H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
11/2004
11/30/2004	CA2175483C Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
11/30/2004	CA2136855C Printed circuit substrates
11/25/2004	WO2004103048A2 An actuation membrane for application to a card slot of a system
11/25/2004	WO2004103045A1 Method of manufacturing flexible multilayer circuit board
11/25/2004	WO2004103038A1 Microelectronic substrates with thermally conductive pathways and methods of making same
11/25/2004	WO2004102690A2 Organic polymers, laminates, and capacitors
11/25/2004	WO2004102688A1 Electronic circuit comprising embedded piezoelectric transformer
11/25/2004	WO2004102661A1 Interconnection pattern design
11/25/2004	WO2004102659A2 Composite material, electrical circuit or electric module
11/25/2004	WO2004102652A1 Organic polymers, electronic devices, and methods
11/25/2004	WO2004102589A1 Insulating material, film, circuit board and method for manufacture thereof
11/25/2004	WO2004102469A1 Method for mounting an electronic component on a substrate
11/25/2004	WO2004101859A1 Low surface roughness electrolytic copper foil and process for producing the same
11/25/2004	WO2004101849A1 Surface treating agent for tin or tin alloy material
11/25/2004	WO2004101509A2 Functionalized benzoxazines, polymers and copolymers thereof
11/25/2004	WO2004101201A1 Fine copper powder and method for producing the same
11/25/2004	WO2004086202B1 A security housing for a circuit
11/25/2004	WO2004083142A3 Glass fibre for the reinforcement of organic and/or inorganic materials, method for production of said glass fibres and corresponding composition
11/25/2004	US20040235641 Microwave dielectric composition and method for producing the same
11/25/2004	US20040235326 Charge-controlling system
11/25/2004	US20040235318 Electrical connector housing
11/25/2004	US20040235317 Housing system for an electric device
11/25/2004	US20040235222 Integrated circuit stacking system and method
11/25/2004	US20040235221 Electronic device and method for manufacturing the same
11/25/2004	US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device
11/25/2004	US20040234741 Resin composition, prepreg, laminate, and semiconductor package
11/25/2004	US20040234686 spin coating precursor of a fluorinated polyamic acid derivative and a fluorinated diamine to a substrate, heat treating to form fluorinated polyimide film
11/25/2004	US20040234232 Open air optical channel
11/25/2004	US20040234210 Optical module and method of manufacturing the same, and hybrid integrated circuit, hybrid circuit board, electronic apparatus, opto-electricity mixed device, and method of manufacturing the same
11/25/2004	US20040233667 Method and arrangement for affixing LED on circuit board with lighting at both sides thereof
11/25/2004	US20040233663 Backlighting system for display screen
11/25/2004	US20040233651 Method and components for manufacturing multi-layer modular electrical circuits
11/25/2004	US20040233650 Multilayer wiring board, method of mounting components, and image pick-up device
11/25/2004	US20040233648 Electronic component module
11/25/2004	US20040233645 Portable data storage device
11/25/2004	US20040233644 Electronic component module
11/25/2004	US20040233642 Heat dissipation structure
11/25/2004	US20040233641 Processor/memory module with foldable substrate
11/25/2004	US20040233640 Electronic control unit
11/25/2004	US20040233611 Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards
11/25/2004	US20040233596 Electrostatic discharge protection apparatus for a circuit board
11/25/2004	US20040233581 System and method related to a flexible circuit
11/25/2004	US20040233251 Ink jet printhead chip with planar actuators
11/25/2004	US20040233133 Apparatus of driving plasma display panel
11/25/2004	US20040233112 Low cost antennas using conductive plastics or conductive composites
11/25/2004	US20040233010 Atomic layer deposition (ALD) high permeability layered magnetic films to reduce noise in high speed interconnection
11/25/2004	US20040233007 Electronic device having adjustable VCO
11/25/2004	US20040232838 Plasma display
11/25/2004	US20040232562 System and method for increasing bump pad height
11/25/2004	US20040232452 Module component
11/25/2004	US20040232312 Image generation device and method for producing such an image generation device
11/25/2004	US20040231888 High speed circuit board and method for fabrication
11/25/2004	US20040231886 PCB design and method for providing vented blind vias
11/25/2004	US20040231885 Printed wiring boards having capacitors and methods of making thereof
11/25/2004	US20040231878 Electronic circuit connecting structure, and its connecting method
11/25/2004	US20040231872 EMI shielding for electronic component packaging
11/25/2004	US20040231758 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom
11/25/2004	US20040231757 has low thermal coefficient of resistivity, may be deposited as a thin film, patterned to form discrete resistors, and embedded in printed circuit boards.
11/25/2004	US20040231594 Microdeposition apparatus
11/25/2004	US20040231593 Apparatus for microdeposition of multiple fluid materials
11/25/2004	US20040231151 Multilayer circuit board and method for manufacturing the same
11/25/2004	DE19914305B4 Elektronische Vorrichtung Electronic device
11/25/2004	DE10360967A1 Anwendungsspezifische Wärmesenkenanordnung Application Specific heat sink assembly
11/25/2004	DE10360966A1 CTE-Angepasste, Anwendungsspezifische Wärmesenkenanordnung CTE Custom, Application Specific heat sink assembly
11/25/2004	DE10332579A1 Electronic circuit board is manufactured with both external and internal conductor tracks
11/25/2004	DE10321260A1 Special purpose machine tool for electronic circuit boards has board moved under computer control relative to fixed cutting tools
11/25/2004	DE10319525A1 Strip-like arrangement comprises a strip conductor structure and electrically connected electronic components arranged on a strip conductor support which is connected to a covering part
11/25/2004	DE10315768A1 Mehrlagige Leiterplatte Multi-layer PCB
11/25/2004	DE10297544T5 Metalloxid-Dispersion Metal oxide dispersion
11/25/2004	DE102004016744A1 Mehrschichtige gedruckte Schaltungskarte und Verfahren zur Herstellung derselben A multilayer printed circuit board and method of manufacturing the same
11/25/2004	CA2523346A1 Organic polymers, laminates, and capacitors
11/24/2004	EP1480500A1 Power supply circuit with three dimensionally arranged circuit boards and method of manufacture
11/24/2004	EP1480289A1 Electronic component module
11/24/2004	EP1480269A1 Printed Circuit Board with improved cooling of electrical component
11/24/2004	EP1480264A1 Electrical circuit device
11/24/2004	EP1480236A2 Ultra low inductance multi layer ceramic capacitor
11/24/2004	EP1479729A1 Resin composition and flexible printed circuit board
11/24/2004	EP1479713A1 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
11/24/2004	EP1479710A1 Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof
11/24/2004	EP1479274A2 Laminated socket contacts
11/24/2004	EP1479060A1 Compact display assembly
11/24/2004	EP1478796A1 Fabric woven with flat glass fibers and production method
11/24/2004	EP1478607A1 Method for metallizing titanate-based ceramics
11/24/2004	EP1478551A1 Method for creating a conductor track on a carrier component and corresponding carrier component
11/24/2004	EP1325545A4 Electronic transformer/inductor devices and methods for making same
11/24/2004	EP1278806B1 Adhesive bonding laminates
11/24/2004	EP1200509B1 Composites of powdered fillers and polymer matrix and process for preparing them
11/24/2004	EP1193280B1 Polyimide resin composition with improved moisture resistance, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
11/24/2004	EP1099362B1 A device and method for mounting electronic components on printed circuit boards
11/24/2004	EP0878984B1 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
11/24/2004	EP0710430B1 Processing low dielectric constant materials for high speed electronics
11/24/2004	CN2659083Y Transformer and transformer unit with the transformer
11/24/2004	CN1550123A Component arrangement
11/24/2004	CN1549833A Three-dimensional copolymers of polyphenylene ether resins and sytrenic resins
11/24/2004	CN1549763A Grinding of liquid crystalline polymers
11/24/2004	CN1549668A Apparatus for connectnigamong mang substrates
11/24/2004	CN1549667A Testing structure and printed circuit board with the same testing structure
11/24/2004	CN1549666A Printed circuit board
11/24/2004	CN1549317A Device having resin package and method of producing the same
11/24/2004	CN1549288A Coating liquid choking apparatus for rotary switch

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