motor vehicle doors which have different equipment |
| 09/29/2004 | EP1092339A4 Molded housing with integral heatsink |
| 09/29/2004 | EP1091915B1 Composite injection mouldable material |
| 09/29/2004 | EP0901696B1 Smart card computer adaptor |
| 09/29/2004 | CN2645405Y Double-faced flexible printed circuit board |
| 09/29/2004 | CN2645404Y Printed circuit board combination |
| 09/29/2004 | CN1533687A Method and apparatus for fabricating circuit board, with three dimensional surface mounted array of semiconductor chips |
| 09/29/2004 | CN1533686A Flexible printed wiring board for chip-on-film |
| 09/29/2004 | CN1533685A Method for shielding an electric circuit on printed circuit board and a corresponding combination of a printed circuit board and shield |
| 09/29/2004 | CN1533638A Hinge assembly for multi-configuration portable electronic device |
| 09/29/2004 | CN1533623A Inverted coplanar waveguide coupler with integrated microstrip connection ports |
| 09/29/2004 | CN1533396A NOvel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, compositions and laminates devived therefrom |
| 09/29/2004 | CN1533228A Electric connector and its producing method |
| 09/29/2004 | CN1533227A Medium board, base board with medium board and structure part and method for producing medium board |
| 09/29/2004 | CN1533226A Method for producing circular inclined light lighting device and flexible circuit base board |
| 09/29/2004 | CN1532931A Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment |
| 09/29/2004 | CN1532930A Semiconductor, electronic device and their producing method and electronic instrument |
| 09/29/2004 | CN1532926A Wiring part and its producing method |
| 09/29/2004 | CN1532920A High heat radiation platic package and its producing method |
| 09/29/2004 | CN1532919A Circuit device and its producing method |
| 09/29/2004 | CN1532608A 液晶显示装置 The liquid crystal display device |
| 09/29/2004 | CN1532597A Liquid crystal module |
| 09/29/2004 | CN1169259C Portable transmitter-receiver |
| 09/29/2004 | CN1169201C IC-mounted structure, liquid crystal device and electronic device |
| 09/28/2004 | US6798730 Superimposing circuit module for reducing spurious electromagnetic wave emissions and small variations in circuit parameters |
| 09/28/2004 | US6798666 Introducing loss in a power bus to reduce EMI and electrical noise |
| 09/28/2004 | US6798665 Module and method of manufacturing the module |
| 09/28/2004 | US6798640 Capacitor having plates with a pattern void of conductive material and method of making therfor |
| 09/28/2004 | US6798320 Microstrip line having a line electrode with integral edge electrodes |
| 09/28/2004 | US6798121 Module with built-in electronic elements and method of manufacture thereof |
| 09/28/2004 | US6798076 Method and apparatus for encoding information in an IC package |
| 09/28/2004 | US6798058 Semiconductor device, mounting and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 09/28/2004 | US6798056 Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package |
| 09/28/2004 | US6798052 Fexible electronic device |
| 09/28/2004 | US6798051 Connection of packaged integrated memory chips to a printed circuit board |
| 09/28/2004 | US6798050 Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same |
| 09/28/2004 | US6798048 2-Metal layer TAB tape and both-sided CSP•BGA tape |
| 09/28/2004 | US6797998 Multi-configuration GPU interface device |