| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/28/2004 | WO2004092265A1 Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| 10/28/2004 | WO2004092093A1 Low temperature sintering ceramic composition for high frequency, method of fabricating the same and electronic component |
| 10/28/2004 | WO2004091809A2 Kinetic spray application of coatings onto covered materials |
| 10/28/2004 | WO2004077901A3 Printed circuit board and method for fixing wired parts thereto |
| 10/28/2004 | US20040216071 Routing structure for transceiver core |
| 10/28/2004 | US20040214959 Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof |
| 10/28/2004 | US20040214497 Process for manufacturing inorganic article, inorganic article, and circuit substrate |
| 10/28/2004 | US20040214496 Material having characteristics of high thermal conductivity and electromagnetic interference resistance |
| 10/28/2004 | US20040214468 Electrical connector |
| 10/28/2004 | US20040214466 Joint connector of printed circuit board and manufacturing method thereof |
| 10/28/2004 | US20040214461 Current path on printed circuit board for electrostatic discharge protection |
| 10/28/2004 | US20040214452 Method for optically trimming electronic components |
| 10/28/2004 | US20040214418 Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component |
| 10/28/2004 | US20040214079 Integrated thin film battery and circuit module |
| 10/28/2004 | US20040214024 a polyesterether copolymer having a bifunctional polyphenylene ether as part of the structure; low dielectric constant and low moisture absorptivity |
| 10/28/2004 | US20040214016 an electroconductive metal, a glass frit of bismuth, boron, silicon, aluminum, zinc and nickel oxides, and an organic vehicle baked onto a glass substrate with a circuit pattern; a defogging glass for automobile windows |
| 10/28/2004 | US20040214006 Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards |
| 10/28/2004 | US20040214004 Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof |
| 10/28/2004 | US20040213963 Terminated conductive patterned sheet utilizing conductive conduits |
| 10/28/2004 | US20040213962 use in transmitted display devices such as liquid crystal displays; polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection, such as guide light waves |
| 10/28/2004 | US20040213957 Article comprising conductive conduit channels |
| 10/28/2004 | US20040213896 Conductive pattern forming composition, formation method of conductive pattern and production method of conductive pattern forming composition |
| 10/28/2004 | US20040213894 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance |
| 10/28/2004 | US20040213613 Image sensing apparatus including a microcontroller |
| 10/28/2004 | US20040213525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 10/28/2004 | US20040213450 Image recognition apparatus and image recognition method |
| 10/28/2004 | US20040212996 Ring lamp |
| 10/28/2004 | US20040212972 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor |
| 10/28/2004 | US20040212971 Printed circuit board |
| 10/28/2004 | US20040212969 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same |
| 10/28/2004 | US20040212965 Electronic circuit apparatus and method of manufacturing the same |
| 10/28/2004 | US20040212964 Stack up assembly |
| 10/28/2004 | US20040212961 Stack up assembly |
| 10/28/2004 | US20040212953 Thermal solution for a mezzanine card |
| 10/28/2004 | US20040212938 Current path between printed circuit boards for electrostatic discharge protection |
| 10/28/2004 | US20040212718 Placement of a camera module in a portable device |
| 10/28/2004 | US20040212634 System and method for configuring capabilities of printed circuit boards |
| 10/28/2004 | US20040212475 Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board |
| 10/28/2004 | US20040212386 Method of testing FPC bonding yield and FPC having testing pads thereon |
| 10/28/2004 | US20040212103 Techniques for pin arrangements in circuit chips |
| 10/28/2004 | US20040212092 Methods of fabricating semiconductor substrate-based BGA interconnections |
| 10/28/2004 | US20040212091 Semiconductor device substrate |
| 10/28/2004 | US20040212087 Wiring substrate and electronic parts packaging structure |
| 10/28/2004 | US20040212085 Thick film circuit board, method of producing the same and integrated circuit device |
| 10/28/2004 | US20040212084 Thick film millimeter wave transceiver module |
| 10/28/2004 | US20040212076 Multilayer substrate |
| 10/28/2004 | US20040212075 Semiconductor device including a wiring board with a three-dimensional wiring pattern |
| 10/28/2004 | US20040212063 Electronic package having a flexible substrate with ends connected to one another |
| 10/28/2004 | US20040212062 Tape stiffener and semiconductor device component assemblies including same |
| 10/28/2004 | US20040212050 Film carrier tape for mounting an electronic part, process for producing the same, and screen for solder resist coating |
| 10/28/2004 | US20040212030 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication |
| 10/28/2004 | US20040211979 Circuit board and method for manufacturing the circuit board |
| 10/28/2004 | US20040211954 Compositive laminate substrate with inorganic substrate and organic substrate |
| 10/28/2004 | US20040211653 Low cost food processing belts and other conveyances manufactured from conductive loaded resin-based materials |
| 10/28/2004 | US20040211593 Method and apparatus for implementing circuit changes on printed circuit boards after manufacture |
| 10/28/2004 | US20040211592 Wiring board and electro-optical device, method of manufacture thereof, and electronic instrument |
| 10/28/2004 | US20040211591 Wiring board, semiconductor device, electronic device, and circuit board for electronic parts |
| 10/28/2004 | US20040211590 Multilayer printed wiring board and integrated circuit using the same |
| 10/28/2004 | US20040211583 Surface-mount-type high-frequency module |
| 10/28/2004 | US20040211506 shrinkage inhibition of multilayer glass laminates, using films comprising glass, ceramic fillers, binders and solvents; dielectrics |
| 10/28/2004 | US20040211060 Method of mounting an electronic part |
| 10/28/2004 | US20040211057 Equipment and method for bonding printed circuit boards |
| 10/28/2004 | DE10392162T5 Schaltkreiskarte und Schaltkreiskartenverbindungsstruktur Circuit board and circuit board connection structure |
| 10/28/2004 | DE10317564A1 Materials with thermoplastics contacting a metal (especially cables, circuit boards or strip conductors) have a corrosion inhibitor other than a triazole derivative of salicylaldehyde in the thermoplastic |
| 10/28/2004 | DE102004011986A1 Busschienenstrukturplatte und Herstellungsverfahren eines Schaltkreisstrukturkörpers unter Verwendung hiermit Busschienenstrukturplatte and method of manufacturing a circuit structure body using hereby |
| 10/28/2004 | CA2832827A1 System and method for attenuating the effect of ambient light on an optical sensor |
| 10/28/2004 | CA2773112A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2773085A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2773076A1 Metal base circuit board and its production process |
| 10/28/2004 | CA2522694A1 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 10/28/2004 | CA2522281A1 System and method for attenuating the effect of ambient light on an optical sensor |
| 10/28/2004 | CA2458438A1 Electronic package with strengthened conductive pad |
| 10/27/2004 | EP1471614A2 TO-CAN type optical module |
| 10/27/2004 | EP1471611A2 Flat flexible plastic cable |
| 10/27/2004 | EP1471605A2 Electronic circuit unit having mounting structure with high soldering reliability |
| 10/27/2004 | EP1471604A1 Electronic component module |
| 10/27/2004 | EP1471574A2 Wiring substrate and electronic parts packaging structure |
| 10/27/2004 | EP1471573A1 Multi-layer ceramic substrate, and method and device for producing the same |
| 10/27/2004 | EP1471570A1 Method of mounting an electronic part on a mounting board |
| 10/27/2004 | EP1471103A1 Process for producing porous polyimide resin and porous polyimide resin |
| 10/27/2004 | EP1471090A1 Polyester, its film and laminate |
| 10/27/2004 | EP1471041A1 Multilayer ceramic composition |
| 10/27/2004 | EP1470964A2 Electrical connector housing |
| 10/27/2004 | EP1470745A1 Housing for electronic home entertainment devices |
| 10/27/2004 | EP1470744A2 High speed differential signal edge card connector circuit board layouts |
| 10/27/2004 | EP1470743A2 Power module |
| 10/27/2004 | EP1470586A2 Power semiconductor, and method for producing the same |
| 10/27/2004 | EP1470581A2 High density area array solder microjoining interconnect structure and fabrication method |
| 10/27/2004 | EP1470528A2 Method for manufacturing rfid labels |
| 10/27/2004 | EP1412445A4 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/27/2004 | EP1093705A4 Cross-midplane switch topology |
| 10/27/2004 | EP1010035B1 Novel addressing schemes for electrophoretic displays |
| 10/27/2004 | EP0997497B1 Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| 10/27/2004 | EP0886991B1 Conducting foil for conductively connecting electric and/or electronic components |
| 10/27/2004 | EP0845445B1 Photosensitive ceramic green sheet, ceramic package,process for producing the same and its use in preparing a ceramic package with a fired board |
| 10/27/2004 | CN2651782Y 照相机 Camera |
| 10/27/2004 | CN1541437A Electrostatic discharge appts. for network devices |
| 10/27/2004 | CN1541414A Electronic assembly with llaterally connected capacitors and mfg. method |
| 10/27/2004 | CN1541054A Electronic assembly and its mfg. method |
| 10/27/2004 | CN1541053A Encapsulation structure of distribution substrate and electronic element |