Patents for H05K 1 - Printed circuits (98,583)
11/2004
11/04/2004US20040217405 Low cost capacitors manufactured from conductive loaded resin-based materials
11/04/2004US20040217093 Method and apparatus for laser drilling
11/04/2004US20040216919 Method and structure for repairing or modifying surface connections on circuit boards
11/04/2004US20040216918 Two-layer electrical substrate for optical devices
11/04/2004US20040216917 Method for improved high current component interconnections
11/04/2004US20040216916 Technique for improving power and ground flooding
11/04/2004US20040216864 CTE matched application specific heat sink assembly
11/04/2004DE19747609B4 Dünnfilmmehrschichtsubstrat und daraus hergestellte elektronische Vorrichtung Thin-film multilayer substrate and derived electronic device
11/04/2004DE10322017B3 Dew point sensor unit has temperature and humidity sensors with underside sealed by circuit board fitting against cover
11/04/2004DE10315417A1 A light plate with illumination elements, especially light emitting diodes, electrically connected by conduction strips where the light plate is made from a transparent thermoplastic material useful for illumination of shop windows
11/04/2004CA2522849A1 Substrate with multiple conductive layers and methods for making and using same
11/04/2004CA2521079A1 Method of producing membrane electrode assemblies
11/03/2004EP1473979A1 High-frequency layered part and manufacturing method thereof
11/03/2004EP1473978A1 Lamp on sheet and manufacturing method thereof
11/03/2004EP1473977A2 Electronic package with strengthened conductive pad
11/03/2004EP1473846A2 Multiband high-frequency switching modul
11/03/2004EP1473744A2 Low profile inductive component
11/03/2004EP1473743A2 Transformers or inductors ("transductors") and antennas manufactured from conductive loaded resin-based materials
11/03/2004EP1473329A1 Resin composition
11/03/2004EP1473328A1 Resin composition
11/03/2004EP1473318A1 Biaxially oriented thermoplastic resin film
11/03/2004EP1472916A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
11/03/2004EP1472915A2 Circuit carrier and production thereof
11/03/2004EP1472914A2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
11/03/2004EP1472078A1 Thermal barriers with reversible enhanced thermal properties
11/03/2004EP1353540B1 Manufacturing method of circuit board module
11/03/2004CN2653842Y Printed board
11/03/2004CN2653840Y 信号传输结构 Signal transmission structure
11/03/2004CN1543756A Wired transmission path
11/03/2004CN1543701A Switching power supply unit
11/03/2004CN1543697A Electromagnetic emission reduction technique for shielded connectors
11/03/2004CN1543675A Microelectronic package having a bumpless laminated interconnection layer
11/03/2004CN1543486A Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/03/2004CN1543298A Multilayer ceramic device
11/03/2004CN1543297A Wiring plate and circuit module
11/03/2004CN1543296A 印制电路板 Printed circuit board
11/03/2004CN1543292A Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
11/03/2004CN1543291A Electronic component built-in module and method of manufacturing the same
11/03/2004CN1542953A CTE matched application specific heat sink assembly
11/03/2004CN1542949A Package substrate
11/03/2004CN1542935A Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
11/03/2004CN1542867A 导电膏和玻璃电路结构 Conductive paste and glass circuit structure
11/03/2004CN1542509A Audio signal processing circuit and a display device incorporating the same
11/03/2004CN1542072A Bonding layer for bonding resin on copper surface
11/03/2004CN1174665C Multilayer flexible wiring board
11/03/2004CN1174663C Mounting structure for temp.-sensitive fuse on circuit board
11/03/2004CN1174524C Flexible circuit board connecting structure
11/03/2004CN1174489C Distribution base, its mfg. method, displaying device and electronic device
11/03/2004CN1174482C Modular assembly and electronic component
11/03/2004CN1174475C Method for making RF module element with sound wave surface wave unit
11/03/2004CN1174447C Method for mounting circuit support of stacked ceramic capacitor and circuit support
11/03/2004CN1174279C Wiring base plate, display device, semiconductor chip and electronic machine
11/03/2004CN1174046C Fire resistance resin compositions, presoaking material and laminated products using same
11/02/2004US6813749 Method, system and computer program product for multidisciplinary design analysis of structural components
11/02/2004US6813511 Low-noise optical probes for reducing ambient noise
11/02/2004US6813164 Low height USB interface connecting device and a memory storage apparatus thereof
11/02/2004US6813163 Converter device
11/02/2004US6813138 Embedded microelectronic capacitor equipped with geometrically-centered electrodes and method of fabrication
11/02/2004US6812805 Differential transmission line for high bandwidth signals
11/02/2004US6812803 Passive transmission line equalization using circuit-board thru-holes
11/02/2004US6812576 Fanned out interconnect via structure for electronic package substrates
11/02/2004US6812571 Low capacitance wiring layout and method for making same
11/02/2004US6812561 Thin high-frequency module having integrated circuit chip with little breakage
11/02/2004US6812555 Memory card substrate with alternating contacts
11/02/2004US6812549 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
11/02/2004US6812412 Multi-layer wiring board and method of producing same
11/02/2004US6812411 Printed circuit board configuration with a multipole plug-in connector
11/02/2004US6812410 Semiconductor module and method of manufacturing the same
11/02/2004US6812409 Layer allocating apparatus for multi-layer circuit board
11/02/2004US6812311 Highly stable packaging substrates
11/02/2004US6812276 Curable mixture of a functionalized poly(arylene ether) such as methacrylate-endcapped poly(2,6-dimethylphenyl ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer; good stiffness, toughness, and heat resistance
11/02/2004US6812178 For use in electronic materials, precision machine component parts, structural materials
11/02/2004US6812137 Method of forming coaxial integrated circuitry interconnect lines
11/02/2004US6812060 Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
11/02/2004US6811635 Multilayer ceramic substrate, method for manufacturing the same, and electronic device
11/02/2004US6811634 Shrinkage inhibition, dimemsional accuracy
11/02/2004US6811410 Integrated circuit socket with capacitors and shunts
11/02/2004US6811409 Connecting device for flexible electrical connection of circuit boards
11/02/2004US6810583 Coupling of conductive vias to complex power-signal substructures
11/02/2004US6810580 System for forming conductor wire on a substrate board
11/02/2004US6810579 Method for manufacturing membranes
10/2004
10/30/2004CA2427303A1 Method for flexibilizing glass fiber nonwoven bound with cured ureaformaldehyde resin
10/28/2004WO2004093507A1 Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device
10/28/2004WO2004093506A2 Electomagnetic interference shielding for a printed circuit board
10/28/2004WO2004093505A2 Emi shielding for electronic component packaging
10/28/2004WO2004093504A2 Printed circuit device with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna
10/28/2004WO2004093503A2 Circuitry for measuring mechanical stress impressed on a printed circuit board
10/28/2004WO2004093498A1 High frequency heating apparatus
10/28/2004WO2004093354A1 Reconfigurable optoelectronic circuit
10/28/2004WO2004093250A1 Radiating slit antenna system
10/28/2004WO2004093221A2 Electrochemical cells
10/28/2004WO2004093186A1 Metal-base circuit board and its manufacturing method
10/28/2004WO2004093145A2 Voltage tunable photodefinable dielectric and method of manufacture therefore
10/28/2004WO2004093113A1 Electromagnetic relay
10/28/2004WO2004093105A1 Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portions
10/28/2004WO2004093100A2 Method for producing soldering globules on an electrical component
10/28/2004WO2004093098A1 Materials containing thermoplastic
10/28/2004WO2004092713A2 System and method for attenuating the effect of ambient light on an optical sensor
10/28/2004WO2004092452A1 Two-layer flexible copper-clad laminate and method for manufacturing the two-layer flexible copper-clad laminate
10/28/2004WO2004092268A1 Resin composition for molding and application and noise reducing material using the same