Patents for H05K 1 - Printed circuits (98,583)
09/2004
09/22/2004EP1460688A2 Resin sealed electronic assembly and method of manufacturing the same
09/22/2004EP1460644A1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating
09/22/2004EP1459611A1 Housing system for an electric device
09/22/2004EP1459408A1 Grouped element transmission channel link termination assemblies
09/22/2004EP1459355A2 Stacking multiple devices using direct soldering
09/22/2004EP1459124A2 Flip-chip mounted opto-electronic circuit
09/22/2004EP1458784A1 3,4-alkylenedioxythiophene compounds and polymers thereof
09/22/2004EP1390219B1 Electric heating system for a motor vehicle
09/22/2004EP1225192B1 Polyimides and polyamic acids
09/22/2004EP1169891B1 Flexible microsystem and building techniques
09/22/2004EP1103021B1 Circuit support with control elements communicating via bus lines
09/22/2004EP1095545B1 A thermal management device and method of making such a device
09/22/2004CN1531841A High frequency printed circuit board via VIA
09/22/2004CN1531717A Metallized dielectric substrates for EAS tags
09/22/2004CN1531471A Method and device for laser beam machining of laminated material
09/22/2004CN1531388A Method for coating conductive belts onto moulded plastic articles and obtained articles thereby
09/22/2004CN1531387A Printed circuit board tenon coupling structure and manufacture thereof
09/22/2004CN1531204A Topology for providing clock signal on electric circuit module with circuit unit
09/22/2004CN1531091A Semiconductor device, electronic apparatus, carrier placode, their manufacturing methods and electronic equipment
09/22/2004CN1531070A Electronic component device and producing method thereof
09/22/2004CN1531041A Method for packing semiconductor device on printing circuit board and the printing circuit board
09/22/2004CN1531013A Sticking device and method for reinforcing plate
09/22/2004CN1530911A Circuit board assembly and disc coil
09/22/2004CN1168360C Multilayered printed wiring board
09/22/2004CN1168174C Transmission, resonator, filter, duplexer and communication equipment
09/22/2004CN1168150C Method for installing transmission or receiving module of optical chain and rigid bendable board
09/22/2004CN1168106C Multilayered electronic part with minimum silver diffusion and its manufacturing method
09/22/2004CN1167732C Resin firming agent containing phosphorus and nitrogen and fireproof resin composition contaniing said firm agent
09/22/2004CN1167547C Mat under printed circuit board, and its processing art
09/21/2004US6795885 Electronic device backplane interconnect method and apparatus
09/21/2004US6795152 Liquid crystal display apparatus and method for checking the joining accuracy thereof
09/21/2004US6795120 Solid-state imaging apparatus and camera using the same
09/21/2004US6795105 Laser printing method and apparatus
09/21/2004US6794961 High frequency circuit module
09/21/2004US6794960 Voltage tunable laminated dielectric materials for microwave waveguide applications
09/21/2004US6794956 Circuit substrate having resistive films connecting external terminals in series with lands
09/21/2004US6794952 High efficiency low pass filter
09/21/2004US6794947 Method for adjusting oscillator frequencies
09/21/2004US6794769 Current mode coupler having a unitary casing
09/21/2004US6794747 Semiconductor device
09/21/2004US6794744 Layout structure and method for supporting two different package techniques of CPU
09/21/2004US6794729 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same
09/21/2004US6794585 Printed circuit board having filled throughole with corner rounded portion and manufacturing method
09/21/2004US6794581 Method and apparatus for distributing power to integrated circuits
09/21/2004US6794580 Solder interconnections for flat circuits
09/21/2004US6794578 Quadrax to twinax conversion apparatus and method
09/21/2004US6794481 Thermosetting resin or a photocurable resin and its intermediate product each of which is suitable for use in electronics fields requiring low dielectric constant, low dielectric loss tangent and high toughness
09/21/2004US6794221 Method of placing elements into receptors in a substrate
09/21/2004US6794040 Printed circuit board or card having plated through-holes filled with a photocured polymer
09/21/2004US6793751 Method for manufacturing laminated ceramic electronic component
09/21/2004US6793541 Circuit board connector with improved terminal tails
09/21/2004US6793502 Press (non-soldered) contacts for high current electrical connections in power modules
09/21/2004US6793500 Radial contact pad footprint and wiring for electrical components
09/21/2004US6792784 Method and device for folding of ribbon cables
09/21/2004US6792679 Method of producing electrical connecting elements
09/21/2004US6792677 Method of manufacturing an electronic component unit
09/21/2004US6792667 Fully automatic process for magnetic circuit assembly
09/16/2004WO2004080140A1 Surface mounting daughter board into an aperture of mother board
09/16/2004WO2004080139A1 Method for manufacturing an electrically conductive pattern
09/16/2004WO2004080137A1 Method and system for manufacturing an electrically conductive metal foil structure
09/16/2004WO2004080136A1 Connection structure of printed wiring board
09/16/2004WO2004079864A2 Coaxial module with surge protector
09/16/2004WO2004079821A1 Packaging structure of high frequency semiconductor device, high frequency transmitter and high frequency receiver employing it
09/16/2004WO2004079797A2 High speed electronics interconnect and method of manufacture
09/16/2004WO2004079795A2 Coaxial waveguide microstructures and methods of formation thereof
09/16/2004WO2004079420A1 Optical connection device and optoelectronic hybrid apparatus including the same
09/16/2004WO2004079304A2 Liquid level sending unit with flexible sensor board
09/16/2004WO2004079053A1 Process for producing electrolytic copper foil
09/16/2004WO2004078701A1 Bis(3-amino-4-hydroxyphenyl)adamantane derivatives and process for production thereof
09/16/2004WO2004078333A1 Use of dispersions in making electronic devices
09/16/2004WO2004068812A3 Transmission line conductor arrangement
09/16/2004WO2004067615A3 Epoxy resin compositions, methods of preparing, and articles made therefrom
09/16/2004WO2004062037A3 Connector and printed circuit board for reducing cross-talk
09/16/2004WO2003038158A3 Electroplating device and electroplating system for coating already conductive structures
09/16/2004US20040181764 Conductor trace design to reduce common mode cross-talk and timing skew
09/16/2004US20040180991 obtained by use of a combustion flame, and hence a cost reduction can be achieved as compared with the case where a spherical oxide powder is obtained by use of a plasma flame
09/16/2004US20040180539 Method of forming a penetration electrode and substrate having a penetration electrode
09/16/2004US20040180471 Method of manufacturing stacked semiconductor device
09/16/2004US20040180227 suitably using as a film for a flexible printed circuit board and a metal laminate using the same; consisting of isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, and 6-amino-2-(p-aminophenyl)-benzimidazole
09/16/2004US20040180202 coated glass fiber strands provide good processability in weaving and knitting. Low fuzz and halos
09/16/2004US20040180185 Heat-resistant synthetic fiber sheet
09/16/2004US20040179373 Light-emitting diode light source unit
09/16/2004US20040179359 Light source unit
09/16/2004US20040179347 Circuit board
09/16/2004US20040179306 Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature
09/16/2004US20040179151 Display device
09/16/2004US20040178876 Circuit board assembly and flat coil
09/16/2004US20040178869 Tunable transmission line stub
09/16/2004US20040178539 System and method for bending a substantially rigid substrate
09/16/2004US20040178514 Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method
09/16/2004US20040178513 Memory card substrate with alternating contacts
09/16/2004US20040178510 Electronic parts packaging structure and method of manufacturing the same
09/16/2004US20040178508 Stacked semiconductor device
09/16/2004US20040178496 Memory expansion and chip scale stacking system and method
09/16/2004US20040178492 Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board
09/16/2004US20040178491 Method for fabricating semiconductor components by forming conductive members using solder
09/16/2004US20040178489 Multilayer circuit and method of manufacturing
09/16/2004US20040178486 Electronic component device and manufacturing method therefor
09/16/2004US20040178393 Conductive paste, method of controlling viscosity thereof and electronic component using the same
09/16/2004US20040178391 include agents that lower the minimum curing temperature of the ink compositions comprising a halogenated solvent such as tetrahydrofurfurylbromide a polymer selected from polyvinylidene chloride, polyvinyl chloride, polyethylene vinyl chloride