| Patents for H05K 1 - Printed circuits (98,583) |
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| 12/08/2004 | EP1484949A2 Processing low dielectric constant materials for high speed electronics |
| 12/08/2004 | EP1484948A1 Printed-circuit board, electronic part having shield structure, and radio communication apparatus |
| 12/08/2004 | EP1484773A1 Increasing performance of planar inductors used in broadband applications |
| 12/08/2004 | EP1484714A1 Conductive paste and method of forming antenna for transponder |
| 12/08/2004 | EP1484713A1 Conductive paste and method of forming an antenna for transponder |
| 12/08/2004 | EP1483948A2 Contact bank, measurement arrangement including a contact bank, telecommunications module provided with a contact bank or a measurement arrangement and telecommunications assembly including plural modules |
| 12/08/2004 | EP1483723A1 Methods and apparatus for fabricating chip-on-board modules |
| 12/08/2004 | EP1483722A1 Memory module assembly using partially defective chips |
| 12/08/2004 | EP1483320A2 Printing of organic conductive polymers containing additives |
| 12/08/2004 | EP1483315A1 Continuous filament mat binder system |
| 12/08/2004 | EP1419678B1 Thermosetting electroconductive paste for electroconductive bump use |
| 12/08/2004 | EP1266426A4 Method for forming radio frequency antenna using conductive inks |
| 12/08/2004 | EP1224847A4 Flexible circuit board and method for making a flexible circuit board |
| 12/08/2004 | CN2662596Y 电路板 Circuit board |
| 12/08/2004 | CN2662595Y Component for guiding printed circuit board to be inserted into apparatus |
| 12/08/2004 | CN2662594Y Circuit preventing electromagnetic noise signal |
| 12/08/2004 | CN1554214A An electronic assembly and a method of constructing an electronic assembly |
| 12/08/2004 | CN1554213A Pin-free socket compatible with optical-electrical interconnects |
| 12/08/2004 | CN1554137A 无线终端 The wireless terminal |
| 12/08/2004 | CN1553856A Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices |
| 12/08/2004 | CN1553855A Method for producing a ceramic substrate and ceramic substrate |
| 12/08/2004 | CN1553759A High-frequency circuit board with signal pickup pad and measuring tool thereof |
| 12/08/2004 | CN1552718A Arylamine functional silicon hydride for epoxy resin laminated board enhanced by glass fiber fabrics |
| 12/08/2004 | CN1552661A Glass ceramic composition, electronic component therewith and laminated LC composite component |
| 12/08/2004 | CN1179619C Highly heat-conductive composite magnetic material |
| 12/08/2004 | CN1179611C Composite foil of aluminium and copper |
| 12/08/2004 | CN1179609C Pressure-bonded substrate, liquid crystal device, and electronic device |
| 12/08/2004 | CN1179608C Printed circuit board and electronic equipment with said printed circuit board |
| 12/08/2004 | CN1179414C 电子电路组件 Electronic circuit assembly |
| 12/08/2004 | CN1179381C Method of manufacturing plurality of electronic components |
| 12/08/2004 | CN1179378C Monolithic inductor and its manufacturing method |
| 12/08/2004 | CN1179355C Flexible wiring base unit and wiring board |
| 12/08/2004 | CN1179348C Data processing of Bitstream signal |
| 12/08/2004 | CN1179070C Method for inspecting physical property of electro-depositing copper foil |
| 12/08/2004 | CN1179069C Dispersion-strengthened electrolytic cupper foil and method for producing the same |
| 12/08/2004 | CN1178783C Microwave dielectric material |
| 12/07/2004 | US6829749 Design support apparatus for circuit including directional coupler, design support tool, method of designing circuit, and circuit board |
| 12/07/2004 | US6829490 Folding electronic apparatus and flexible substrate thereof |
| 12/07/2004 | US6829149 Placement of sacrificial solder balls underneath the PBGA substrate |
| 12/07/2004 | US6829148 Apparatus and method for providing a ground reference potential |
| 12/07/2004 | US6829133 Capacitor |
| 12/07/2004 | US6828898 Fuel tank resistor card having improved corrosion resistance |
| 12/07/2004 | US6828819 High-speed memory system |
| 12/07/2004 | US6828670 Module component |
| 12/07/2004 | US6828669 Plurality of terminal pads located at positions corresponding to plurality of solder bumps or flip chips; semiconductors |
| 12/07/2004 | US6828668 Flexible lead structures and methods of making same |
| 12/07/2004 | US6828667 Surface mounting type electronic component |
| 12/07/2004 | US6828666 Low inductance power distribution system for an integrated circuit chip |
| 12/07/2004 | US6828665 Module device of stacked semiconductor packages and method for fabricating the same |
| 12/07/2004 | US6828656 High performance silicon contact for flip chip and a system using same |
| 12/07/2004 | US6828543 Flip chip package structure for an image sensor and an image sense module with the flip chip package structure |
| 12/07/2004 | US6828514 High speed circuit board and method for fabrication |
| 12/07/2004 | US6828513 Electrical connector pad assembly for printed circuit board |
| 12/07/2004 | US6828512 Apparatus and methods for interconnecting components to via-in-pad interconnects |
| 12/07/2004 | US6828511 Prefabricated semiconductor chip carrier |
| 12/07/2004 | US6828510 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 12/07/2004 | US6828506 Wiring structure |
| 12/07/2004 | US6828390 First polyimide is the reaction product of an aromatic dianhydride and an aromatic diamine and a silylating end group, and second polyimide is polymerized in presence of first polyimide to form a single phase system |
| 12/07/2004 | US6828224 Method of fabricating substrate utilizing an electrophoretic deposition process |
| 12/07/2004 | US6828063 Anode thin film for lithium secondary battery |
| 12/07/2004 | US6827867 Method for manufacturing printed wiring board |
| 12/07/2004 | US6827800 Process for the constrained sintering of asymmetrically configured dielectric layers |
| 12/07/2004 | US6827282 Identifying card |
| 12/02/2004 | WO2004105454A1 Wiring board manufacturing method |
| 12/02/2004 | WO2004105453A1 Through hole electrical connection structure for flexible multilayer circuit board and method for forming the same |
| 12/02/2004 | WO2004105238A2 An enclosure and substate structure for a tuner module |
| 12/02/2004 | WO2004105131A1 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 12/02/2004 | WO2004105128A1 Semiconductor package |
| 12/02/2004 | WO2004105071A1 Thermal management in electronic displays |
| 12/02/2004 | WO2004104523A1 Cover for a dew point sensor mounted on a printed circuit board |
| 12/02/2004 | WO2004104103A1 Polyimide resin composition, polymer film containing polyimide resin and laminate using the same, and method for manufacturing printed wiring board |
| 12/02/2004 | WO2004104097A1 Epoxy resin composition |
| 12/02/2004 | WO2004103931A1 Porcelain composition |
| 12/02/2004 | WO2004103103A1 System for the mechanical and electrical connection of printed circuits |
| 12/02/2004 | WO2004090701A3 Physical presence determination in a trusted platform |
| 12/02/2004 | WO2004088731A3 Methods for fabricating three-dimensional all organic interconnect structures |
| 12/02/2004 | US20040244016 Optical pickup head, optical pickup head manufacturing method, and optical pickup device |
| 12/02/2004 | US20040242403 Microwave dielectric composite composition |
| 12/02/2004 | US20040242402 Dielectric ceramic composition |
| 12/02/2004 | US20040242086 Bus bar structure plate and producing method of circuit structure body by using of the same |
| 12/02/2004 | US20040242027 Integrated circuit device and wiring board |
| 12/02/2004 | US20040241585 Method for forming image on object surface including circuit substrate |
| 12/02/2004 | US20040241465 Laminate for electronic circuit |
| 12/02/2004 | US20040241419 Comprising a highly heat resistant resin (polyimide) film having a fine porous structure with a mean pore size of 0.01-5 mu m and a porosity of 15-80%; low dielectric constant and dielectric loss |
| 12/02/2004 | US20040241395 Method of modifying a surface of a substrate and articles therefrom |
| 12/02/2004 | US20040241338 Heating a substrate coated with a curable polymer and a glass transition suppression modifier to greater than the glass transition temperature but less than the curing temperature; and heat curing the layer to form a substrate with percent planarization at 100 micrometers of greater than fifty percent. |
| 12/02/2004 | US20040240803 Use of chip-on-board technology to mount optical transmitting and detecting devices with a protective covering with multiple optical interface options |
| 12/02/2004 | US20040240800 Light-transmitting module capable of heating the light-emitting module and the substrate included therein |
| 12/02/2004 | US20040240773 Optical communication module |
| 12/02/2004 | US20040240323 Multifunctional timepiece module with application specific printed circuit boards |
| 12/02/2004 | US20040240295 Memory socket |
| 12/02/2004 | US20040240191 Electromagnetic interference shielding for a printed circuit board |
| 12/02/2004 | US20040240190 Communication card and method of making the same |
| 12/02/2004 | US20040240183 Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment |
| 12/02/2004 | US20040240146 Multilayer ceramic electronic component and mounting structure and method for the same |
| 12/02/2004 | US20040239728 Fluid ejecting actuator for multiple nozzles of a printhead |
| 12/02/2004 | US20040239578 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials |
| 12/02/2004 | US20040239474 Polymer thick film resistor, layout cell, and method |
| 12/02/2004 | US20040239469 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate |
| 12/02/2004 | US20040239438 Compact electromagnetic coupler for use with digital transmission systems |